NO970777L - Koblingsanordning som representerer og/eller dominerer en kapasitans ved et kort med trykte kretser - Google Patents
Koblingsanordning som representerer og/eller dominerer en kapasitans ved et kort med trykte kretserInfo
- Publication number
- NO970777L NO970777L NO970777A NO970777A NO970777L NO 970777 L NO970777 L NO 970777L NO 970777 A NO970777 A NO 970777A NO 970777 A NO970777 A NO 970777A NO 970777 L NO970777 L NO 970777L
- Authority
- NO
- Norway
- Prior art keywords
- layers
- printed circuit
- voltage
- layer
- specified
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 claims description 47
- 239000004020 conductor Substances 0.000 claims description 34
- 230000004913 activation Effects 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 9
- 238000009499 grossing Methods 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 claims 1
- 238000001994 activation Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- 230000001939 inductive effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/14—Arrangements for reducing ripples from dc input or output
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0262—Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Logic Circuits (AREA)
- Polysaccharides And Polysaccharide Derivatives (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9402792A SE503166C2 (sv) | 1994-08-22 | 1994-08-22 | Kapacitansuppvisande mönsterkortstillhörigt kopplingsarrangemang |
| PCT/SE1995/000892 WO1996006389A1 (en) | 1994-08-22 | 1995-07-31 | A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NO970777D0 NO970777D0 (no) | 1997-02-20 |
| NO970777L true NO970777L (no) | 1997-04-21 |
Family
ID=20394981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO970777A NO970777L (no) | 1994-08-22 | 1997-02-20 | Koblingsanordning som representerer og/eller dominerer en kapasitans ved et kort med trykte kretser |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US5815373A (sv) |
| EP (1) | EP0777873B1 (sv) |
| KR (1) | KR100217514B1 (sv) |
| AU (1) | AU698863B2 (sv) |
| CA (1) | CA2190458A1 (sv) |
| DE (1) | DE69516879T2 (sv) |
| ES (1) | ES2146768T3 (sv) |
| FI (1) | FI970321A (sv) |
| NO (1) | NO970777L (sv) |
| SE (1) | SE503166C2 (sv) |
| WO (1) | WO1996006389A1 (sv) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
| US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| JP3610221B2 (ja) * | 1998-01-27 | 2005-01-12 | キヤノン株式会社 | 多層プリント配線基板 |
| US6014319A (en) * | 1998-05-21 | 2000-01-11 | International Business Machines Corporation | Multi-part concurrently maintainable electronic circuit card assembly |
| US20060179305A1 (en) * | 2004-03-11 | 2006-08-10 | Junbiao Zhang | WLAN session management techniques with secure rekeying and logoff |
| GB2439862A (en) | 2005-03-01 | 2008-01-09 | X2Y Attenuators Llc | Conditioner with coplanar conductors |
| US8025634B1 (en) * | 2006-09-18 | 2011-09-27 | Baxter International Inc. | Method and system for controlled infusion of therapeutic substances |
| CN109496057A (zh) * | 2018-11-12 | 2019-03-19 | 晶晨半导体(上海)股份有限公司 | 一种印制电路板布局 |
| FR3089341B1 (fr) * | 2018-12-03 | 2022-04-22 | Psa Automobiles Sa | Dispositif de couplage à pièces assurant un couplage entre une liaison électrique et un élément conducteur |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4441070A (en) * | 1982-02-26 | 1984-04-03 | Motorola, Inc. | Voltage regulator circuit with supply voltage ripple rejection to transient spikes |
| DE3242023A1 (de) * | 1982-11-12 | 1984-05-17 | Siemens AG, 1000 Berlin und 8000 München | Schaltungsanordnung zur speisung von elektrischen verbrauchern mit einer gleichspannung |
| US5065284A (en) * | 1988-08-01 | 1991-11-12 | Rogers Corporation | Multilayer printed wiring board |
| US5010641A (en) * | 1989-06-30 | 1991-04-30 | Unisys Corp. | Method of making multilayer printed circuit board |
