NO993048L - Halvlederelement - Google Patents
HalvlederelementInfo
- Publication number
- NO993048L NO993048L NO993048A NO993048A NO993048L NO 993048 L NO993048 L NO 993048L NO 993048 A NO993048 A NO 993048A NO 993048 A NO993048 A NO 993048A NO 993048 L NO993048 L NO 993048L
- Authority
- NO
- Norway
- Prior art keywords
- semiconductor element
- semiconductor
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/12—Bridge initiators
- F42B3/13—Bridge initiators with semiconductive bridge
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/195—Manufacture
- F42B3/198—Manufacture of electric initiator heads e.g., testing, machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Pressure Sensors (AREA)
- Bridges Or Land Bridges (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/771,536 US6054760A (en) | 1996-12-23 | 1996-12-23 | Surface-connectable semiconductor bridge elements and devices including the same |
PCT/US1997/022426 WO1998028792A1 (en) | 1996-12-23 | 1997-12-03 | Surface connectable semiconductor bridge elements, devices and methods |
Publications (2)
Publication Number | Publication Date |
---|---|
NO993048D0 NO993048D0 (no) | 1999-06-21 |
NO993048L true NO993048L (no) | 1999-08-23 |
Family
ID=25092149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO993048A NO993048L (no) | 1996-12-23 | 1999-06-21 | Halvlederelement |
Country Status (9)
Country | Link |
---|---|
US (1) | US6054760A (no) |
EP (1) | EP0948812B1 (no) |
JP (1) | JP4326027B2 (no) |
AU (1) | AU717944B2 (no) |
BR (1) | BR9714516A (no) |
CA (1) | CA2274167A1 (no) |
DE (1) | DE69732650T2 (no) |
NO (1) | NO993048L (no) |
WO (1) | WO1998028792A1 (no) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6271060B1 (en) * | 1999-09-13 | 2001-08-07 | Vishay Intertechnology, Inc. | Process of fabricating a chip scale surface mount package for semiconductor device |
KR100462980B1 (ko) * | 1999-09-13 | 2004-12-23 | 비쉐이 메저먼츠 그룹, 인코포레이티드 | 반도체장치용 칩 스케일 표면 장착 패키지 및 그 제조공정 |
US7211877B1 (en) | 1999-09-13 | 2007-05-01 | Vishay-Siliconix | Chip scale surface mount package for semiconductor device and process of fabricating the same |
JP2001199787A (ja) * | 2000-01-12 | 2001-07-24 | Asahi Kasei Corp | 起爆装置ならびに起爆方法 |
FR2807157B1 (fr) * | 2000-04-04 | 2003-01-31 | Vishay Sa | Element resistif pour initiateur pyrotechnique |
US6772692B2 (en) * | 2000-05-24 | 2004-08-10 | Lifesparc, Inc. | Electro-explosive device with laminate bridge |
FR2809806B1 (fr) | 2000-05-30 | 2003-01-10 | Livbag Snc | Initiateur electro-pyrotechnique a pont en couche mince et a tres basse energie de fonctionnement |
SG139508A1 (en) * | 2001-09-10 | 2008-02-29 | Micron Technology Inc | Wafer dicing device and method |
SG102639A1 (en) * | 2001-10-08 | 2004-03-26 | Micron Technology Inc | Apparatus and method for packing circuits |
TW504815B (en) * | 2001-11-16 | 2002-10-01 | Advanced Semiconductor Eng | Packaging mold device with ESD protection |
US7204425B2 (en) * | 2002-03-18 | 2007-04-17 | Precision Dynamics Corporation | Enhanced identification appliance |
TWI232560B (en) | 2002-04-23 | 2005-05-11 | Sanyo Electric Co | Semiconductor device and its manufacture |
