GB1210321A - Laminated circuit components and method of manufacture thereof - Google Patents

Laminated circuit components and method of manufacture thereof

Info

Publication number
GB1210321A
GB1210321A GB233868A GB233868A GB1210321A GB 1210321 A GB1210321 A GB 1210321A GB 233868 A GB233868 A GB 233868A GB 233868 A GB233868 A GB 233868A GB 1210321 A GB1210321 A GB 1210321A
Authority
GB
United Kingdom
Prior art keywords
plate
trough
plates
connection
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB233868A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bunker Ramo Corp
Original Assignee
Bunker Ramo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo Corp filed Critical Bunker Ramo Corp
Publication of GB1210321A publication Critical patent/GB1210321A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguides (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

1,210,321. Making laminar circuit components. BUNKER-RAMO CORP. 16 Jan., 1968 [2 Feb., 1967], No. 2338/68. Heading B3A. [Also in Division H1] A laminar circuit component is made by forming in a conductive plate 87, Fig. 11e, a trough with an island 90 positioned therein and spaced from the side edges thereof, which trough is thereafter filled with a dielectric material. After forming the trough by photo- or electrochemical etching and filling it with dielectric, a conductive layer is electrodeposited on the upper surface of plate 87 and is partially removed by etching to form a centre conductor 96. A plate 74, Fig. 10, laminated by conductive epoxy, electron beam or pressure welding to further plates 75, 61, 60, has this type of connection 70, 69 coupled to a connection 64 of a device 62. Through conductors 72, 73, 73<SP>1</SP> respectively in plates 74, 75, 61 connect a connection 67 of the device 62 with conductors 76 and 77 in the plates. A through conductor of this type is formed by etching out a further trough on the opposite side of the plate 87, Fig. 11f, to electri ally isolate the island 90 from the plate 87. Dielectric material 101 is deposited in the trough and the plate 87 laminated to further plates facilitated by depositing conductive bonding material at 97-99 and 102-104. The plates may be aluminium copper, magnesium, steel, plastics or a doped semi-conductor. It is stated that the prior art method of making a through connection (7), (Fig. 2, not shown), comprises drilling a hole in the dielectric material (5) in the plate (1b) followed by metal plating of the hole walls. External connectors (3) are then positioned in the holes.
GB233868A 1967-02-02 1968-01-16 Laminated circuit components and method of manufacture thereof Expired GB1210321A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61365267A 1967-02-02 1967-02-02

Publications (1)

Publication Number Publication Date
GB1210321A true GB1210321A (en) 1970-10-28

Family

ID=24458155

Family Applications (1)

Application Number Title Priority Date Filing Date
GB233868A Expired GB1210321A (en) 1967-02-02 1968-01-16 Laminated circuit components and method of manufacture thereof

Country Status (5)

Country Link
JP (1) JPS4540835B1 (en)
DE (1) DE1616235B1 (en)
FR (1) FR1553381A (en)
GB (1) GB1210321A (en)
NL (1) NL163702C (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2177851A (en) * 1985-06-05 1987-01-28 Spence Bate Laminated low power circuitry components
US7405363B2 (en) 2003-09-30 2008-07-29 J.S.T. Mfg. Co., Ltd. Connecting sheet

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704455A (en) * 1971-02-01 1972-11-28 Alfred D Scarbrough 3d-coaxial memory construction and method of making

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1100734B (en) * 1959-09-01 1961-03-02 Siemens Ag Contact piece in a sheet of insulating material provided with flat cable connections
DE1127970B (en) * 1959-12-08 1962-04-19 Licentia Gmbh Process for producing conductive connections between two conductor strips of a circuit board printed on both sides
US2990310A (en) * 1960-05-11 1961-06-27 Burroughs Corp Laminated printed circuit board
US3335489A (en) * 1962-09-24 1967-08-15 North American Aviation Inc Interconnecting circuits with a gallium and indium eutectic
FR1407843A (en) * 1964-06-26 1965-08-06 Electronique & Automatisme Sa Improvements made to the realization of so-called hybrid circuits

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2177851A (en) * 1985-06-05 1987-01-28 Spence Bate Laminated low power circuitry components
US7405363B2 (en) 2003-09-30 2008-07-29 J.S.T. Mfg. Co., Ltd. Connecting sheet

Also Published As

Publication number Publication date
NL163702B (en) 1980-04-15
FR1553381A (en) 1969-01-10
DE1616235B1 (en) 1971-05-06
JPS4540835B1 (en) 1970-12-22
NL163702C (en) 1980-09-15
NL6801269A (en) 1968-08-05

Similar Documents

Publication Publication Date Title
US4247883A (en) Encapsulated capacitor
KR101546572B1 (en) Semiconductor device package and method for manufacturing the same
GB1337652A (en) Electrical circuit packaging structure and method of fabrication thereof
IE39666L (en) Circuit board
US3541225A (en) Electrical conductor with improved solder characteristics
GB1212626A (en) Electrical interconnection means and method of fabrication thereof
US3558993A (en) Electrical component assemblies with improved printed circuit construction
GB1282371A (en) Coaxial circuit construction and method of making
KR20180002025A (en) Semiconductor package and method for producing same
US3568312A (en) Method of making printed circuit boards
IE34944B1 (en) Semiconductor device with solder bond and process for its fabrication
CN108882567A (en) A kind of production method of PCB
GB1210321A (en) Laminated circuit components and method of manufacture thereof
GB1152809A (en) Electric Circuit Assembly
CN103225094A (en) Single-sided current protection method for blind hole plate electroplating
US3158926A (en) Method of making an electrical terminal board
GB1126370A (en) Improvements relating to printed circuits
US3646404A (en) Solid-state electrolytic capacitor and method of making same
US3848077A (en) Package for electronic semiconductor devices
US3626081A (en) Sandwich-type voltage and ground plane
JPS6448423A (en) Dividing method of semiconductor chip
CN112349603A (en) Manufacturing method of power device, power device and electronic equipment
GB1084598A (en) A method of making passivated semiconductor devices
GB1042234A (en) Multilayer printed circuits
GB1145771A (en) Electrical circuit boards

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee