PT3232468T - Estrutura de dissipação de calor de um dispositivo semicondutor - Google Patents

Estrutura de dissipação de calor de um dispositivo semicondutor

Info

Publication number
PT3232468T
PT3232468T PT171519721T PT17151972T PT3232468T PT 3232468 T PT3232468 T PT 3232468T PT 171519721 T PT171519721 T PT 171519721T PT 17151972 T PT17151972 T PT 17151972T PT 3232468 T PT3232468 T PT 3232468T
Authority
PT
Portugal
Prior art keywords
semiconductor device
heat dissipation
dissipation structure
heat
semiconductor
Prior art date
Application number
PT171519721T
Other languages
English (en)
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of PT3232468T publication Critical patent/PT3232468T/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/32227—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the layer connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83232—Applying energy for connecting using an autocatalytic reaction, e.g. exothermic brazing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PT171519721T 2016-04-15 2017-01-18 Estrutura de dissipação de calor de um dispositivo semicondutor PT3232468T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016081964A JP6711098B2 (ja) 2016-04-15 2016-04-15 半導体装置の放熱構造

Publications (1)

Publication Number Publication Date
PT3232468T true PT3232468T (pt) 2021-01-18

Family

ID=57838279

Family Applications (1)

Application Number Title Priority Date Filing Date
PT171519721T PT3232468T (pt) 2016-04-15 2017-01-18 Estrutura de dissipação de calor de um dispositivo semicondutor

Country Status (7)

Country Link
US (1) US9997430B2 (pt)
EP (1) EP3232468B1 (pt)
JP (1) JP6711098B2 (pt)
KR (1) KR101946467B1 (pt)
CN (1) CN107301987B (pt)
PT (1) PT3232468T (pt)
TW (1) TWI648829B (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6693441B2 (ja) * 2017-02-27 2020-05-13 オムロン株式会社 電子装置およびその製造方法
CN110137720B (zh) * 2018-02-09 2022-07-26 富士康(昆山)电脑接插件有限公司 一种用来固定散热器的固定装置及其抵压装置
KR102185824B1 (ko) 2019-01-04 2020-12-02 강병혁 전력변환용 반도체 패키지의 방열구조
JP2023087808A (ja) 2021-12-14 2023-06-26 オムロン株式会社 実装基板、及び実装基板を搭載した電気機器
EP4297080A1 (de) * 2022-06-20 2023-12-27 Siemens Aktiengesellschaft Schaltungsanordnung mit einem schaltungsträger und einem halbleiterbauelement