SG142115A1 (en) | 2002-06-14 | 2008-05-28 | Micron Technology Inc | Wafer level packaging |
TWI229435B (en) | 2002-06-18 | 2005-03-11 | Sanyo Electric Co | Manufacture of semiconductor device |
TWI227550B (en) * | 2002-10-30 | 2005-02-01 | Sanyo Electric Co | Semiconductor device manufacturing method |
TWI229890B (en) * | 2003-04-24 | 2005-03-21 | Sanyo Electric Co | Semiconductor device and method of manufacturing same |
SG119185A1 (en) | 2003-05-06 | 2006-02-28 | Micron Technology Inc | Method for packaging circuits and packaged circuits |
FR2857738B1 (fr) | 2003-07-17 | 2006-01-20 | Giat Ind Sa | Composant pyrotechnique et procede de fabrication et de montage d'un tel composant |
JP4401181B2 (ja) | 2003-08-06 | 2010-01-20 | 三洋電機株式会社 | 半導体装置及びその製造方法 |
FR2875594B1 (fr) * | 2004-09-21 | 2007-03-16 | Ncs Pyrotechnie & Tech | Initiateur electro-pyrotechnique |
ATE520003T1 (de) * | 2004-10-04 | 2011-08-15 | Nippon Kayaku Kk | Halbleiterbrückenschaltungsvorrichtung und diese enthaltende zündvorrichtung |
JP2006138510A (ja) * | 2004-11-10 | 2006-06-01 | Nippon Kayaku Co Ltd | 無起爆薬電気雷管 |
TWI324800B (en) * | 2005-12-28 | 2010-05-11 | Sanyo Electric Co | Method for manufacturing semiconductor device |
KR100745399B1 (ko) * | 2006-07-14 | 2007-08-02 | 삼성전자주식회사 | 라디칼 산화 공정을 이용한 반도체 장치의 제조 방법 |
US7719096B2 (en) * | 2006-08-11 | 2010-05-18 | Vishay General Semiconductor Llc | Semiconductor device and method for manufacturing a semiconductor device |
JP4653718B2 (ja) * | 2006-10-26 | 2011-03-16 | 日本化薬株式会社 | スクイブならびにエアバッグ用ガス発生装置およびシートベルトプリテンショナー用ガス発生装置 |
JP4705550B2 (ja) | 2006-10-26 | 2011-06-22 | 日本化薬株式会社 | スクイブならびにエアバッグ用ガス発生装置およびシートベルトプリテンショナー用ガス発生装置 |
US8080862B2 (en) | 2008-09-09 | 2011-12-20 | Qualcomm Incorporate | Systems and methods for enabling ESD protection on 3-D stacked devices |
US8399995B2 (en) * | 2009-01-16 | 2013-03-19 | Infineon Technologies Ag | Semiconductor device including single circuit element for soldering |
US20100207227A1 (en) * | 2009-02-16 | 2010-08-19 | Georg Meyer-Berg | Electronic Device and Method of Manufacturing Same |
US9134100B2 (en) * | 2009-04-13 | 2015-09-15 | Ensign-Bickford Aerospace & Defense Company | Surface mountable semiconductor bridge die |
US20110089557A1 (en) * | 2009-10-19 | 2011-04-21 | Jeng-Jye Shau | Area reduction for die-scale surface mount package chips |
US9568288B2 (en) * | 2014-02-05 | 2017-02-14 | Battelle Memorial Institute | Surface mount exploding foil initiator |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE556596A (no) * | 1956-04-30 | |||
US3196041A (en) * | 1960-11-25 | 1965-07-20 | Gen Lab Associates Inc | Method of making a semiconductor gap for an initiator |
US3292537A (en) * | 1965-06-15 | 1966-12-20 | Jr Frank A Goss | Multi-signal explosive detonator |
US3366055A (en) * | 1966-11-15 | 1968-01-30 | Green Mansions Inc | Semiconductive explosive igniter |
DE2020016C3 (de) * | 1970-04-24 | 1974-12-12 | Dynamit Nobel Ag, 5210 Troisdorf | Metallschichtzündmittel |
US4044222A (en) * | 1976-01-16 | 1977-08-23 | Western Electric Company, Inc. | Method of forming tapered apertures in thin films with an energy beam |
US4381692A (en) * | 1977-05-11 | 1983-05-03 | Quantic Industries, Inc. | Method of making an incendiary munition |
