RU2018140415A3 - - Google Patents
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- Publication number
- RU2018140415A3 RU2018140415A3 RU2018140415A RU2018140415A RU2018140415A3 RU 2018140415 A3 RU2018140415 A3 RU 2018140415A3 RU 2018140415 A RU2018140415 A RU 2018140415A RU 2018140415 A RU2018140415 A RU 2018140415A RU 2018140415 A3 RU2018140415 A3 RU 2018140415A3
- Authority
- RU
- Russia
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
- C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/01—Hydrocarbons
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/375—Thiols containing six-membered aromatic rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16170330.1 | 2016-05-19 | ||
| EP16170330 | 2016-05-19 | ||
| PCT/EP2017/062112 WO2017198820A1 (en) | 2016-05-19 | 2017-05-19 | Adhesives for assembling components of inert material |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| RU2018140415A RU2018140415A (ru) | 2020-06-19 |
| RU2018140415A3 true RU2018140415A3 (ru) | 2020-08-18 |
| RU2744431C2 RU2744431C2 (ru) | 2021-03-09 |
Family
ID=56098006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2018140415A RU2744431C2 (ru) | 2016-05-19 | 2017-05-19 | Адгезивы для сборки компонентов инертного материала |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11111417B2 (ru) |
| EP (1) | EP3458538B1 (ru) |
| JP (1) | JP6947188B2 (ru) |
| KR (1) | KR102346575B1 (ru) |
| CN (1) | CN109153900B (ru) |
| CA (1) | CA3022348C (ru) |
| RU (1) | RU2744431C2 (ru) |
| WO (1) | WO2017198820A1 (ru) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI789529B (zh) | 2018-07-30 | 2023-01-11 | 瑞士商西克帕控股有限公司 | 多晶片模組(mcm)組件 |
| TWI814839B (zh) | 2018-07-30 | 2023-09-11 | 瑞士商西克帕控股有限公司 | 多晶片模組(mcm)組合件和列印條 |
| CN111849394B (zh) * | 2019-04-29 | 2021-12-28 | 常州强力电子新材料股份有限公司 | 光固化粘接剂组合物、光固化粘接剂、偏光板及光学设备 |
| WO2021117486A1 (ja) | 2019-12-12 | 2021-06-17 | ダイキン工業株式会社 | 組成物、硬化性組成物、及び、硬化物 |
| CN115368550B (zh) * | 2021-05-20 | 2024-01-26 | 常州强力先端电子材料有限公司 | 一种氧杂环丁烷类含氟聚合物及其制备方法 |
| CN117264469A (zh) * | 2023-11-23 | 2023-12-22 | 苏州凡赛特材料科技有限公司 | 一种用于喷墨打印的延迟固化uv胶黏剂 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2016037C1 (ru) * | 1991-02-06 | 1994-07-15 | Государственное предприятие - Научно-производственное объединение "Орион" | СПОСОБ СКЛЕИВАНИЯ ПЛАСТИНЫ CdxHg1-xTe С САПФИРОВОЙ ПОДЛОЖКОЙ |
| JP2001089639A (ja) * | 1999-09-24 | 2001-04-03 | Mitsubishi Heavy Ind Ltd | エネルギー線硬化樹脂組成物 |
| US6610759B1 (en) * | 2000-03-06 | 2003-08-26 | Curators Of The University Of Missouri | Cationically polymerizable adhesive composition containing an acidic component and methods and materials employing same |
| JP2003152248A (ja) * | 2001-11-09 | 2003-05-23 | Fuji Photo Film Co Ltd | 光デバイス |
| GB0212062D0 (en) * | 2002-05-24 | 2002-07-03 | Vantico Ag | Jetable compositions |
| JP4377188B2 (ja) * | 2003-09-29 | 2009-12-02 | 富士フイルム株式会社 | 重合性樹脂組成物、インクジェット記録ヘッド及びその製造方法 |
| US20060292377A1 (en) * | 2005-06-28 | 2006-12-28 | Seagate Tecnology Llc | Adhesive attachment of a first member to a second member |
| EP2041217A2 (en) * | 2006-07-17 | 2009-04-01 | Ciba Holding Inc. | Method of bonding |
| WO2008146685A1 (ja) * | 2007-05-23 | 2008-12-04 | Showa Denko K.K. | エーテル結合を有する反応性ウレタン化合物、硬化性組成物および硬化物 |
| JP2010163566A (ja) * | 2009-01-16 | 2010-07-29 | Three M Innovative Properties Co | エポキシ樹脂組成物 |
| WO2011001911A1 (ja) * | 2009-07-01 | 2011-01-06 | 協立化学産業株式会社 | 速硬化性に優れたエネルギー線硬化型エポキシ樹脂組成物 |
| JP5684275B2 (ja) * | 2010-09-24 | 2015-03-11 | 電気化学工業株式会社 | エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体 |
| EP2753662B1 (en) * | 2011-09-07 | 2020-06-24 | MicroChem Corp. | Epoxy formulations and processes for fabrication of relief patterns on low surface energy substrates |
| CN105441001A (zh) * | 2015-12-24 | 2016-03-30 | 深圳市浩力新材料技术有限公司 | 一种高性能光通讯器件用接着剂及其制备方法 |
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2017
- 2017-05-19 CA CA3022348A patent/CA3022348C/en active Active
- 2017-05-19 KR KR1020187035767A patent/KR102346575B1/ko active IP Right Grant
- 2017-05-19 RU RU2018140415A patent/RU2744431C2/ru active
- 2017-05-19 WO PCT/EP2017/062112 patent/WO2017198820A1/en active Search and Examination
- 2017-05-19 JP JP2018556288A patent/JP6947188B2/ja active Active
- 2017-05-19 US US16/303,048 patent/US11111417B2/en active Active
- 2017-05-19 CN CN201780030689.4A patent/CN109153900B/zh active Active
- 2017-05-19 EP EP17730382.3A patent/EP3458538B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CA3022348C (en) | 2024-02-20 |
| EP3458538A1 (en) | 2019-03-27 |
| US11111417B2 (en) | 2021-09-07 |
| KR20190010588A (ko) | 2019-01-30 |
| EP3458538B1 (en) | 2020-10-28 |
| JP6947188B2 (ja) | 2021-10-13 |
| US20190300753A1 (en) | 2019-10-03 |
| JP2019522685A (ja) | 2019-08-15 |
| RU2744431C2 (ru) | 2021-03-09 |
| RU2018140415A (ru) | 2020-06-19 |
| CN109153900A (zh) | 2019-01-04 |
| WO2017198820A1 (en) | 2017-11-23 |
| KR102346575B1 (ko) | 2022-01-04 |
| CN109153900B (zh) | 2021-12-03 |
| CA3022348A1 (en) | 2017-11-23 |