PL2394288T3 - Modyfikowalna konfiguracja magnesów dla źródeł odparowania łukowego - Google Patents

Modyfikowalna konfiguracja magnesów dla źródeł odparowania łukowego

Info

Publication number
PL2394288T3
PL2394288T3 PL09799555T PL09799555T PL2394288T3 PL 2394288 T3 PL2394288 T3 PL 2394288T3 PL 09799555 T PL09799555 T PL 09799555T PL 09799555 T PL09799555 T PL 09799555T PL 2394288 T3 PL2394288 T3 PL 2394288T3
Authority
PL
Poland
Prior art keywords
modifiable
magnet configuration
arc vaporization
vaporization sources
sources
Prior art date
Application number
PL09799555T
Other languages
English (en)
Inventor
Siegfried Krassnitzer
Juerg Hagmann
Oliver Gstoehl
Original Assignee
Oerlikon Surface Solutions Ag, Pfäffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag, Pfäffikon filed Critical Oerlikon Surface Solutions Ag, Pfäffikon
Publication of PL2394288T3 publication Critical patent/PL2394288T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3458—Electromagnets in particular for cathodic sputtering apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/338—Changing chemical properties of treated surfaces
    • H01J2237/3387—Nitriding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
  • Magnetic Treatment Devices (AREA)
PL09799555T 2009-02-09 2009-12-30 Modyfikowalna konfiguracja magnesów dla źródeł odparowania łukowego PL2394288T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009008161A DE102009008161A1 (de) 2009-02-09 2009-02-09 Modifizierbare Magnetkonfiguration für Arc-Verdampfungsquellen
PCT/EP2009/009319 WO2010088947A1 (de) 2009-02-09 2009-12-30 Modifizierbare magnetkonfiguration für arc-verdampungsquellen
EP09799555.9A EP2394288B1 (de) 2009-02-09 2009-12-30 Modifizierbare magnetkonfiguration für arc-verdampungsquellen

Publications (1)

Publication Number Publication Date
PL2394288T3 true PL2394288T3 (pl) 2018-03-30

Family

ID=41647035

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09799555T PL2394288T3 (pl) 2009-02-09 2009-12-30 Modyfikowalna konfiguracja magnesów dla źródeł odparowania łukowego

Country Status (17)

Country Link
US (2) US11264216B2 (pl)
EP (1) EP2394288B1 (pl)
JP (1) JP5608176B2 (pl)
KR (2) KR20110135919A (pl)
CN (1) CN102308359B (pl)
AU (1) AU2009339328B2 (pl)
BR (1) BRPI0924299A2 (pl)
CA (1) CA2751811C (pl)
DE (1) DE102009008161A1 (pl)
ES (1) ES2652141T3 (pl)
HU (1) HUE034774T2 (pl)
MX (1) MX2011008408A (pl)
PL (1) PL2394288T3 (pl)
PT (1) PT2394288T (pl)
RU (1) RU2550502C2 (pl)
SG (2) SG173512A1 (pl)
WO (1) WO2010088947A1 (pl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009008161A1 (de) * 2009-02-09 2010-08-12 Oerlikon Trading Ag, Trübbach Modifizierbare Magnetkonfiguration für Arc-Verdampfungsquellen
JP5035479B2 (ja) 2011-01-27 2012-09-26 三菱マテリアル株式会社 耐欠損性、耐摩耗性にすぐれた表面被覆切削工具
RU2602577C2 (ru) * 2011-06-30 2016-11-20 Эрликон Серфиз Солюшнз Аг, Пфеффикон Нанослойное покрытие для высококачественных инструментов
JP6074573B2 (ja) * 2013-04-30 2017-02-08 日本アイ・ティ・エフ株式会社 アーク蒸発源
CN103556122B (zh) * 2013-10-23 2017-01-18 苏州矩阵光电有限公司 一种自适应磁场调整型磁控溅射镀膜设备及其镀膜方法
JP6403269B2 (ja) * 2014-07-30 2018-10-10 株式会社神戸製鋼所 アーク蒸発源
CA3021704C (en) * 2016-04-22 2023-11-14 Oerlikon Surface Solutions Ag, Pfaffikon Ticn having reduced growth defects by means of hipims
CH715878A1 (de) 2019-02-26 2020-08-31 Oerlikon Surface Solutions Ag Pfaeffikon Magnetanordnung für eine Plasmaquelle zur Durchführung von Plasmabehandlungen.
KR102667048B1 (ko) 2021-07-20 2024-05-22 한국생산기술연구원 중앙부 함몰형 자기장을 가지는 아크 증발원 및 이를 포함하는 아크 이온 플레이팅 장치, 그리고 이를 이용한 금속 및 금속화합물의 증착방법
DE102022118927A1 (de) 2022-07-28 2024-02-08 Rainer Cremer Verfahren zum Verdampfen einer Kathode in einem Vakuumlichtbogenverdampfer

