CN114144870B - 将物品移动到处理站的装置和方法、输送系统和处理设备 - Google Patents

将物品移动到处理站的装置和方法、输送系统和处理设备

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Publication number
CN114144870B
CN114144870B CN202080052801.6A CN202080052801A CN114144870B CN 114144870 B CN114144870 B CN 114144870B CN 202080052801 A CN202080052801 A CN 202080052801A CN 114144870 B CN114144870 B CN 114144870B
Authority
CN
China
Prior art keywords
carrier
movement
holding assembly
substrate
reference axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080052801.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN114144870A (zh
Inventor
R·普雷切尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of CN114144870A publication Critical patent/CN114144870A/zh
Application granted granted Critical
Publication of CN114144870B publication Critical patent/CN114144870B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/15—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/12—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length
    • B05C3/132—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length supported on conveying means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0476—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Specific Conveyance Elements (AREA)
  • General Factory Administration (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
  • Multi-Process Working Machines And Systems (AREA)
CN202080052801.6A 2019-06-26 2020-06-24 将物品移动到处理站的装置和方法、输送系统和处理设备 Active CN114144870B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP19182628.8A EP3758049B8 (en) 2019-06-26 2019-06-26 Device and method for moving an object into a processing station, conveying system and processing apparatus
EP19182628.8 2019-06-26
PCT/EP2020/067697 WO2020260389A1 (en) 2019-06-26 2020-06-24 Device and method for moving an object into a processing station, conveying system and processing apparatus

Publications (2)

Publication Number Publication Date
CN114144870A CN114144870A (zh) 2022-03-04
CN114144870B true CN114144870B (zh) 2025-08-15

Family

ID=67105738

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080052801.6A Active CN114144870B (zh) 2019-06-26 2020-06-24 将物品移动到处理站的装置和方法、输送系统和处理设备

Country Status (9)

Country Link
US (1) US12205838B2 (cg-RX-API-DMAC7.html)
EP (1) EP3758049B8 (cg-RX-API-DMAC7.html)
JP (1) JP7539935B2 (cg-RX-API-DMAC7.html)
KR (1) KR102845027B1 (cg-RX-API-DMAC7.html)
CN (1) CN114144870B (cg-RX-API-DMAC7.html)
PH (1) PH12021553206A1 (cg-RX-API-DMAC7.html)
PT (1) PT3758049T (cg-RX-API-DMAC7.html)
TW (1) TWI811554B (cg-RX-API-DMAC7.html)
WO (1) WO2020260389A1 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4332277A1 (en) 2022-08-29 2024-03-06 Atotech Deutschland GmbH & Co. KG Apparatus and method for non-immersive wet-chemical treatment of a planar substrate and device for holding the substrate
WO2024046871A1 (en) 2022-08-29 2024-03-07 Atotech Deutschland GmbH & Co. KG Device and system for delivering a stream of liquid and apparatus and method for non-immersive wet-chemical treatment of a planar substrate
EP4679496A1 (en) 2024-07-12 2026-01-14 Atotech Deutschland GmbH & Co. KG Apparatus and method for non-immersive wet-chemical treatment of a substrate and device for holding the substrate
EP4715086A1 (en) 2024-09-23 2026-03-25 Atotech Deutschland GmbH & Co. KG Method and apparatus for non-immersive plating of a surface of a workpiece

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014189806A (ja) * 2013-03-26 2014-10-06 Ebara Corp めっき装置およびめっき方法

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
GB8531723D0 (en) * 1985-12-24 1986-02-05 Vg Instr Group Wafer transfer apparatus
US6558750B2 (en) * 2001-07-16 2003-05-06 Technic Inc. Method of processing and plating planar articles
US20030077396A1 (en) * 2001-10-23 2003-04-24 Lecompte Robert S. Dip coating system
JP3827627B2 (ja) 2002-08-13 2006-09-27 株式会社荏原製作所 めっき装置及びめっき方法
JP2007056350A (ja) 2005-08-26 2007-03-08 Akebono Brake Ind Co Ltd メッキ装置
JP2012195562A (ja) * 2011-02-28 2012-10-11 Hitachi Kokusai Electric Inc 異径基板用アタッチメントおよび基板処理装置ならびに基板若しくは半導体デバイスの製造方法
US9449862B2 (en) 2011-06-03 2016-09-20 Tel Nexx, Inc. Parallel single substrate processing system
WO2014116681A2 (en) * 2013-01-22 2014-07-31 Brooks Automation, Inc. Substrate transport
JP6077886B2 (ja) * 2013-03-04 2017-02-08 株式会社荏原製作所 めっき装置
JP6239417B2 (ja) * 2014-03-24 2017-11-29 株式会社荏原製作所 基板処理装置
EP3176288A1 (en) 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition
JP6865613B2 (ja) 2017-03-28 2021-04-28 株式会社荏原製作所 基板搬送装置、基板搬送装置の制御装置、基板搬送装置における変位補償方法、当該方法を実施するプログラムおよび当該プログラムが記録された記録媒体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014189806A (ja) * 2013-03-26 2014-10-06 Ebara Corp めっき装置およびめっき方法

Also Published As

Publication number Publication date
KR102845027B1 (ko) 2025-08-11
US12205838B2 (en) 2025-01-21
KR20220024771A (ko) 2022-03-03
JP7539935B2 (ja) 2024-08-26
WO2020260389A1 (en) 2020-12-30
EP3758049A1 (en) 2020-12-30
EP3758049B1 (en) 2022-02-16
US20220336243A1 (en) 2022-10-20
TWI811554B (zh) 2023-08-11
TW202117892A (zh) 2021-05-01
PT3758049T (pt) 2022-03-21
JP2022538161A (ja) 2022-08-31
CN114144870A (zh) 2022-03-04
EP3758049B8 (en) 2022-03-23
PH12021553206A1 (en) 2022-11-07

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