GB1210321A - Laminated circuit components and method of manufacture thereof - Google Patents
Laminated circuit components and method of manufacture thereofInfo
- Publication number
- GB1210321A GB1210321A GB233868A GB233868A GB1210321A GB 1210321 A GB1210321 A GB 1210321A GB 233868 A GB233868 A GB 233868A GB 233868 A GB233868 A GB 233868A GB 1210321 A GB1210321 A GB 1210321A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plate
- trough
- plates
- connection
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Waveguides (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
1,210,321. Making laminar circuit components. BUNKER-RAMO CORP. 16 Jan., 1968 [2 Feb., 1967], No. 2338/68. Heading B3A. [Also in Division H1] A laminar circuit component is made by forming in a conductive plate 87, Fig. 11e, a trough with an island 90 positioned therein and spaced from the side edges thereof, which trough is thereafter filled with a dielectric material. After forming the trough by photo- or electrochemical etching and filling it with dielectric, a conductive layer is electrodeposited on the upper surface of plate 87 and is partially removed by etching to form a centre conductor 96. A plate 74, Fig. 10, laminated by conductive epoxy, electron beam or pressure welding to further plates 75, 61, 60, has this type of connection 70, 69 coupled to a connection 64 of a device 62. Through conductors 72, 73, 73<SP>1</SP> respectively in plates 74, 75, 61 connect a connection 67 of the device 62 with conductors 76 and 77 in the plates. A through conductor of this type is formed by etching out a further trough on the opposite side of the plate 87, Fig. 11f, to electri ally isolate the island 90 from the plate 87. Dielectric material 101 is deposited in the trough and the plate 87 laminated to further plates facilitated by depositing conductive bonding material at 97-99 and 102-104. The plates may be aluminium copper, magnesium, steel, plastics or a doped semi-conductor. It is stated that the prior art method of making a through connection (7), (Fig. 2, not shown), comprises drilling a hole in the dielectric material (5) in the plate (1b) followed by metal plating of the hole walls. External connectors (3) are then positioned in the holes.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US61365267A | 1967-02-02 | 1967-02-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1210321A true GB1210321A (en) | 1970-10-28 |
Family
ID=24458155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB233868A Expired GB1210321A (en) | 1967-02-02 | 1968-01-16 | Laminated circuit components and method of manufacture thereof |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS4540835B1 (en) |
DE (1) | DE1616235B1 (en) |
FR (1) | FR1553381A (en) |
GB (1) | GB1210321A (en) |
NL (1) | NL163702C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2177851A (en) * | 1985-06-05 | 1987-01-28 | Spence Bate | Laminated low power circuitry components |
US7405363B2 (en) | 2003-09-30 | 2008-07-29 | J.S.T. Mfg. Co., Ltd. | Connecting sheet |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3704455A (en) * | 1971-02-01 | 1972-11-28 | Alfred D Scarbrough | 3d-coaxial memory construction and method of making |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1100734B (en) * | 1959-09-01 | 1961-03-02 | Siemens Ag | Contact piece in a sheet of insulating material provided with flat cable connections |
DE1127970B (en) * | 1959-12-08 | 1962-04-19 | Licentia Gmbh | Process for producing conductive connections between two conductor strips of a circuit board printed on both sides |
US2990310A (en) * | 1960-05-11 | 1961-06-27 | Burroughs Corp | Laminated printed circuit board |
US3335489A (en) * | 1962-09-24 | 1967-08-15 | North American Aviation Inc | Interconnecting circuits with a gallium and indium eutectic |
FR1407843A (en) * | 1964-06-26 | 1965-08-06 | Electronique & Automatisme Sa | Improvements made to the realization of so-called hybrid circuits |
-
1968
- 1968-01-16 GB GB233868A patent/GB1210321A/en not_active Expired
- 1968-01-29 NL NL6801269A patent/NL163702C/en not_active IP Right Cessation
- 1968-01-31 DE DE1968B0096449 patent/DE1616235B1/en not_active Withdrawn
- 1968-02-02 JP JP606968A patent/JPS4540835B1/ja active Pending
- 1968-02-02 FR FR1553381D patent/FR1553381A/fr not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2177851A (en) * | 1985-06-05 | 1987-01-28 | Spence Bate | Laminated low power circuitry components |
US7405363B2 (en) | 2003-09-30 | 2008-07-29 | J.S.T. Mfg. Co., Ltd. | Connecting sheet |
Also Published As
Publication number | Publication date |
---|---|
NL163702B (en) | 1980-04-15 |
FR1553381A (en) | 1969-01-10 |
DE1616235B1 (en) | 1971-05-06 |
JPS4540835B1 (en) | 1970-12-22 |
NL163702C (en) | 1980-09-15 |
NL6801269A (en) | 1968-08-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |