PT3050903T - Composição de resina curável do tipo microcápsula - Google Patents

Composição de resina curável do tipo microcápsula

Info

Publication number
PT3050903T
PT3050903T PT14848416T PT14848416T PT3050903T PT 3050903 T PT3050903 T PT 3050903T PT 14848416 T PT14848416 T PT 14848416T PT 14848416 T PT14848416 T PT 14848416T PT 3050903 T PT3050903 T PT 3050903T
Authority
PT
Portugal
Prior art keywords
resin composition
curable resin
microcapsule type
type curable
microcapsule
Prior art date
Application number
PT14848416T
Other languages
English (en)
Inventor
Onoda Tomohiro
Kamata Kunihiko
Maeda Yasuo
Original Assignee
Threebond Fine Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Threebond Fine Chemical Co Ltd filed Critical Threebond Fine Chemical Co Ltd
Publication of PT3050903T publication Critical patent/PT3050903T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/12—Polymerisation in non-solvents
    • C08F2/16—Aqueous medium
    • C08F2/20—Aqueous medium with the aid of macromolecular dispersing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B39/00—Locking of screws, bolts or nuts
    • F16B39/22—Locking of screws, bolts or nuts in which the locking takes place during screwing down or tightening
    • F16B39/225—Locking of screws, bolts or nuts in which the locking takes place during screwing down or tightening by means of a settable material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Dispersion Chemistry (AREA)
PT14848416T 2013-09-25 2014-09-08 Composição de resina curável do tipo microcápsula PT3050903T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013198047A JP6146571B2 (ja) 2013-09-25 2013-09-25 マイクロカプセル型硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
PT3050903T true PT3050903T (pt) 2019-08-07

Family

ID=52742977

Family Applications (1)

Application Number Title Priority Date Filing Date
PT14848416T PT3050903T (pt) 2013-09-25 2014-09-08 Composição de resina curável do tipo microcápsula

Country Status (8)

Country Link
US (1) US9969914B2 (pt)
EP (1) EP3050903B1 (pt)
JP (1) JP6146571B2 (pt)
CN (1) CN105555807B (pt)
HU (1) HUE044514T2 (pt)
PT (1) PT3050903T (pt)
TR (1) TR201911278T4 (pt)
WO (1) WO2015045830A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6406502B2 (ja) * 2014-07-04 2018-10-17 株式会社スリーボンド 重合性封着組成物
JPWO2020129459A1 (ja) * 2018-12-18 2021-11-04 株式会社スリーボンド 螺着部材用シール剤およびこれを用いた螺着部材
JP7415359B2 (ja) * 2019-07-31 2024-01-17 株式会社デンソー 硬化性組成物、接着構造体及び封止構造体
EP3783051A1 (en) * 2019-08-20 2021-02-24 D. Swarovski KG Adherable element with pressure-activated adhesive system
KR102280451B1 (ko) * 2019-11-21 2021-07-23 (주)진합 열수축 튜브를 활용한 풀림 방지 볼트부재
EP4435050A1 (en) * 2021-11-17 2024-09-25 ThreeBond Co., Ltd. Microcapsule type curable resin composition
NL2033064B1 (en) * 2022-09-16 2024-03-25 Panasia Progressive Tech Co Ltd Screw connection
WO2024135400A1 (ja) * 2022-12-20 2024-06-27 株式会社スリーボンド 硬化性樹脂組成物およびその加工品

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55161849A (en) * 1979-06-04 1980-12-16 Toray Silicone Co Ltd Organopolysiloxane composition
US4237252A (en) * 1979-06-28 1980-12-02 Minnesota Mining And Manufacturing Company Heat activatable one-part liquid resin systems
US4252708A (en) * 1979-06-28 1981-02-24 Minnesota Mining And Manufacturing Company Mechanically activateable one-part liquid resin systems
JP2696515B2 (ja) 1987-10-21 1998-01-14 株式会社スリーボンド 重合性封着組成物
JPH03292378A (ja) 1990-04-10 1991-12-24 Nitto Denko Corp マイクロカプセル、それを用いた接着剤組成物及びその硬化方法
JPH0742719A (ja) * 1993-08-04 1995-02-10 Toagosei Co Ltd フアスナ
JPH07224824A (ja) * 1994-02-10 1995-08-22 Shinko Bolt Kk 潤滑剤を付着させたボルトセット
EP0785243A3 (en) 1996-01-18 1998-06-03 Loctite (Ireland) Limited A method of sealing two abutting surfaces in face-to-face contact
JP3412430B2 (ja) 1996-10-28 2003-06-03 株式会社スリーボンド ねじ部材などに用いられるプレコート型接着剤組成物及びこれを用いたプレコート螺合部材
JPH10252177A (ja) * 1997-03-13 1998-09-22 Sekisui Chem Co Ltd 吸音材
JP3412469B2 (ja) 1997-07-31 2003-06-03 株式会社スリーボンド 硬化性組成物
JPH11349917A (ja) 1998-06-05 1999-12-21 Nissei Technica:Kk 緩み止め用のエアゾル型スプレー接着剤組成物
JP2000015087A (ja) 1998-06-29 2000-01-18 Kuraray Co Ltd マイクロカプセルの製造方法
JP2000191745A (ja) * 1998-12-25 2000-07-11 Sumitomo Bakelite Co Ltd 紫外線硬化型樹脂組成物
JP2000239438A (ja) * 1999-02-17 2000-09-05 Shikoku Chem Corp ホウ酸アルミニウムウイスカ及びこれを用いたエポキシ樹脂組成物
JP2002212513A (ja) * 2001-01-19 2002-07-31 Nippon Dekoratsukusu Kk ボルト固定用固着剤
JP4181773B2 (ja) * 2001-12-27 2008-11-19 株式会社ニッセイテクニカ 水性分散液型の緩み止め剤組成物
WO2005054393A1 (ja) * 2003-12-03 2005-06-16 Three Bond Co., Ltd. マイクロカプセル型接着剤組成物
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Also Published As

Publication number Publication date
WO2015045830A1 (ja) 2015-04-02
HUE044514T2 (hu) 2019-10-28
US20160208150A1 (en) 2016-07-21
JP2015063601A (ja) 2015-04-09
EP3050903A1 (en) 2016-08-03
EP3050903B1 (en) 2019-06-12
CN105555807B (zh) 2017-07-18
TR201911278T4 (tr) 2019-08-21
CN105555807A (zh) 2016-05-04
EP3050903A4 (en) 2017-05-31
US9969914B2 (en) 2018-05-15
JP6146571B2 (ja) 2017-06-14

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