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US3836451A (en) * 1968-12-26 1974-09-17 A Snaper Arc deposition apparatus
US4309266A (en) * 1980-07-18 1982-01-05 Murata Manufacturing Co., Ltd. Magnetron sputtering apparatus
DE3175623D1 (en) 1980-08-11 1987-01-08 Siemens Ag Fingerprint sensor delivering an electric signal corresponding to the topographic relief of a finger to be examined
US4401539A (en) * 1981-01-30 1983-08-30 Hitachi, Ltd. Sputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux generated by said sputtering cathode structure, and method of forming films by use of said sputtering cathode structure
JPS5994357U (ja) * 1982-12-14 1984-06-27 三島製紙株式会社 情報記録紙の複写性低下を防止するシ−ト
DE4017111C2 (de) * 1990-05-28 1998-01-29 Hauzer Holding Lichtbogen-Magnetron-Vorrichtung
US5298136A (en) * 1987-08-18 1994-03-29 Regents Of The University Of Minnesota Steered arc coating with thick targets
JP2912864B2 (ja) * 1995-11-28 1999-06-28 アプライド マテリアルズ インコーポレイテッド スパッタリング装置のマグネトロンユニット
DE19702928C2 (de) * 1997-01-28 2001-06-07 Eitec Ges Fuer Metallisches Ha Lichtbogenverdampfer
GB9722649D0 (en) * 1997-10-24 1997-12-24 Univ Nanyang Cathode ARC source for metallic and dielectric coatings
DE10010448C1 (de) * 2000-03-03 2002-04-25 Multi Media Machinery Gmbh Kathode
DE10127012A1 (de) 2001-06-05 2002-12-12 Gabriel Herbert M Lichtbogen-Verdampfungsvorrichtung
DE10127013A1 (de) 2001-06-05 2002-12-12 Gabriel Herbert M Lichtbogen-Verdampfungsvorrichtung
KR101074554B1 (ko) * 2002-12-19 2011-10-17 오를리콘 트레이딩 아크티엔게젤샤프트, 트뤼프바흐 자기장 발생 장치를 포함하는 진공 아크 공급 장치
RU2256724C1 (ru) * 2003-12-10 2005-07-20 Самарский государственный аэрокосмический университет им. акад. С.П. Королева Способ нанесения композиционных покрытий в вакууме
US8778144B2 (en) * 2004-09-28 2014-07-15 Oerlikon Advanced Technologies Ag Method for manufacturing magnetron coated substrates and magnetron sputter source
JP4548666B2 (ja) * 2005-08-26 2010-09-22 株式会社不二越 アーク式イオンプレーティング装置用蒸発源
ATE459734T1 (de) 2005-12-16 2010-03-15 Fundacion Tekniker Kathodenverdampfungsmaschine
GB0608582D0 (en) * 2006-05-02 2006-06-07 Univ Sheffield Hallam High power impulse magnetron sputtering vapour deposition
RU2448388C2 (ru) * 2006-05-16 2012-04-20 Эрликон Трейдинг Аг, Трюббах Электродуговой источник и магнитное приспособление
US7857948B2 (en) 2006-07-19 2010-12-28 Oerlikon Trading Ag, Trubbach Method for manufacturing poorly conductive layers
US10043642B2 (en) * 2008-02-01 2018-08-07 Oerlikon Surface Solutions Ag, Pfäffikon Magnetron sputtering source and arrangement with adjustable secondary magnet arrangement
DE102009008161A1 (de) * 2009-02-09 2010-08-12 Oerlikon Trading Ag, Trübbach Modifizierbare Magnetkonfiguration für Arc-Verdampfungsquellen

Also Published As

Publication number Publication date
EP2394288B1 (de) 2017-10-11
CN102308359A (zh) 2012-01-04
MX2011008408A (es) 2011-09-22
CN102308359B (zh) 2016-06-01
CA2751811A1 (en) 2010-08-12
JP5608176B2 (ja) 2014-10-15
KR20160150641A (ko) 2016-12-30
US11264216B2 (en) 2022-03-01
US20110308941A1 (en) 2011-12-22
CA2751811C (en) 2017-08-22
AU2009339328A1 (en) 2011-08-25
SG2014008999A (en) 2014-04-28
KR20110135919A (ko) 2011-12-20
US20200176220A1 (en) 2020-06-04
RU2550502C2 (ru) 2015-05-10
DE102009008161A1 (de) 2010-08-12
PT2394288T (pt) 2018-01-03
RU2011137165A (ru) 2013-03-20
BRPI0924299A2 (pt) 2016-01-26
US11535928B2 (en) 2022-12-27
SG173512A1 (en) 2011-09-29
AU2009339328B2 (en) 2014-05-08
WO2010088947A1 (de) 2010-08-12
KR101784648B1 (ko) 2017-11-06
ES2652141T3 (es) 2018-01-31
JP2012517522A (ja) 2012-08-02
EP2394288A1 (de) 2011-12-14
HUE034774T2 (en) 2018-02-28

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