DE2747163A1 (de) * | 1977-10-20 | 1979-04-26 | Dynamit Nobel Ag | Elektrisches anzuendelement |
US4405933A (en) * | 1981-02-04 | 1983-09-20 | Rca Corporation | Protective integrated circuit device utilizing back-to-back zener diodes |
US4559875A (en) * | 1984-03-19 | 1985-12-24 | Quantic Industries, Inc. | High energy switching circuit for initiator means or the like and method therefor |
IT8454108V0 (it) * | 1984-12-04 | 1984-12-04 | Riv Officine Di Villar Perosa | Punteria idraulica a tenuta stagna per il comando del moto di una valvola di un motore endotermico |
US4708060A (en) * | 1985-02-19 | 1987-11-24 | The United States Of America As Represented By The United States Department Of Energy | Semiconductor bridge (SCB) igniter |
US4700263A (en) * | 1985-10-01 | 1987-10-13 | Quantic Industries, Inc. | Safe-arm system with electrical charge transfer circuit |
US4649821A (en) * | 1986-01-03 | 1987-03-17 | Quantic Industries, Inc. | Electrical circuit continuity test apparatus for firing unit |
US4729315A (en) * | 1986-12-17 | 1988-03-08 | Quantic Industries, Inc. | Thin film bridge initiator and method therefor |
US4843964A (en) * | 1988-02-01 | 1989-07-04 | The United States Of America As Represented By The United States Department Of Energy | Smart explosive igniter |
US4976200A (en) * | 1988-12-30 | 1990-12-11 | The United States Of America As Represented By The United States Department Of Energy | Tungsten bridge for the low energy ignition of explosive and energetic materials |
US4978639A (en) * | 1989-01-10 | 1990-12-18 | Avantek, Inc. | Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips |
US4934804A (en) * | 1989-01-13 | 1990-06-19 | Whittaker Ordnance, Inc. | Focusing optical explosive initiator and initiator window |
US4930418A (en) * | 1989-06-23 | 1990-06-05 | Whittaker Ordnance, Inc. | Method for sealing optical windows in explosive initiators |
US5029529A (en) * | 1989-09-25 | 1991-07-09 | Olin Corporation | Semiconductor bridge (SCB) packaging system |
US5113764A (en) * | 1989-09-25 | 1992-05-19 | Olin Corporation | Semiconductor bridge (SCB) packaging system |
US5010822A (en) * | 1990-02-02 | 1991-04-30 | Whittaker Ordnance, Inc. | Explosive initiator with angled fiber optic input |
US5036767A (en) * | 1990-07-02 | 1991-08-06 | Whittaker Ordnance, Inc. | Optical window for laser-initiated explosive devices |
US5148265A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
US5080016A (en) * | 1991-03-20 | 1992-01-14 | The United States Of America As Represented By The Department Of Energy | Hydrogen loaded metal for bridge-foils for enhanced electric gun/slapper detonator operation |
US5206455A (en) * | 1991-03-28 | 1993-04-27 | Quantic Industries, Inc. | Laser initiated ordnance systems |
US5230287A (en) * | 1991-04-16 | 1993-07-27 | Thiokol Corporation | Low cost hermetically sealed squib |
DE4229624C2 (de) * | 1991-09-05 | 2000-12-07 | Trw Inc | Aufblasvorrichtung für eine Fahrzeuginsassen-Rückhaltevorrichtung |
US5255277A (en) * | 1991-09-30 | 1993-10-19 | Whittaker Ordnance, Inc. | Electronic pulse width controller for flashlamp pumped lasers |
