PT3193360T - Coluna em cu, coluna com núcleo em cu, junta de solda e via de passagem de silício - Google Patents
Coluna em cu, coluna com núcleo em cu, junta de solda e via de passagem de silícioInfo
- Publication number
- PT3193360T PT3193360T PT149015711T PT14901571T PT3193360T PT 3193360 T PT3193360 T PT 3193360T PT 149015711 T PT149015711 T PT 149015711T PT 14901571 T PT14901571 T PT 14901571T PT 3193360 T PT3193360 T PT 3193360T
- Authority
- PT
- Portugal
- Prior art keywords
- column
- solder joint
- nuclear
- silicon via
- nuclear column
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K35/302—Cu as the principal constituent
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K35/3615—N-compounds
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- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01L2224/1354—Coating
- H01L2224/13599—Material
- H01L2224/136—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/1354—Coating
- H01L2224/13599—Material
- H01L2224/1369—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
Applications Claiming Priority (1)
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PCT/JP2014/073808 WO2016038686A1 (ja) | 2014-09-09 | 2014-09-09 | Cuカラム、Cu核カラム、はんだ継手およびシリコン貫通電極 |
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PT3193360T true PT3193360T (pt) | 2020-08-25 |
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PT149015711T PT3193360T (pt) | 2014-09-09 | 2014-09-09 | Coluna em cu, coluna com núcleo em cu, junta de solda e via de passagem de silício |
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EP (1) | EP3193360B1 (pt) |
JP (1) | JP5733486B1 (pt) |
KR (2) | KR20170042372A (pt) |
CN (1) | CN106688085B (pt) |
PT (1) | PT3193360T (pt) |
TW (1) | TWI566650B (pt) |
WO (1) | WO2016038686A1 (pt) |
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JP6350720B2 (ja) * | 2017-05-25 | 2018-07-04 | 千住金属工業株式会社 | 金属核カラムの実装方法 |
CN110600461B (zh) * | 2019-08-30 | 2022-04-22 | 荣耀终端有限公司 | 封装结构及电子设备 |
KR102579478B1 (ko) * | 2022-09-06 | 2023-09-21 | 덕산하이메탈(주) | 전기접속용 금속핀 |
KR102579479B1 (ko) * | 2022-09-06 | 2023-09-21 | 덕산하이메탈(주) | 접속핀 |
KR102485393B1 (ko) * | 2022-09-30 | 2023-01-09 | 씨피에스 주식회사 | 합금 와이어를 이용하여 필라를 제조하기 위한 장치 및 이에 의하여 제조된 필라 |
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JPS444063B1 (pt) | 1965-06-28 | 1966-02-19 | ||
US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
JPH0766209A (ja) | 1993-08-23 | 1995-03-10 | Furukawa Electric Co Ltd:The | バンプ材並びにその製造方法及びそれを用いた光部品実装方法 |
US5591941A (en) * | 1993-10-28 | 1997-01-07 | International Business Machines Corporation | Solder ball interconnected assembly |
JP3344295B2 (ja) | 1997-09-25 | 2002-11-11 | イビデン株式会社 | 半田部材及びプリント配線板 |
JP2000232119A (ja) | 1999-02-10 | 2000-08-22 | Shinko Electric Ind Co Ltd | 半導体チップの接続部材及びその製造方法とその接続部材を用いた半導体チップの接続方法 |
JP3697926B2 (ja) * | 1999-03-05 | 2005-09-21 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JP2003249598A (ja) | 2002-02-26 | 2003-09-05 | Kyocera Corp | 半導体素子収納用パッケージおよび半導体装置 |
WO2005020315A1 (ja) * | 2003-08-26 | 2005-03-03 | Tokuyama Corporation | 素子接合用基板、素子接合基板及びその製造方法 |
US7036710B1 (en) * | 2004-12-28 | 2006-05-02 | International Business Machines Corporation | Method and structures for implementing impedance-controlled coupled noise suppressor for differential interface solder column array |
JP2007115857A (ja) * | 2005-10-20 | 2007-05-10 | Nippon Steel Chem Co Ltd | マイクロボール |
JP4404063B2 (ja) | 2006-03-24 | 2010-01-27 | 株式会社村田製作所 | 接続構造、その形成方法、回路基板、および実装基板に表面実装された電子部品 |
US20080164300A1 (en) * | 2007-01-08 | 2008-07-10 | Endicott Interconnect Technologies, Inc. | Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly |
JP4945815B2 (ja) | 2007-06-25 | 2012-06-06 | Dowaエレクトロニクス株式会社 | 酸化銅粉末 |
JP5763887B2 (ja) * | 2010-02-24 | 2015-08-12 | 千住金属工業株式会社 | 銅カラム及びその製造方法 |
JP5633776B2 (ja) * | 2010-03-30 | 2014-12-03 | 日立金属株式会社 | 電子部品用複合ボールの製造方法 |
CN102148215B (zh) * | 2011-01-21 | 2012-06-06 | 哈尔滨理工大学 | 提高ccga 器件软钎焊焊点可靠性的互连结构及实现方法 |
KR101623629B1 (ko) * | 2011-03-07 | 2016-05-23 | 제이엑스 킨조쿠 가부시키가이샤 | 구리 또는 구리 합금, 본딩 와이어, 구리의 제조 방법, 구리 합금의 제조 방법 및 본딩 와이어의 제조 방법 |
JP6076020B2 (ja) * | 2012-02-29 | 2017-02-08 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
JP2014024082A (ja) * | 2012-07-26 | 2014-02-06 | Sumitomo Metal Mining Co Ltd | はんだ合金 |
US9668358B2 (en) * | 2012-12-06 | 2017-05-30 | Senju Metal Industry Co., Ltd. | Cu ball |
JP5590259B1 (ja) * | 2014-01-28 | 2014-09-17 | 千住金属工業株式会社 | Cu核ボール、はんだペーストおよびはんだ継手 |
WO2015114770A1 (ja) | 2014-01-30 | 2015-08-06 | 千住金属工業株式会社 | OSP処理Cuボール、はんだ継手、フォームはんだ、およびはんだペースト |
JP5534122B1 (ja) | 2014-02-04 | 2014-06-25 | 千住金属工業株式会社 | 核ボール、はんだペースト、フォームはんだ、フラックスコート核ボールおよびはんだ継手 |
US10137535B2 (en) | 2014-02-04 | 2018-11-27 | Senju Metal Industry Co., Ltd. | Cu ball, Cu core ball, solder joint, solder paste, and solder foam |
JP6761690B2 (ja) | 2016-07-28 | 2020-09-30 | アスリートFa株式会社 | 柱状部材搭載装置、柱状部材搭載方法 |
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- 2014-09-09 KR KR1020177009272A patent/KR20170042372A/ko active Search and Examination
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EP3193360A4 (en) | 2018-04-04 |
KR20180021222A (ko) | 2018-02-28 |
US20170287862A1 (en) | 2017-10-05 |
US10811376B2 (en) | 2020-10-20 |
TWI566650B (zh) | 2017-01-11 |
EP3193360A1 (en) | 2017-07-19 |
TW201630485A (zh) | 2016-08-16 |
JPWO2016038686A1 (ja) | 2017-04-27 |
JP5733486B1 (ja) | 2015-06-10 |
CN106688085B (zh) | 2019-06-18 |
EP3193360B1 (en) | 2020-07-01 |
CN106688085A (zh) | 2017-05-17 |
KR20170042372A (ko) | 2017-04-18 |
WO2016038686A1 (ja) | 2016-03-17 |
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