PT3758049T - Dispositivo e método para mover um objeto para uma estação de processamento, sistema de transporte e aparelho de processamento - Google Patents
Dispositivo e método para mover um objeto para uma estação de processamento, sistema de transporte e aparelho de processamentoInfo
- Publication number
- PT3758049T PT3758049T PT191826288T PT19182628T PT3758049T PT 3758049 T PT3758049 T PT 3758049T PT 191826288 T PT191826288 T PT 191826288T PT 19182628 T PT19182628 T PT 19182628T PT 3758049 T PT3758049 T PT 3758049T
- Authority
- PT
- Portugal
- Prior art keywords
- moving
- conveying system
- processing apparatus
- processing
- processing station
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/15—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
- B05C3/12—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length
- B05C3/132—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length supported on conveying means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
- H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H10P72/0476—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3222—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3308—Vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19182628.8A EP3758049B8 (en) | 2019-06-26 | 2019-06-26 | Device and method for moving an object into a processing station, conveying system and processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT3758049T true PT3758049T (pt) | 2022-03-21 |
Family
ID=67105738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT191826288T PT3758049T (pt) | 2019-06-26 | 2019-06-26 | Dispositivo e método para mover um objeto para uma estação de processamento, sistema de transporte e aparelho de processamento |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US12205838B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3758049B8 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7539935B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102845027B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN114144870B (cg-RX-API-DMAC7.html) |
| PH (1) | PH12021553206A1 (cg-RX-API-DMAC7.html) |
| PT (1) | PT3758049T (cg-RX-API-DMAC7.html) |
| TW (1) | TWI811554B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2020260389A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4332277A1 (en) | 2022-08-29 | 2024-03-06 | Atotech Deutschland GmbH & Co. KG | Apparatus and method for non-immersive wet-chemical treatment of a planar substrate and device for holding the substrate |
| WO2024046871A1 (en) | 2022-08-29 | 2024-03-07 | Atotech Deutschland GmbH & Co. KG | Device and system for delivering a stream of liquid and apparatus and method for non-immersive wet-chemical treatment of a planar substrate |
| EP4679496A1 (en) | 2024-07-12 | 2026-01-14 | Atotech Deutschland GmbH & Co. KG | Apparatus and method for non-immersive wet-chemical treatment of a substrate and device for holding the substrate |
| EP4715086A1 (en) | 2024-09-23 | 2026-03-25 | Atotech Deutschland GmbH & Co. KG | Method and apparatus for non-immersive plating of a surface of a workpiece |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8531723D0 (en) * | 1985-12-24 | 1986-02-05 | Vg Instr Group | Wafer transfer apparatus |
| US6558750B2 (en) * | 2001-07-16 | 2003-05-06 | Technic Inc. | Method of processing and plating planar articles |
| US20030077396A1 (en) * | 2001-10-23 | 2003-04-24 | Lecompte Robert S. | Dip coating system |
| JP3827627B2 (ja) | 2002-08-13 | 2006-09-27 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| JP2007056350A (ja) | 2005-08-26 | 2007-03-08 | Akebono Brake Ind Co Ltd | メッキ装置 |
| JP2012195562A (ja) * | 2011-02-28 | 2012-10-11 | Hitachi Kokusai Electric Inc | 異径基板用アタッチメントおよび基板処理装置ならびに基板若しくは半導体デバイスの製造方法 |
| US9449862B2 (en) | 2011-06-03 | 2016-09-20 | Tel Nexx, Inc. | Parallel single substrate processing system |
| WO2014116681A2 (en) * | 2013-01-22 | 2014-07-31 | Brooks Automation, Inc. | Substrate transport |
| JP6077886B2 (ja) * | 2013-03-04 | 2017-02-08 | 株式会社荏原製作所 | めっき装置 |
