PL83007B1 - Electroplating - esp of selected regions of semiconductors[FR2144766A1] - Google Patents
Electroplating - esp of selected regions of semiconductors[FR2144766A1] Download PDFInfo
- Publication number
- PL83007B1 PL83007B1 PL15650972A PL15650972A PL83007B1 PL 83007 B1 PL83007 B1 PL 83007B1 PL 15650972 A PL15650972 A PL 15650972A PL 15650972 A PL15650972 A PL 15650972A PL 83007 B1 PL83007 B1 PL 83007B1
- Authority
- PL
- Poland
- Prior art keywords
- electrolyte
- electroplating
- coating
- elements
- coated
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 title abstract description 3
- 239000003792 electrolyte Substances 0.000 claims abstract description 37
- 238000000576 coating method Methods 0.000 claims description 35
- 239000011248 coating agent Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 17
- 238000001914 filtration Methods 0.000 claims description 4
- 230000006641 stabilisation Effects 0.000 claims description 3
- 238000011105 stabilization Methods 0.000 claims description 3
- 210000000056 organ Anatomy 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 101150114468 TUB1 gene Proteins 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000009493 Hova Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002262 irrigation Effects 0.000 description 1
- 238000003973 irrigation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000000699 topical effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1670568A SU384436A1 (ru) | 1971-07-05 | 1971-07-05 | Устройство дл локальной электролитической обработки деталей |
| SU1670569A SU392152A1 (ru) | 1971-07-05 | 1971-07-05 | Устройство дл локальной электролитической обработки деталей |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL83007B1 true PL83007B1 (en) | 1975-12-31 |
Family
ID=26665433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL15650972A PL83007B1 (en) | 1971-07-05 | 1972-07-05 | Electroplating - esp of selected regions of semiconductors[FR2144766A1] |
Country Status (7)
| Country | Link |
|---|---|
| AT (1) | AT326440B (enExample) |
| DD (1) | DD97441A1 (enExample) |
| FR (1) | FR2144766A1 (enExample) |
| HU (1) | HU171455B (enExample) |
| IT (1) | IT973345B (enExample) |
| NL (1) | NL7209403A (enExample) |
| PL (1) | PL83007B1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5836067B2 (ja) * | 1980-10-16 | 1983-08-06 | アイシン精機株式会社 | 環状体の上面内縁部に部分メッキするためのメッキ装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2502495A (en) * | 1946-06-29 | 1950-04-04 | Norris Stamping And Mfg Compan | Apparatus for copper plating |
| FR1360811A (fr) * | 1963-04-03 | 1964-05-15 | Microdécapeur | |
| FR1537535A (fr) * | 1967-09-22 | 1968-08-23 | Heye Hermann Fa | Procédé et dispositif de nickelage des surfaces internes des corps creux, en particulier des moules à verre |
-
1972
- 1972-07-04 IT IT5133072A patent/IT973345B/it active
- 1972-07-04 FR FR7224163A patent/FR2144766A1/fr active Granted
- 1972-07-05 AT AT577472A patent/AT326440B/de not_active IP Right Cessation
- 1972-07-05 HU HU72IA00000662A patent/HU171455B/hu unknown
- 1972-07-05 DD DD16421472A patent/DD97441A1/xx unknown
- 1972-07-05 NL NL7209403A patent/NL7209403A/xx unknown
- 1972-07-05 PL PL15650972A patent/PL83007B1/pl unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE2232995A1 (de) | 1973-01-25 |
| DE2232995B2 (de) | 1975-12-04 |
| AT326440B (de) | 1975-12-10 |
| DD97441A1 (enExample) | 1973-05-14 |
| FR2144766A1 (en) | 1973-02-16 |
| FR2144766B1 (enExample) | 1976-05-14 |
| NL7209403A (enExample) | 1973-01-09 |
| ATA577472A (de) | 1975-02-15 |
| HU171455B (hu) | 1978-01-28 |
| IT973345B (it) | 1974-06-10 |
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