PL1913801T3 - Sposób wytwarzania na podłożu nośnym metalowych struktur tworzących wzory - Google Patents

Sposób wytwarzania na podłożu nośnym metalowych struktur tworzących wzory

Info

Publication number
PL1913801T3
PL1913801T3 PL06776606T PL06776606T PL1913801T3 PL 1913801 T3 PL1913801 T3 PL 1913801T3 PL 06776606 T PL06776606 T PL 06776606T PL 06776606 T PL06776606 T PL 06776606T PL 1913801 T3 PL1913801 T3 PL 1913801T3
Authority
PL
Poland
Prior art keywords
carrier substrate
metal structures
pattern
forming metal
manufacturing pattern
Prior art date
Application number
PL06776606T
Other languages
English (en)
Polish (pl)
Inventor
Franz Kohnle
Michael Guggemos
Matthias Dammasch
Wolfgang Ptak
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PL1913801T3 publication Critical patent/PL1913801T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
PL06776606T 2005-08-09 2006-08-04 Sposób wytwarzania na podłożu nośnym metalowych struktur tworzących wzory PL1913801T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005038392A DE102005038392B4 (de) 2005-08-09 2005-08-09 Verfahren zum Herstellen von Muster bildenden Kupferstrukturen auf einem Trägersubstrat
EP06776606A EP1913801B1 (en) 2005-08-09 2006-08-04 Method of manufacturing pattern-forming metal structures on a carrier substrate
PCT/EP2006/007734 WO2007017192A1 (en) 2005-08-09 2006-08-04 Method of manufacturing pattern-forming metal structures on a carrier substrate

Publications (1)

Publication Number Publication Date
PL1913801T3 true PL1913801T3 (pl) 2010-06-30

Family

ID=37307595

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06776606T PL1913801T3 (pl) 2005-08-09 2006-08-04 Sposób wytwarzania na podłożu nośnym metalowych struktur tworzących wzory

Country Status (13)

Country Link
US (1) US8202567B2 (pt)
EP (1) EP1913801B1 (pt)
JP (1) JP4802244B2 (pt)
KR (1) KR101225383B1 (pt)
CN (1) CN101243735B (pt)
AT (1) ATE453310T1 (pt)
BR (1) BRPI0614296A2 (pt)
DE (2) DE102005038392B4 (pt)
ES (1) ES2335693T3 (pt)
MY (1) MY143624A (pt)
PL (1) PL1913801T3 (pt)
TW (1) TWI415534B (pt)
WO (1) WO2007017192A1 (pt)

Families Citing this family (11)

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Publication number Priority date Publication date Assignee Title
US8786510B2 (en) 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
DE102008035522A1 (de) * 2008-07-30 2010-02-04 Mühlbauer Ag Verfahren zur Herstellung einer Vorrichtung zur drahtlosen Kommunikation bzw. eines Prelaminats für eine solche Vorrichtung
ES2739355T3 (es) 2010-06-14 2020-01-30 Avery Dennison Corp Producto intermedio estratificado de lámina fina y método de fabricación
TW201249275A (en) * 2011-05-16 2012-12-01 Jieng Tai Internat Electric Corp Method for forming component-mounting device with antenna
FI125720B (fi) 2011-05-19 2016-01-29 Tecnomar Oy Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä
CN102790259A (zh) * 2011-05-20 2012-11-21 晶钛国际电子股份有限公司 形成具有天线的载件的方法
CN102880898A (zh) * 2011-07-13 2013-01-16 上海铁勋智能识别系统有限公司 一种覆盖uhf全频段、自由空间和金属表面共用的超高频电子标签
WO2016134703A1 (de) 2015-02-26 2016-09-01 Dynamic Solar Systems Ag Raumtemperatur-verfahren zur herstellung elektrotechnischer dünnschichten und verfahrensgemäss erhaltene dünnschichtfolge
US20180033620A1 (en) * 2015-02-26 2018-02-01 Dynamic Solar Systems Ag Room temperature method for the production of electrotechnical thin layers, the use of same, and a thin layer heating system obtained in this manner
DE102016103432A1 (de) 2015-02-26 2016-09-01 Dynamic Solar Systems Ag Raumtemperatur-Verfahren zur Herstellung elektrotechnischer Dünnschichten und elektrotechnische Dünnschicht
US10846494B2 (en) 2019-01-03 2020-11-24 The Boeing Company Radio-frequency identification device for indicating a temperature history of a composite structure

