PL2828889T3 - Materiał interfejsu termicznego - Google Patents

Materiał interfejsu termicznego

Info

Publication number
PL2828889T3
PL2828889T3 PL13719621T PL13719621T PL2828889T3 PL 2828889 T3 PL2828889 T3 PL 2828889T3 PL 13719621 T PL13719621 T PL 13719621T PL 13719621 T PL13719621 T PL 13719621T PL 2828889 T3 PL2828889 T3 PL 2828889T3
Authority
PL
Poland
Prior art keywords
thermal interface
interface material
thermal
interface
Prior art date
Application number
PL13719621T
Other languages
English (en)
Inventor
Bas Fleskens
Boer Reinier Imre Anton Den
Original Assignee
Philips Lighting Holding Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Lighting Holding Bv filed Critical Philips Lighting Holding Bv
Publication of PL2828889T3 publication Critical patent/PL2828889T3/pl

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/02—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
    • B29C55/10—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial
    • B29C55/12—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/12—Thermoplastic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0002—Condition, form or state of moulded material or of the material to be shaped monomers or prepolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/253—Preform
    • B29K2105/256—Sheets, plates, blanks or films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0013—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
PL13719621T 2012-03-22 2013-03-11 Materiał interfejsu termicznego PL2828889T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261614065P 2012-03-22 2012-03-22
EP13719621.8A EP2828889B1 (en) 2012-03-22 2013-03-11 Thermal interface material
PCT/IB2013/051907 WO2013140295A2 (en) 2012-03-22 2013-03-11 Thermal interface material

Publications (1)

Publication Number Publication Date
PL2828889T3 true PL2828889T3 (pl) 2016-02-29

Family

ID=48227358

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13719621T PL2828889T3 (pl) 2012-03-22 2013-03-11 Materiał interfejsu termicznego

Country Status (8)

Country Link
US (1) US9316447B2 (pl)
EP (1) EP2828889B1 (pl)
JP (1) JP5893764B2 (pl)
CN (1) CN104145332B (pl)
ES (1) ES2551914T3 (pl)
PL (1) PL2828889T3 (pl)
RU (1) RU2580529C1 (pl)
WO (1) WO2013140295A2 (pl)

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CN106662309B (zh) * 2014-08-08 2020-10-09 亮锐控股有限公司 具有柔性热界面的led设备
GB201502329D0 (en) 2015-02-12 2015-04-01 Trimble Navigation Ltd Geographical positioning in time
CN105938821B (zh) * 2015-03-03 2020-04-28 台湾积体电路制造股份有限公司 热增强的散热器
CN105138725A (zh) * 2015-07-21 2015-12-09 厦门大学 一种制备热整流元器件的方法
US10371345B2 (en) * 2015-12-28 2019-08-06 Eaton Intelligent Power Limited Light emitting diode (LED) module for LED luminaire
JP6691792B2 (ja) * 2016-02-26 2020-05-13 株式会社小糸製作所 車両用灯具
US11014203B2 (en) 2016-07-11 2021-05-25 Laird Technologies, Inc. System for applying interface materials
US10741519B2 (en) 2016-07-11 2020-08-11 Laird Technologies, Inc. Systems of applying materials to components
US11150448B2 (en) 2016-11-06 2021-10-19 Denso Corporation Vehicle windshield mounted camera module
US10098267B1 (en) 2017-06-06 2018-10-09 Robert Bosch Llc Housing for a camera and method of manufacture
US10667396B2 (en) * 2017-08-25 2020-05-26 Tactotek Oy Multilayer structure for hosting electronics and related method of manufacture
JP2019053941A (ja) * 2017-09-19 2019-04-04 株式会社小糸製作所 灯具ユニット及び車両用灯具
USD999405S1 (en) 2017-10-06 2023-09-19 Laird Technologies, Inc. Material having edging
USD879046S1 (en) 2017-10-06 2020-03-24 Laird Technologies, Inc. Material having edging
USD881822S1 (en) 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
US11141823B2 (en) 2018-04-28 2021-10-12 Laird Technologies, Inc. Systems and methods of applying materials to components

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JPH06302728A (ja) * 1993-04-12 1994-10-28 Oki Electric Ind Co Ltd セラミック多層基板上におけるｌｓｉ放熱構造
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US5591034A (en) 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
US5940687A (en) * 1997-06-06 1999-08-17 International Business Machines Corporation Wire mesh insert for thermal adhesives
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Also Published As

Publication number Publication date
CN104145332B (zh) 2017-05-10
CN104145332A (zh) 2014-11-12
EP2828889A2 (en) 2015-01-28
EP2828889B1 (en) 2015-09-02
RU2580529C1 (ru) 2016-04-10
JP2015510274A (ja) 2015-04-02
ES2551914T3 (es) 2015-11-24
US20150036363A1 (en) 2015-02-05
WO2013140295A3 (en) 2014-01-23
JP5893764B2 (ja) 2016-03-23
WO2013140295A2 (en) 2013-09-26
US9316447B2 (en) 2016-04-19

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