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0458551A (ja) * 1990-06-28 1992-02-25 Nec Corp マルチチップモジュール
JPH08264688A (ja) * 1995-03-28 1996-10-11 Sumitomo Kinzoku Electro Device:Kk 半導体用セラミックパッケージ
JPH09139451A (ja) * 1995-11-15 1997-05-27 Hitachi Ltd 放熱フィン付半導体装置およびその実装方法ならびに取り外し方法
JPH09213847A (ja) * 1996-02-01 1997-08-15 Hitachi Ltd 半導体集積回路装置及びこの製造方法並びにそれを用いた電子装置
JPH09306954A (ja) * 1996-05-20 1997-11-28 Hitachi Ltd 半導体装置及びその実装方法並びに実装構造体
JP3451979B2 (ja) 1999-04-28 2003-09-29 株式会社日立製作所 半導体装置
US6292367B1 (en) * 2000-06-22 2001-09-18 International Business Machines Corporation Thermally efficient semiconductor chip
JP3855726B2 (ja) 2001-10-23 2006-12-13 松下電器産業株式会社 パワーモジュール
JP3934565B2 (ja) * 2003-02-21 2007-06-20 富士通株式会社 半導体装置
JP4173751B2 (ja) * 2003-02-28 2008-10-29 株式会社ルネサステクノロジ 半導体装置
TWI242863B (en) * 2003-09-15 2005-11-01 Siliconware Precision Industries Co Ltd Heat dissipating structure and semiconductor package with the heat dissipating structure
DE60315469T2 (de) * 2003-10-29 2008-04-24 Power One Italy S.P.A. Wärmeableiteinsatz, Schaltung mit einem solchen Einsatz und Verfahren zur Herstellung
US20050133908A1 (en) * 2003-12-18 2005-06-23 Advanced Thermal Technologies Chip assembly with glue-strengthening holes
JP4986435B2 (ja) * 2005-10-12 2012-07-25 株式会社ソニー・コンピュータエンタテインメント 半導体装置、半導体装置の作成方法
JP4935220B2 (ja) 2006-07-21 2012-05-23 三菱マテリアル株式会社 パワーモジュール装置
TW200824073A (en) * 2006-11-24 2008-06-01 Siliconware Precision Industries Co Ltd Heat-dissipation semiconductor package and fabrication method thereof
TWI355048B (en) * 2006-12-13 2011-12-21 Siliconware Precision Industries Co Ltd Heat-dissipation semiconductor package and heat-di
TWI353047B (en) * 2006-12-28 2011-11-21 Siliconware Precision Industries Co Ltd Heat-dissipating-type semiconductor package
JP4539773B2 (ja) * 2008-03-07 2010-09-08 株式会社デンソー 半導体装置およびその製造方法
WO2009119904A1 (ja) * 2008-03-28 2009-10-01 日本電気株式会社 半導体装置、その製造方法、プリント回路基板および電子機器
US8304291B2 (en) * 2009-06-29 2012-11-06 Advanced Micro Devices, Inc. Semiconductor chip thermal interface structures
CN102714195B (zh) * 2009-12-14 2015-05-06 松下电器产业株式会社 半导体装置
US20110240279A1 (en) * 2010-03-30 2011-10-06 International Business Machines Corporation Hybrid liquid metal-solder thermal interface
JP2012033559A (ja) * 2010-07-28 2012-02-16 J Devices:Kk 半導体装置
JP2012074425A (ja) * 2010-09-28 2012-04-12 Daikin Ind Ltd パワーモジュール
KR101198848B1 (ko) * 2010-12-22 2012-11-07 (주)포인트엔지니어링 반도체 디바이스 및 그 제조 방법
JP2013004953A (ja) * 2011-06-22 2013-01-07 Denso Corp 電子制御装置
WO2013051387A1 (ja) * 2011-10-07 2013-04-11 富士電機株式会社 プリント基板の取り付け構造およびその構造を用いた半導体装置
JP5983032B2 (ja) * 2012-05-28 2016-08-31 富士通株式会社 半導体パッケージ及び配線基板ユニット
US8952503B2 (en) * 2013-01-29 2015-02-10 International Business Machines Corporation Organic module EMI shielding structures and methods
JP2014165231A (ja) * 2013-02-22 2014-09-08 Fujitsu Ltd 電子部品ユニット及び固定構造
US9236323B2 (en) * 2013-02-26 2016-01-12 Intel Corporation Integrated heat spreader for multi-chip packages
JP6075218B2 (ja) 2013-06-11 2017-02-08 株式会社デンソー 半導体装置
US9576930B2 (en) * 2013-11-08 2017-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Thermally conductive structure for heat dissipation in semiconductor packages
CN105765713A (zh) * 2013-11-12 2016-07-13 捷恩智株式会社 散热器
DE102014205958A1 (de) * 2014-03-31 2015-10-01 Lemförder Electronic GmbH Halbleiterschaltelementanordnung und Steuergeräteinrichtung für ein Fahrzeug

Also Published As

Publication number Publication date
CN107301987B (zh) 2019-11-05
JP6711098B2 (ja) 2020-06-17
EP3232468B1 (en) 2021-01-06
TW201803049A (zh) 2018-01-16
KR101946467B1 (ko) 2019-02-08
EP3232468A1 (en) 2017-10-18
JP2017191904A (ja) 2017-10-19
CN107301987A (zh) 2017-10-27
US9997430B2 (en) 2018-06-12
US20170301602A1 (en) 2017-10-19
TWI648829B (zh) 2019-01-21
KR20170118599A (ko) 2017-10-25

Similar Documents

Publication Publication Date Title
HK1253883A1 (zh) 半導體器件
HK1251728A1 (zh) 半導體裝置
GB2559180B (en) Semiconductor cooling arrangement
HK1217058A1 (zh) 使用硅的芯片級熱耗散
SG10201707339PA (en) Semiconductor device
HK1245998A1 (zh) 半導體器件
DE102014113888B8 (de) Wärmeableitungsvorrichtung und elektronisches Gerät
GB201608523D0 (en) Heat sink
HK1222476A1 (zh) 半導體器件
TWI563631B (en) Semiconductor Device
PL3160019T3 (pl) Konstrukcja silnika zdolna do odprowadzania ciepła znajdującego się w nim
TWM533401U (en) Heat dissipation apparatus
HK1252338A1 (zh) 半導體器件
PT3232468T (pt) Estrutura de dissipação de calor de um dispositivo semicondutor
EP2988581A4 (en) CHIP HEAT DISSIPATION STRUCTURE AND TERMINAL DEVICE
GB2545155B (en) Assembly of semiconductor devices
HK1249276A1 (zh) 半導體器件
EP3564993A4 (en) HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR ELEMENT
HK1244353A1 (zh) 半導體器件
DE102017110821A8 (de) Halbleitervorrichtung
EP3478045A4 (en) HEAT DISSIPATION DEVICE
EP3422401C0 (en) HEAT DISSIPATION SUBSTRATE
GB201706285D0 (en) Semiconductor device comprising halometallate
HUE046080T2 (hu) Motorszerkezet, amely képes hõ disszipálására abban
TWM533195U (en) Heat dissipating device