| JP6018961B2 (ja) * | 2013-03-26 | 2016-11-02 | 株式会社荏原製作所 | めっき装置およびめっき方法 |
| JP6239417B2 (ja) * | 2014-03-24 | 2017-11-29 | 株式会社荏原製作所 | 基板処理装置 |
| EP3176288A1 (en) | 2015-12-03 | 2017-06-07 | ATOTECH Deutschland GmbH | Method for galvanic metal deposition |
| JP6865613B2 (ja) | 2017-03-28 | 2021-04-28 | 株式会社荏原製作所 | 基板搬送装置、基板搬送装置の制御装置、基板搬送装置における変位補償方法、当該方法を実施するプログラムおよび当該プログラムが記録された記録媒体 |
-
2019
- 2019-06-26 PT PT191826288T patent/PT3758049T/pt unknown
- 2019-06-26 EP EP19182628.8A patent/EP3758049B8/en active Active
-
2020
- 2020-06-24 JP JP2021577083A patent/JP7539935B2/ja active Active
- 2020-06-24 PH PH1/2021/553206A patent/PH12021553206A1/en unknown
- 2020-06-24 WO PCT/EP2020/067697 patent/WO2020260389A1/en not_active Ceased
- 2020-06-24 KR KR1020227001988A patent/KR102845027B1/ko active Active
- 2020-06-24 CN CN202080052801.6A patent/CN114144870B/zh active Active
- 2020-06-24 US US17/621,448 patent/US12205838B2/en active Active
- 2020-06-29 TW TW109121927A patent/TWI811554B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102845027B1 (ko) | 2025-08-11 |
| US12205838B2 (en) | 2025-01-21 |
| KR20220024771A (ko) | 2022-03-03 |
| JP7539935B2 (ja) | 2024-08-26 |
| WO2020260389A1 (en) | 2020-12-30 |
| EP3758049A1 (en) | 2020-12-30 |
| EP3758049B1 (en) | 2022-02-16 |
| US20220336243A1 (en) | 2022-10-20 |
| TWI811554B (zh) | 2023-08-11 |
| TW202117892A (zh) | 2021-05-01 |
| JP2022538161A (ja) | 2022-08-31 |
| CN114144870A (zh) | 2022-03-04 |
| EP3758049B8 (en) | 2022-03-23 |
| PH12021553206A1 (en) | 2022-11-07 |
| CN114144870B (zh) | 2025-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11202010000VA (en) | Task processing method, apparatus, and system | |
| PT3758049T (pt) | Dispositivo e método para mover um objeto para uma estação de processamento, sistema de transporte e aparelho de processamento | |
| IL259252B (en) | Device, system and method for docking a flying device | |
| EP4216507A4 (en) | SERVICE PROCESSING METHOD AND APPARATUS, APPARATUS AND SYSTEM | |
| HUE063582T2 (hu) | Szállítójármû, megmunkálóberendezés, eljárás tárgyak szállítására és/vagy megmunkálására | |
| SG10201913005YA (en) | Method, apparatus, and system for recognizing target object | |
| EP4135338A4 (en) | SERVICE PROCESSING METHOD, APPARATUS AND APPARATUS | |
| EP3896013A4 (en) | POSITION INFORMATION PROCESSING DEVICE FOR CONVEYOR BELT, CONVEYOR BELT TYPE DEVICE, POSITION INFORMATION PROCESSING METHOD FOR CONVEYOR BELT, CONVEYOR BELT AND POSITION INFORMATION PROCESSING DEVICE | |
| GB201807800D0 (en) | A pipe inspection apparatus, system and method | |
| SG11202010933UA (en) | Service processing method and apparatus, and electronic device | |
| PL3814025T3 (pl) | Układ do i sposób sortowania materiału na przenośniku | |
| SG11202010605PA (en) | Data processing method, apparatus, and device | |
| GB2602604B (en) | Method, system and apparatus for mobile dimensioning | |
| HUE066067T2 (hu) | Termékek szállítására szolgáló berendezés és eljárás | |
| GB202213223D0 (en) | Information processing apparatus, information processing system, and method for information processing apparatus | |
| GB2586405B (en) | Method, system and apparatus for mobile automation apparatus localization | |
| GB201905138D0 (en) | Apparatus and method for processing a substrate | |
| SG11202006073PA (en) | Service data processing method, apparatus, and electronic device | |
| GB202101485D0 (en) | Apparatus, system and method | |
| GB201916272D0 (en) | Data processing apparatus, control device and method | |
| GB202317895D0 (en) | Apparatus, systems and method for image processing | |
| PL4065453T3 (pl) | Urządzenie transportowe, instalacja do obróbki, sposób transportowania i/lub obróbki przedmiotów | |
| SG11202102542QA (en) | Information processing apparatus, information processing system, and information processing method | |
| PT3761348T (pt) | Sistema para transportar um substrato entre estações de processamento de um aparelho de processamento, aparelho de processamento e métodos de manusear um substrato | |
| GB2618777B (en) | Apparatus, systems and methods for processing images |