US5309841A (en) * | 1991-10-08 | 1994-05-10 | Scb Technologies, Inc. | Zener diode for protection of integrated circuit explosive bridge |
US5179248A (en) * | 1991-10-08 | 1993-01-12 | Scb Technologies, Inc. | Zener diode for protection of semiconductor explosive bridge |
US5334306A (en) * | 1991-12-11 | 1994-08-02 | At&T Bell Laboratories | Metallized paths on diamond surfaces |
US5173958A (en) * | 1992-01-17 | 1992-12-22 | Whittaker Ordnance, Inc. | Beam distributor for laser-to-optical fiber application |
US5285727A (en) * | 1992-04-02 | 1994-02-15 | The United States Of America As Represented By The Secretary Of The Army | Semiconductor ignitor |
US5327834A (en) * | 1992-05-28 | 1994-07-12 | Thiokol Corporation | Integrated field-effect initiator |
US5359192A (en) * | 1992-06-10 | 1994-10-25 | Quantic Industries Inc. | Dual-wavelength low-power built-in-test for a laser-initiated ordnance system |
US5243492A (en) * | 1992-08-27 | 1993-09-07 | Coors Ceramics Company | Process for fabricating a hermetic coaxial feedthrough |
US5454320A (en) * | 1992-10-23 | 1995-10-03 | Quantic Industries, Inc. | Air bag initiator |
US5294567A (en) * | 1993-01-08 | 1994-03-15 | E. I. Du Pont De Nemours And Company | Method for forming via holes in multilayer circuits |
ATE187551T1 (de) * | 1993-02-26 | 1999-12-15 | Quantic Ind Inc | Verbesserter halbleiter-brückenzünder |
JP3152834B2 (ja) * | 1993-06-24 | 2001-04-03 | 株式会社東芝 | 電子回路装置 |
US5385097A (en) * | 1993-07-16 | 1995-01-31 | At&T Corp. | Electroexplosive device |
US5473623A (en) * | 1993-12-17 | 1995-12-05 | Quantic Industries, Inc. | Laser diode driver circuit |
US5500546A (en) * | 1994-09-16 | 1996-03-19 | Texas Instruments Incorporated | ESD protection circuits using Zener diodes |
-
1996
- 1996-12-23 US US08/771,536 patent/US6054760A/en not_active Expired - Fee Related
-
1997
- 1997-12-03 WO PCT/US1997/022426 patent/WO1998028792A1/en active IP Right Grant
- 1997-12-03 JP JP52879098A patent/JP4326027B2/ja not_active Expired - Fee Related
- 1997-12-03 CA CA002274167A patent/CA2274167A1/en not_active Abandoned
- 1997-12-03 DE DE69732650T patent/DE69732650T2/de not_active Expired - Fee Related
- 1997-12-03 EP EP97950874A patent/EP0948812B1/en not_active Expired - Lifetime
- 1997-12-03 BR BR9714516-5A patent/BR9714516A/pt not_active Application Discontinuation
- 1997-12-03 AU AU53764/98A patent/AU717944B2/en not_active Expired
-
1999
- 1999-06-21 NO NO993048A patent/NO993048L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DE69732650D1 (de) | 2005-04-07 |
EP0948812A4 (en) | 2000-11-15 |
BR9714516A (pt) | 2001-11-20 |
DE69732650T2 (de) | 2005-07-21 |
EP0948812A1 (en) | 1999-10-13 |
JP2001508941A (ja) | 2001-07-03 |
AU717944B2 (en) | 2000-04-06 |
NO993048D0 (no) | 1999-06-21 |
US6054760A (en) | 2000-04-25 |
CA2274167A1 (en) | 1998-07-02 |
WO1998028792A1 (en) | 1998-07-02 |
EP0948812B1 (en) | 2005-03-02 |
JP4326027B2 (ja) | 2009-09-02 |
AU5376498A (en) | 1998-07-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application | ||
FC2A | Withdrawal, rejection or dismissal of laid open patent application | ||
FC2A | Withdrawal, rejection or dismissal of laid open patent application |