PH12021553206A1 - Device and method for moving an object into a processing station, conveying system and processing apparatus - Google Patents
Device and method for moving an object into a processing station, conveying system and processing apparatusInfo
- Publication number
- PH12021553206A1 PH12021553206A1 PH1/2021/553206A PH12021553206A PH12021553206A1 PH 12021553206 A1 PH12021553206 A1 PH 12021553206A1 PH 12021553206 A PH12021553206 A PH 12021553206A PH 12021553206 A1 PH12021553206 A1 PH 12021553206A1
- Authority
- PH
- Philippines
- Prior art keywords
- moving
- movement
- processing apparatus
- carrier
- conveying system
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/15—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
- B05C3/12—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length
- B05C3/132—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length supported on conveying means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
- H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H10P72/0476—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3222—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3308—Vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Specific Conveyance Elements (AREA)
- General Factory Administration (AREA)
- Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
- Multi-Process Working Machines And Systems (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19182628.8A EP3758049B8 (en) | 2019-06-26 | 2019-06-26 | Device and method for moving an object into a processing station, conveying system and processing apparatus |
| PCT/EP2020/067697 WO2020260389A1 (en) | 2019-06-26 | 2020-06-24 | Device and method for moving an object into a processing station, conveying system and processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PH12021553206A1 true PH12021553206A1 (en) | 2022-11-07 |
Family
ID=67105738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH1/2021/553206A PH12021553206A1 (en) | 2019-06-26 | 2020-06-24 | Device and method for moving an object into a processing station, conveying system and processing apparatus |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US12205838B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3758049B8 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7539935B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102845027B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN114144870B (cg-RX-API-DMAC7.html) |
| PH (1) | PH12021553206A1 (cg-RX-API-DMAC7.html) |
| PT (1) | PT3758049T (cg-RX-API-DMAC7.html) |
| TW (1) | TWI811554B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2020260389A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4332277A1 (en) | 2022-08-29 | 2024-03-06 | Atotech Deutschland GmbH & Co. KG | Apparatus and method for non-immersive wet-chemical treatment of a planar substrate and device for holding the substrate |
| WO2024046871A1 (en) | 2022-08-29 | 2024-03-07 | Atotech Deutschland GmbH & Co. KG | Device and system for delivering a stream of liquid and apparatus and method for non-immersive wet-chemical treatment of a planar substrate |
| EP4679496A1 (en) | 2024-07-12 | 2026-01-14 | Atotech Deutschland GmbH & Co. KG | Apparatus and method for non-immersive wet-chemical treatment of a substrate and device for holding the substrate |
| EP4715086A1 (en) | 2024-09-23 | 2026-03-25 | Atotech Deutschland GmbH & Co. KG | Method and apparatus for non-immersive plating of a surface of a workpiece |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8531723D0 (en) * | 1985-12-24 | 1986-02-05 | Vg Instr Group | Wafer transfer apparatus |
| US6558750B2 (en) * | 2001-07-16 | 2003-05-06 | Technic Inc. | Method of processing and plating planar articles |
| US20030077396A1 (en) * | 2001-10-23 | 2003-04-24 | Lecompte Robert S. | Dip coating system |
| JP3827627B2 (ja) | 2002-08-13 | 2006-09-27 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| JP2007056350A (ja) | 2005-08-26 | 2007-03-08 | Akebono Brake Ind Co Ltd | メッキ装置 |
| JP2012195562A (ja) * | 2011-02-28 | 2012-10-11 | Hitachi Kokusai Electric Inc | 異径基板用アタッチメントおよび基板処理装置ならびに基板若しくは半導体デバイスの製造方法 |
| US9449862B2 (en) | 2011-06-03 | 2016-09-20 | Tel Nexx, Inc. | Parallel single substrate processing system |
| WO2014116681A2 (en) * | 2013-01-22 | 2014-07-31 | Brooks Automation, Inc. | Substrate transport |
| JP6077886B2 (ja) * | 2013-03-04 | 2017-02-08 | 株式会社荏原製作所 | めっき装置 |
| JP6018961B2 (ja) * | 2013-03-26 | 2016-11-02 | 株式会社荏原製作所 | めっき装置およびめっき方法 |
| JP6239417B2 (ja) * | 2014-03-24 | 2017-11-29 | 株式会社荏原製作所 | 基板処理装置 |
| EP3176288A1 (en) | 2015-12-03 | 2017-06-07 | ATOTECH Deutschland GmbH | Method for galvanic metal deposition |
| JP6865613B2 (ja) | 2017-03-28 | 2021-04-28 | 株式会社荏原製作所 | 基板搬送装置、基板搬送装置の制御装置、基板搬送装置における変位補償方法、当該方法を実施するプログラムおよび当該プログラムが記録された記録媒体 |
-
2019
- 2019-06-26 PT PT191826288T patent/PT3758049T/pt unknown
- 2019-06-26 EP EP19182628.8A patent/EP3758049B8/en active Active
-
2020
- 2020-06-24 JP JP2021577083A patent/JP7539935B2/ja active Active
- 2020-06-24 PH PH1/2021/553206A patent/PH12021553206A1/en unknown
- 2020-06-24 WO PCT/EP2020/067697 patent/WO2020260389A1/en not_active Ceased
- 2020-06-24 KR KR1020227001988A patent/KR102845027B1/ko active Active
- 2020-06-24 CN CN202080052801.6A patent/CN114144870B/zh active Active
- 2020-06-24 US US17/621,448 patent/US12205838B2/en active Active
- 2020-06-29 TW TW109121927A patent/TWI811554B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102845027B1 (ko) | 2025-08-11 |
| US12205838B2 (en) | 2025-01-21 |
| KR20220024771A (ko) | 2022-03-03 |
| JP7539935B2 (ja) | 2024-08-26 |
| WO2020260389A1 (en) | 2020-12-30 |
| EP3758049A1 (en) | 2020-12-30 |
| EP3758049B1 (en) | 2022-02-16 |
| US20220336243A1 (en) | 2022-10-20 |
| TWI811554B (zh) | 2023-08-11 |
| TW202117892A (zh) | 2021-05-01 |
| PT3758049T (pt) | 2022-03-21 |
| JP2022538161A (ja) | 2022-08-31 |
| CN114144870A (zh) | 2022-03-04 |
| EP3758049B8 (en) | 2022-03-23 |
| CN114144870B (zh) | 2025-08-15 |
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