PL1927275T3 - Szablon drukarski stosowany w procesie SMT i sposób jego powlekania - Google Patents
Szablon drukarski stosowany w procesie SMT i sposób jego powlekaniaInfo
- Publication number
- PL1927275T3 PL1927275T3 PL06793003T PL06793003T PL1927275T3 PL 1927275 T3 PL1927275 T3 PL 1927275T3 PL 06793003 T PL06793003 T PL 06793003T PL 06793003 T PL06793003 T PL 06793003T PL 1927275 T3 PL1927275 T3 PL 1927275T3
- Authority
- PL
- Poland
- Prior art keywords
- coating
- printing
- clearances
- template
- printing template
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
- B41M2205/12—Preparation of material for subsequent imaging, e.g. corona treatment, simultaneous coating, pre-treatments
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Textile Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Printing Plates And Materials Therefor (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Chemically Coating (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005045350A DE102005045350B4 (de) | 2005-09-22 | 2005-09-22 | Druckschablone eines SMT-Prozesses |
PCT/EP2006/065666 WO2007033882A1 (de) | 2005-09-22 | 2006-08-25 | Druckschablone eines smt-prozesses und verfahren zu ihrer beschichtung |
EP06793003A EP1927275B1 (de) | 2005-09-22 | 2006-08-25 | Druckschablone eines smt-prozesses und verfahren zu ihrer beschichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
PL1927275T3 true PL1927275T3 (pl) | 2011-04-29 |
Family
ID=37402594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL06793003T PL1927275T3 (pl) | 2005-09-22 | 2006-08-25 | Szablon drukarski stosowany w procesie SMT i sposób jego powlekania |
Country Status (9)
Country | Link |
---|---|
US (1) | US20110045238A1 (pl) |
EP (1) | EP1927275B1 (pl) |
JP (1) | JP2009508721A (pl) |
CN (1) | CN101268724B (pl) |
AT (1) | ATE483353T1 (pl) |
DE (3) | DE102005045350B4 (pl) |
DK (1) | DK1927275T3 (pl) |
PL (1) | PL1927275T3 (pl) |
WO (1) | WO2007033882A1 (pl) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007010936A1 (de) | 2007-03-07 | 2008-09-11 | Biotronik Crm Patent Ag | Siebdruckvorrichtung und Verfahren zur Herstellung derselben |
DE102009024877A1 (de) * | 2009-06-09 | 2010-12-23 | Nb Technologies Gmbh | Siebdruckform |
DE102011083733A1 (de) | 2011-09-29 | 2013-04-04 | Siemens Aktiengesellschaft | Siebdruckschablone und Verfahren zum Beschichten von Siebdruckschablonen |
CN103096639B (zh) * | 2011-11-02 | 2016-04-27 | 恩斯迈电子(深圳)有限公司 | 印刷模板及其制造方法及印刷锡膏的方法 |
CN102615932B (zh) * | 2012-04-06 | 2013-12-11 | 深圳光韵达光电科技股份有限公司 | 一种金属印刷模板及其制造方法以及其使用的涂层溶液 |
CN102963146B (zh) * | 2012-09-29 | 2015-12-02 | 深圳光韵达光电科技股份有限公司 | 一种smt激光模板及其制作方法 |
CN103442510A (zh) * | 2013-07-17 | 2013-12-11 | 卢世闵 | 一种smt的印刷钢板及生产工艺 |
EP2937890B1 (en) * | 2014-04-22 | 2020-06-03 | Europlasma nv | Plasma coating apparatus with a plasma diffuser and method preventing discolouration of a substrate |
MX2018002858A (es) * | 2018-03-07 | 2019-09-09 | Interlatin S De R L De C V | Plantilla que mejora el estarcido de soldadura en pasta, y su método de fabricación. |
CN111361272A (zh) * | 2020-04-14 | 2020-07-03 | 湖北奥霖卡光电科技有限公司 | 一种高疏水性新型网印模板及其制备方法 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2421607A (en) * | 1942-04-03 | 1947-06-03 | Harwood B Fowler | Method of making metallic printing screens |
US4803110A (en) * | 1986-09-15 | 1989-02-07 | International Business Machines Corporation | Coated mask for photolithographic construction of electric circuits |
JPH0272997A (ja) * | 1988-09-07 | 1990-03-13 | Fujitsu Ltd | 印刷版 |
US5707740A (en) * | 1990-04-03 | 1998-01-13 | Ppg Industries, Inc. | Water repellent surface treatment with acid activation |
DE4122743C1 (pl) * | 1991-07-10 | 1992-11-26 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De | |
JPH05116475A (ja) * | 1991-10-29 | 1993-05-14 | Kimoto & Co Ltd | 表面改質孔版およびその表面改質方法 |
JPH05220922A (ja) * | 1992-02-18 | 1993-08-31 | Matsushita Electric Ind Co Ltd | メタルマスク及びその製造方法 |
JPH06228755A (ja) * | 1993-02-03 | 1994-08-16 | Nippon Sheet Glass Co Ltd | 基板上に撥水性被膜を形成する方法 |
JP3070411B2 (ja) * | 1994-10-07 | 2000-07-31 | トヨタ自動車株式会社 | 鉄系部材に撥水性被覆膜を形成する方法 |