| US5161086A (en) * | 1989-08-23 | 1992-11-03 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| US5079069A (en) * | 1989-08-23 | 1992-01-07 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| JPH03258101A (ja) * | 1990-03-08 | 1991-11-18 | Nec Corp | 回路基板 |
| US5198969A (en) * | 1990-07-13 | 1993-03-30 | Design Automation, Inc. | Soft-switching full-bridge dc/dc converting |
| US5162977A (en) * | 1991-08-27 | 1992-11-10 | Storage Technology Corporation | Printed circuit board having an integrated decoupling capacitive element |
| JPH05219729A (ja) * | 1992-02-07 | 1993-08-27 | Sony Corp | 直流電源装置 |
-
1994
- 1994-08-22 SE SE9402792A patent/SE503166C2/sv not_active IP Right Cessation
-
1995
- 1995-07-31 CA CA002190458A patent/CA2190458A1/en not_active Abandoned
- 1995-07-31 EP EP95930072A patent/EP0777873B1/en not_active Expired - Lifetime
- 1995-07-31 ES ES95930072T patent/ES2146768T3/es not_active Expired - Lifetime
- 1995-07-31 US US08/776,765 patent/US5815373A/en not_active Expired - Lifetime
- 1995-07-31 KR KR1019970701149A patent/KR100217514B1/ko not_active IP Right Cessation
- 1995-07-31 WO PCT/SE1995/000892 patent/WO1996006389A1/en active IP Right Grant
- 1995-07-31 DE DE69516879T patent/DE69516879T2/de not_active Expired - Fee Related
- 1995-07-31 AU AU33576/95A patent/AU698863B2/en not_active Ceased
-
1997
- 1997-01-24 FI FI970321A patent/FI970321A/sv unknown
- 1997-02-20 NO NO970777A patent/NO970777L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| CA2190458A1 (en) | 1996-02-29 |
| US5815373A (en) | 1998-09-29 |
| ES2146768T3 (es) | 2000-08-16 |
| FI970321A0 (sv) | 1997-01-24 |
| FI970321A (sv) | 1997-01-24 |
| DE69516879T2 (de) | 2000-11-09 |
| EP0777873B1 (en) | 2000-05-10 |
| DE69516879D1 (de) | 2000-06-15 |
| WO1996006389A1 (en) | 1996-02-29 |
| SE503166C2 (sv) | 1996-04-15 |
| NO970777D0 (no) | 1997-02-20 |
| KR100217514B1 (ko) | 1999-09-01 |
| SE9402792L (sv) | 1996-02-23 |
| AU698863B2 (en) | 1998-11-12 |
| AU3357695A (en) | 1996-03-14 |
| EP0777873A1 (en) | 1997-06-11 |
| SE9402792D0 (sv) | 1994-08-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6191479B1 (en) | Decoupling capacitor configuration for integrated circuit chip | |
| US7495459B2 (en) | Probe card assembly with a dielectric strip structure coupled to a side of at least a portion of the probes | |
| US7504922B2 (en) | Embedded inductor element and chip package applying the same | |
| NO970777L (no) | Koblingsanordning som representerer og/eller dominerer en kapasitans ved et kort med trykte kretser | |
| JP2001168234A (ja) | 半導体チップ用の接地平面 | |
| US6246013B1 (en) | Surface mounting structure and surface mount type electronic component included therein | |
| JPH1032413A (ja) | 表面実装型アンテナ | |
| KR100376482B1 (ko) | 캐패시터 내장형 인쇄회로기판 제조방법 | |
| KR20030003784A (ko) | 칩 안테나 | |
| US4344049A (en) | Surface wave component | |
| US7306466B2 (en) | Electrical printed circuit board | |
| JP2600516B2 (ja) | 半導体装置 | |
| US7276668B2 (en) | Circuit board with mounting pads for reducing parasitic effect | |
| US7183651B1 (en) | Power plane decoupling | |
| JP4841302B2 (ja) | インバータ回路 | |
| JP2001167974A (ja) | 回路基板およびそれを用いた回路モジュールおよびそれを用いた電子装置 | |
| US6525945B1 (en) | Method and system for wide band decoupling of integrated circuits | |
| WO2024111155A1 (ja) | 半導体リレー及び半導体リレーの製造方法 | |
| JP2590686B2 (ja) | 混成集積回路 | |
| JPH0766519A (ja) | フレキシブル基板 | |
| JPH0735459Y2 (ja) | 自動アンテナチューナの構造 | |
| JP2003142786A (ja) | フレキシブルプリント配線基板 | |
| KR20000071262A (ko) | 전기장치 | |
| WO2004090981A1 (en) | Electronic packaging structure with integrated distributed decoupling capacitors | |
| JP2006114715A (ja) | 容量可変型コンデンサ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FC2A | Withdrawal, rejection or dismissal of laid open patent application |