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GB1160730A (en) * 1966-12-23 1969-08-06 Matsushita Electric Ind Co Ltd Improvements in or relating to the Production of Printed Circuits
US3575838A (en) * 1968-12-12 1971-04-20 Ferro Corp Electrophoretic deposition of ceramic coatings
US3801364A (en) * 1971-02-03 1974-04-02 Matsushita Electric Ind Co Ltd Method for making printed circuits which include printed resistors
US4355083A (en) * 1977-06-06 1982-10-19 Nathan Feldstein Electrolessly metallized silver coated article
US4252672A (en) * 1979-12-04 1981-02-24 Xerox Corporation Preparation of colloidal iron dispersions by the polymer-catalyzed decomposition of iron carbonyl and iron organocarbonyl compounds
US4404237A (en) * 1980-12-29 1983-09-13 General Electric Company Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal
DE3148330A1 (de) * 1981-12-07 1983-06-09 Max Planck Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen
DE3428121A1 (de) * 1984-07-31 1986-02-13 Basf Ag, 6700 Ludwigshafen Verfahren zur herstellung von eisenpulver
DE3515985A1 (de) * 1985-05-03 1986-11-06 Wilhelm Ruf KG, 8000 München Verfahren zur herstellung einer loetbaren beschichtung auf einem substrat und leiterbahnplatte bzw. loetbare kontaktflaeche
JPH0387092A (ja) * 1989-06-15 1991-04-11 Matsushita Electric Works Ltd 内層用回路板の銅回路の処理方法
DE4227085A1 (de) * 1992-08-17 1994-02-24 Bosch Gmbh Robert Verfahren zur Herstellung fein strukturierter elektrisch leitfähiger Schichten
DE4440299A1 (de) * 1994-11-11 1996-05-15 Metallgesellschaft Ag Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen
US6496382B1 (en) * 1995-05-19 2002-12-17 Kasten Chase Applied Research Limited Radio frequency identification tag
US5709832A (en) * 1995-06-02 1998-01-20 Ericsson Inc. Method of manufacturing a printed antenna
US6331201B1 (en) * 1997-04-28 2001-12-18 Fry's Metals, Inc. Bismuth coating protection for copper
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JP4943673B2 (ja) * 2005-06-28 2012-05-30 三菱製紙株式会社 導電性材料の製造方法

Also Published As

Publication number Publication date
DE602006011335D1 (de) 2010-02-04
BRPI0614296A2 (pt) 2011-03-22
MY143624A (en) 2011-06-15
ATE453310T1 (de) 2010-01-15
DE102005038392A1 (de) 2007-03-15
CN101243735A (zh) 2008-08-13
KR20080033385A (ko) 2008-04-16
CN101243735B (zh) 2012-09-26
TWI415534B (zh) 2013-11-11
ES2335693T3 (es) 2010-03-31
KR101225383B1 (ko) 2013-01-22
JP4802244B2 (ja) 2011-10-26
DE102005038392B4 (de) 2008-07-10
US8202567B2 (en) 2012-06-19
WO2007017192A1 (en) 2007-02-15
EP1913801A1 (en) 2008-04-23
JP2009505383A (ja) 2009-02-05
TW200726349A (en) 2007-07-01
US20100136252A1 (en) 2010-06-03
EP1913801B1 (en) 2009-12-23

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