PL1655762T3 - Układ katodowy do rozpylania obrotowej rury targetowej - Google Patents

Układ katodowy do rozpylania obrotowej rury targetowej

Info

Publication number
PL1655762T3
PL1655762T3 PL05007131T PL05007131T PL1655762T3 PL 1655762 T3 PL1655762 T3 PL 1655762T3 PL 05007131 T PL05007131 T PL 05007131T PL 05007131 T PL05007131 T PL 05007131T PL 1655762 T3 PL1655762 T3 PL 1655762T3
Authority
PL
Poland
Prior art keywords
target
sputtering
shaft
cathode assembly
tubular target
Prior art date
Application number
PL05007131T
Other languages
English (en)
Other versions
PL1655762T5 (pl
Inventor
Richard Newcomb
Scott Trube
Tom Riso
Ken Kawakami
Dietmar Marquardt
Andreas Sauer
Original Assignee
Applied Mat Gmbh & Co Kg
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=35715682&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL1655762(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Applied Mat Gmbh & Co Kg, Applied Materials Inc filed Critical Applied Mat Gmbh & Co Kg
Publication of PL1655762T3 publication Critical patent/PL1655762T3/pl
Publication of PL1655762T5 publication Critical patent/PL1655762T5/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03H—PRODUCING A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03H1/00—Using plasma to produce a reactive propulsive thrust
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B35/00—Screw-bolts; Stay-bolts; Screw-threaded studs; Screws; Set screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/02—Permanent magnets [PM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Projection Apparatus (AREA)
  • Earth Drilling (AREA)
PL05007131T 2004-11-05 2005-03-31 Układ katodowy do rozpylania obrotowej rury targetowej PL1655762T5 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/983,179 US20060096855A1 (en) 2004-11-05 2004-11-05 Cathode arrangement for atomizing a rotatable target pipe
EP05007131A EP1655762B2 (de) 2004-11-05 2005-03-31 Katodenanordnung zur Zerstäubung eines drehbaren Targetrohres

Publications (2)

Publication Number Publication Date
PL1655762T3 true PL1655762T3 (pl) 2008-02-29
PL1655762T5 PL1655762T5 (pl) 2011-12-30

Family

ID=35715682

Family Applications (1)

Application Number Title Priority Date Filing Date
PL05007131T PL1655762T5 (pl) 2004-11-05 2005-03-31 Układ katodowy do rozpylania obrotowej rury targetowej

Country Status (11)

Country Link
US (1) US20060096855A1 (pl)
EP (1) EP1655762B2 (pl)
JP (1) JP4155983B2 (pl)
KR (1) KR100738870B1 (pl)
CN (1) CN100537834C (pl)
AT (1) ATE374434T1 (pl)
DE (1) DE502005001564D1 (pl)
ES (1) ES2294587T5 (pl)
PL (1) PL1655762T5 (pl)
PT (1) PT1655762E (pl)
TW (1) TWI289608B (pl)

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CN100564582C (zh) * 2006-09-19 2009-12-02 中国科学院合肥物质科学研究院 用于10-8Pa超高真空圆形平面磁控溅射靶的密封装置
CN101854770B (zh) * 2009-04-02 2012-05-09 烟台龙源电力技术股份有限公司 等离子发生器的进回水装置
DE102009033546B4 (de) * 2009-07-16 2014-07-17 Von Ardenne Anlagentechnik Gmbh Versorgungsendblock für ein rotierendes Magnetron
CN101834117B (zh) * 2010-01-29 2011-12-14 东莞宏威数码机械有限公司 腔门紧锁装置
CN102296273B (zh) * 2010-06-24 2013-06-05 上海子创镀膜技术有限公司 一种真空磁控溅射镀膜用旋转阴极驱动系统
CN102268647A (zh) * 2011-06-28 2011-12-07 黄峰 旋转靶用驱动端头装置
CN102230161B (zh) * 2011-06-28 2012-12-19 黄峰 用于旋转靶的水电端头连接装置
RU2471883C1 (ru) * 2011-11-23 2013-01-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" (ФГУП НПП "Исток") Устройство для вакуумного нанесения материала
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CN103533736B (zh) * 2013-10-21 2016-01-20 芜湖鼎瀚再制造技术有限公司 一种自动点火式等离子喷枪的回转导杆
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CN106702336B (zh) * 2015-11-16 2019-02-19 北京北方华创微电子装备有限公司 磁控管的安装机构及磁控溅射设备
CN105821388A (zh) * 2016-05-25 2016-08-03 东莞南玻工程玻璃有限公司 磁控溅射镀膜设备
CN105821389A (zh) * 2016-05-25 2016-08-03 东莞南玻工程玻璃有限公司 旋转靶驱动装置
CN105821390A (zh) * 2016-05-25 2016-08-03 东莞南玻工程玻璃有限公司 旋转靶六角轴机构
WO2020164685A1 (en) * 2019-02-12 2020-08-20 Applied Materials, Inc. Cathode drive unit, sputtering cathode and method for assembling a cathode drive unit
CN111719123B (zh) * 2019-03-21 2024-08-02 广东太微加速器有限公司 组合式靶件
CN110295351B (zh) * 2019-05-27 2024-02-27 东莞市汇成真空科技有限公司 一种通过翻转式靶门隔离靶体的镀膜机
JP7362431B2 (ja) * 2019-10-31 2023-10-17 キヤノントッキ株式会社 成膜装置、ターゲットユニットの取り外し方法、及びターゲットユニットの取り付け方法
CN111850499B (zh) * 2020-09-02 2024-10-29 光驰科技(上海)有限公司 内置式结构紧凑型旋转阴极装置
CN113699489B (zh) * 2021-07-23 2024-04-09 镇江市德利克真空设备科技有限公司 用于旋转阴极接头处的高密封性连接装置
CN116083854A (zh) * 2023-02-20 2023-05-09 圣思科技(廊坊)有限公司 一种能够快速实现靶材更换的旋转阴极

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Also Published As

Publication number Publication date
ES2294587T3 (es) 2008-04-01
EP1655762A1 (de) 2006-05-10
CN100537834C (zh) 2009-09-09
KR20060050479A (ko) 2006-05-19
ES2294587T5 (es) 2011-12-23
US20060096855A1 (en) 2006-05-11
JP4155983B2 (ja) 2008-09-24
ATE374434T1 (de) 2007-10-15
EP1655762B1 (de) 2007-09-26
CN1769515A (zh) 2006-05-10
KR100738870B1 (ko) 2007-07-12
EP1655762B2 (de) 2011-08-03
PL1655762T5 (pl) 2011-12-30
TWI289608B (en) 2007-11-11
JP2006131989A (ja) 2006-05-25
DE502005001564D1 (de) 2007-11-08
TW200615391A (en) 2006-05-16
PT1655762E (pt) 2007-12-10

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