RU2014110523A - Модуль rfid-чипа - Google Patents

Модуль rfid-чипа Download PDF

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RU2014110523A
RU2014110523A RU2014110523/02A RU2014110523A RU2014110523A RU 2014110523 A RU2014110523 A RU 2014110523A RU 2014110523/02 A RU2014110523/02 A RU 2014110523/02A RU 2014110523 A RU2014110523 A RU 2014110523A RU 2014110523 A RU2014110523 A RU 2014110523A
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metallization
chip module
main surface
holder
chip
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RU2014110523/02A
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RU2581941C2 (ru
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Стефан БЮЛЕР
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Текстильма АГ
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
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    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
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    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
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    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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Abstract

1. Модуль чипа (10; 20; 30), включающий:держатель (1), имеющий первую основную поверхность (1а) и вторую основную поверхность (1b), противоположную первой основной поверхности (1а);первую структуру выемки (4), расположенную в держателе (1) на первой основной поверхности (1а);чип (5), расположенный в первой структуре выемки (4) держателя (1); ифигурный слой металлизации (2), нанесенный на вторую основную поверхность держателя (1), причем слой металлизации (2) имеет первую структуру металлизации (2а) и вторую структуру металлизации (2b), и причем первая структура металлизации (2а) электрически изолирована от второй структуры металлизации (2b), и причем чип (5) электрически соединен с первой структурой металлизации (2а) и второй структурой металлизации (2b).2. Модуль чипа (10; 20; 30) по п. 1, отличающийся тем, что держатель (1) включает материал, который прозрачен для видимого, ультрафиолетового и/или инфракрасного света.3. Модуль чипа (10; 20; 30) по п. 1, кроме того включающий:вторую структуру выемки (ба), расположенную в держателе (1) на первой основной поверхности (1а) противоположно первой структуре металлизации (2а), и третью структуру выемки (6b), расположенную в держателе (1) на первой основной поверхности (1а) противоположно второй структуре металлизации (2b).4. Модуль чипа (10; 20; 30) по п. 3, отличающийся тем, что вторая и третья структуры выемок (6) являются переходными отверстиями, которые проходят от первой основной поверхности (1а) до второй основной поверхности (1b) через держатель (1).5. Модуль чипа (10; 20; 30) по п. 4, отличающийся тем, что переходные отверстия (6) проходят через первую и вторую структуры металлизации (2а, 2b).6. Модуль чипа (10; 20; 30) по п. 1, отличающийся тем, что пе

Claims (15)

1. Модуль чипа (10; 20; 30), включающий:
держатель (1), имеющий первую основную поверхность (1а) и вторую основную поверхность (1b), противоположную первой основной поверхности (1а);
первую структуру выемки (4), расположенную в держателе (1) на первой основной поверхности (1а);
чип (5), расположенный в первой структуре выемки (4) держателя (1); и
фигурный слой металлизации (2), нанесенный на вторую основную поверхность держателя (1), причем слой металлизации (2) имеет первую структуру металлизации (2а) и вторую структуру металлизации (2b), и причем первая структура металлизации (2а) электрически изолирована от второй структуры металлизации (2b), и причем чип (5) электрически соединен с первой структурой металлизации (2а) и второй структурой металлизации (2b).
2. Модуль чипа (10; 20; 30) по п. 1, отличающийся тем, что держатель (1) включает материал, который прозрачен для видимого, ультрафиолетового и/или инфракрасного света.
3. Модуль чипа (10; 20; 30) по п. 1, кроме того включающий:
вторую структуру выемки (ба), расположенную в держателе (1) на первой основной поверхности (1а) противоположно первой структуре металлизации (2а), и третью структуру выемки (6b), расположенную в держателе (1) на первой основной поверхности (1а) противоположно второй структуре металлизации (2b).
4. Модуль чипа (10; 20; 30) по п. 3, отличающийся тем, что вторая и третья структуры выемок (6) являются переходными отверстиями, которые проходят от первой основной поверхности (1а) до второй основной поверхности (1b) через держатель (1).
5. Модуль чипа (10; 20; 30) по п. 4, отличающийся тем, что переходные отверстия (6) проходят через первую и вторую структуры металлизации (2а, 2b).
6. Модуль чипа (10; 20; 30) по п. 1, отличающийся тем, что первая и вторая структуры металлизации (2а, 2b) образованы каждая непрерывным элементом металлизации, проходящим за краевые части модуля чипа (10) на вторую основную поверхность (1b) и с участком металлизации, проходящим от непрерывного элемента металлизации к центральной части модуля чипа (10).
7. Модуль чипа (10; 20; 30) по п. 1, кроме того включающий:
слой фоторезиста, расположенный между слоем металлизации (2) и держателем (1).
8. Модуль чипа (10; 20; 30) по п. 1, отличающийся тем, что чип (5) в структуре выемки (4) отлит из формовочного материала.
9. Модуль чипа {10; 20; 30) по п. 1, отличающийся тем, что чип (5) является RFID-чипом.
10. Модуль чипа (10; 20; 30) по п. 1, кроме того включающий:
первый выступ припоя (3), расположенный на первой структуре металлизации (2а), и второй выступ припоя (3), расположенный на второй структуре металлизации (2b).
11. Способ (50) соединения модуля чипа (10; 20; 30) с основой, причем модуль чипа (10; 20; 30) включает держатель (1), имеющий первую основную поверхность (1а) и вторую основную поверхность (1b), противоположную первой основной поверхности (1а), и фигурный слой металлизации (2) нанесенный на вторую основную поверхность держателя (1), и причем слой металлизации (2) имеет первую структуру металлизации (2а) с первым выступом припоя (3а), прикрепленным к ней, и вторую структуру металлизации (2b) с вторым выступом припоя (3b), прикрепленным к ней, и причем способ включает:
помещение (51) модуля чипа (10; 20; 30) на основу (47; 61), причем вторая основная поверхность (1b) модуля чипа (10; 20; 30) обращена к основе (47; 61);
выравнивание (52) первого выступа припоя (3а) и второго выступа припоя (3b) модуля чипа (10; 20; 30) с соответствующими первой и второй структурами металлизации (62) на основе (47; 61);
облучение (53) модуля чипа (10; 20; 30) лазерными лучами (L), причем лазерные лучи (L) падают на первую основную поверхность (1а) под прямым углом падения; и
оплавление (54) первого и второго выступов припоя (3а, 3b) лазерными лучами (L), этим формируя паяное соединение между первым и вторым выступами припоя (3а, 3b) и соответствующими первой и второй структурами металлизации (62) на основе (47; 61).
12. Способ (50) по п. 11, кроме того включающий:
нанесение модуля чипа (10; 20; 30) с ленты, причем лента включает некоторое число модулей чипов (10; 20; 30).
13. Способ (50) по п. 11, отличающийся тем, что модуль чипа (10; 20; 30) включает RFID-чип (5) и отличающийся тем, что первая и вторая структуры металлизации (62) основы (47; 61) формируют структуру RFID-антенны.
14. RFID-метка (60), включающая:
модуль чипа (10; 20; 30) по п. 9; и
основу (61), имеющую структуру RFID-антенны (62), причем модуль чипа (10; 20; 30) припаян к структуре RFID-антенны (62).
15. RFID-метка (60) по п. 14, отличающаяся тем, что основа (61) является текстильной основой.
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