DE4438281C1 (de) * | 1994-10-26 | 1996-04-18 | Koenen Gmbh | Siebdruck-Sieb und Verfahren zu seiner Herstellung |
WO1997043656A2 (en) * | 1996-05-17 | 1997-11-20 | Formfactor, Inc. | Wafer-level burn-in and test |
US6669781B2 (en) * | 1997-09-23 | 2003-12-30 | Micron Technology, Inc. | Method and apparatus for improving stencil/screen print quality |
JP3933777B2 (ja) * | 1997-12-03 | 2007-06-20 | 株式会社Kri | 基材の表面改質方法 |
US6089151A (en) * | 1998-02-24 | 2000-07-18 | Micron Technology, Inc. | Method and stencil for extruding material on a substrate |
TW527492B (en) * | 1998-10-14 | 2003-04-11 | Tomoegawa Paper Co Ltd | Anti-reflection material and polarized film using the same |
US6564935B1 (en) * | 1999-11-04 | 2003-05-20 | Nippon Sheet Glass Co., Ltd. | Coating solution, method and kit for preparing the same, and method for water-repellent treatment using the same |
JP3508673B2 (ja) * | 2000-01-25 | 2004-03-22 | トヨタ自動車株式会社 | 自己潤滑性コーティング及びその形成方法 |
JP2001240469A (ja) * | 2000-02-28 | 2001-09-04 | Matsushita Electric Ind Co Ltd | 誘電体粒子の製造方法および誘電体膜の製造方法 |
JP4509295B2 (ja) * | 2000-04-26 | 2010-07-21 | リコーマイクロエレクトロニクス株式会社 | 印刷用マスク及びその製造方法 |
JP2002046298A (ja) * | 2000-08-03 | 2002-02-12 | Riso Kagaku Corp | サーマルヘッド、その表面処理方法及び表面処理剤 |
DE10063519A1 (de) * | 2000-12-20 | 2002-07-04 | Nano X Gmbh | Lösungsmittelarme Sol-Gel-Systeme |
JP3825971B2 (ja) * | 2000-12-25 | 2006-09-27 | 株式会社ボンマーク | 印刷用メタルマスク |
DE10105329A1 (de) * | 2001-02-05 | 2002-08-29 | Hans Und Antonie Priwitzer Ing | Druckschablone |
NL1019781C2 (nl) * | 2002-01-18 | 2003-07-21 | Tno | Deklaag alsmede werkwijzen en inrichtingen voor de vervaardiging daarvan. |
DE10231698A1 (de) * | 2002-03-26 | 2003-10-23 | Fraunhofer Ges Forschung | Verfahren zur Verbesserung des Transfers von Zusatzmaterial mittels einer Schablone auf einen Träger sowie zugehörige Schablone |
DE10217202A1 (de) * | 2002-04-18 | 2003-11-06 | Bayer Ag | Anti-Haft-Beschichtungen für Reaktoren |
US6988652B2 (en) * | 2002-05-17 | 2006-01-24 | Fry's Metals, Inc. | Solder printing using a stencil having a reverse-tapered aperture |
US7093746B2 (en) * | 2002-05-17 | 2006-08-22 | Fry's Metals, Inc. | Coated stencil with reduced surface tension |
ITNO20020009A1 (it) * | 2002-07-12 | 2004-01-12 | Novara Technology Srl | "processo sol-gel per la preparazione di film vetrosi con elevate proprieta' di adesione e soluzioni colloidali stabili adatte alla loro rea |
RU2396210C2 (ru) * | 2003-07-22 | 2010-08-10 | Х.К.Штарк Инк. | ПОРОШОК MoO2, СПОСОБЫ ИЗГОТОВЛЕНИЯ ПЛАСТИНЫ ИЗ ПОРОШКА MoO2 (ИХ ВАРИАНТЫ), ЭЛЕМЕНТ И СПОСОБ ИЗГОТОВЛЕНИЯ ТОНКОЙ ПЛЕНКИ ИЗ НЕЕ, СПОСОБ РАСПЫЛЕНИЯ С ПРИМЕНЕНИЕМ УКАЗАННОЙ ПЛАСТИНЫ |
JP4134327B2 (ja) * | 2003-11-19 | 2008-08-20 | 株式会社プロセス・ラボ・ミクロン | メタルマスク及びその製造方法 |
-
2005
- 2005-09-22 DE DE102005045350A patent/DE102005045350B4/de not_active Expired - Fee Related
- 2005-09-22 DE DE102005063510A patent/DE102005063510B4/de active Active
-
2006
- 2006-08-25 WO PCT/EP2006/065666 patent/WO2007033882A1/de active Application Filing
- 2006-08-25 DE DE502006007976T patent/DE502006007976D1/de active Active
- 2006-08-25 DK DK06793003.2T patent/DK1927275T3/da active
- 2006-08-25 AT AT06793003T patent/ATE483353T1/de active
- 2006-08-25 PL PL06793003T patent/PL1927275T3/pl unknown
- 2006-08-25 EP EP06793003A patent/EP1927275B1/de not_active Not-in-force
- 2006-08-25 JP JP2008531650A patent/JP2009508721A/ja active Pending
- 2006-08-25 US US12/067,560 patent/US20110045238A1/en not_active Abandoned
- 2006-08-25 CN CN2006800347896A patent/CN101268724B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101268724A (zh) | 2008-09-17 |
DE102005045350A1 (de) | 2007-04-05 |
DE102005063510B4 (de) | 2010-06-02 |
DE502006007976D1 (de) | 2010-11-11 |
JP2009508721A (ja) | 2009-03-05 |
EP1927275A1 (de) | 2008-06-04 |
US20110045238A1 (en) | 2011-02-24 |
EP1927275B1 (de) | 2010-09-29 |
WO2007033882A1 (de) | 2007-03-29 |
ATE483353T1 (de) | 2010-10-15 |
DE102005045350B4 (de) | 2009-07-16 |
CN101268724B (zh) | 2010-12-15 |
DK1927275T3 (da) | 2011-01-10 |
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