NO911933L - Epoksyharpiksmateriale, samt katalysator for herding derav - Google Patents
Epoksyharpiksmateriale, samt katalysator for herding deravInfo
- Publication number
- NO911933L NO911933L NO91911933A NO911933A NO911933L NO 911933 L NO911933 L NO 911933L NO 91911933 A NO91911933 A NO 91911933A NO 911933 A NO911933 A NO 911933A NO 911933 L NO911933 L NO 911933L
- Authority
- NO
- Norway
- Prior art keywords
- acid
- polyepoxide
- boric acid
- curing
- mixture
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6611—Wire connections
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Retarders (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Professional, Industrial, Or Sporting Protective Garments (AREA)
- Wrappers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52648790A | 1990-05-21 | 1990-05-21 | |
US07/526,488 US5169473A (en) | 1990-05-21 | 1990-05-21 | Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
NO911933D0 NO911933D0 (no) | 1991-05-16 |
NO911933L true NO911933L (no) | 1991-11-22 |
Family
ID=27062123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO91911933A NO911933L (no) | 1990-05-21 | 1991-05-16 | Epoksyharpiksmateriale, samt katalysator for herding derav |
Country Status (15)
Country | Link |
---|---|
EP (1) | EP0458502B1 (ja) |
JP (5) | JP3080245B2 (ja) |
KR (1) | KR100229301B1 (ja) |
CN (3) | CN1035823C (ja) |
AT (1) | ATE243227T1 (ja) |
AU (1) | AU657264B2 (ja) |
BR (1) | BR9102108A (ja) |
CA (1) | CA2042858A1 (ja) |
DE (1) | DE69133280T2 (ja) |
FI (1) | FI912435A (ja) |
IL (1) | IL98185A (ja) |
MY (1) | MY141502A (ja) |
NO (1) | NO911933L (ja) |
PT (1) | PT97724A (ja) |
SG (1) | SG43193A1 (ja) |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4981926A (en) * | 1990-02-06 | 1991-01-01 | The Dow Chemical Company | Composition of epoxy resin, amino group-containing phosphonium catalyst and curing agent |
GB9103402D0 (en) * | 1991-02-19 | 1991-04-03 | Pilkington Plc | Fire resistance |
GB9208955D0 (en) * | 1992-04-24 | 1992-06-10 | Dow Europ Sa | Dicyandiamide solution |
US5407977A (en) * | 1993-04-20 | 1995-04-18 | The Dow Chemical Company | Solvent system |
US5464910A (en) * | 1993-12-22 | 1995-11-07 | Shikoku Chemicals Corporation | Epoxy resin adduct combined with a borate ester and phenolic compound |
GB9421405D0 (en) * | 1994-10-21 | 1994-12-07 | Dow Chemical Co | Low voc laminating formulations |
GB9421407D0 (en) * | 1994-10-21 | 1994-12-07 | Dow Chemical Co | Curable epoxy resin accelerated by boric acid and its analogs |
US5508328A (en) * | 1994-11-17 | 1996-04-16 | Alliedsignal Inc. | Curing epoxy resins using dicy, imidazole and acid |
US6613839B1 (en) | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
WO1998031750A1 (en) † | 1997-01-21 | 1998-07-23 | The Dow Chemical Company | Latent catalysts for epoxy curing systems |
US6353080B1 (en) | 1997-06-26 | 2002-03-05 | The Dow Chemical Company | Flame retardant epoxy resin composition |
GB9817799D0 (en) * | 1998-08-14 | 1998-10-14 | Dow Deutschland Inc | Viscosity modifier for thermosetting resin compositioning |
TWI261059B (en) | 1999-12-13 | 2006-09-01 | Dow Global Technologies Inc | Flame retardant phosphorus element-containing epoxy resin compositions |
US6403220B1 (en) | 1999-12-13 | 2002-06-11 | The Dow Chemical Company | Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith |
KR100419063B1 (ko) * | 2000-06-10 | 2004-02-14 | 주식회사 엘지화학 | 에폭시 수지 조성물 및 이를 이용한 적층판 |
JP4534344B2 (ja) * | 2000-11-27 | 2010-09-01 | 住友ベークライト株式会社 | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
WO2003022904A1 (en) * | 2001-09-12 | 2003-03-20 | Dow Global Technologies Inc. | Network polymers comprising epoxy-terminated esters |
EP1391490A1 (en) * | 2002-08-23 | 2004-02-25 | Vantico Gmbh | Modified epoxy resins for triboelectric coating processes |
JP4612625B2 (ja) * | 2003-04-16 | 2011-01-12 | ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー | 低温硬化用の促進剤系 |
US20060247334A1 (en) * | 2003-08-05 | 2006-11-02 | Akira Ohbayashi | Epoxy resin composition and method for producing heat-resistant laminate sheet |
JP4895487B2 (ja) * | 2003-08-05 | 2012-03-14 | 一般財団法人川村理化学研究所 | 熱硬化性樹脂組成物及びその製造方法、成型物の製造方法 |
JP4558359B2 (ja) * | 2004-03-22 | 2010-10-06 | 財団法人川村理化学研究所 | エポキシ樹脂組成物及びそれを用いた銅張積層板 |
WO2005118604A1 (en) | 2004-05-28 | 2005-12-15 | Dow Global Technologies Inc. | Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
EP1867672B1 (en) | 2005-04-07 | 2011-01-26 | Asahi Kasei Chemicals Corporation | Epoxy resin composition |
DE102005029146A1 (de) * | 2005-06-23 | 2006-12-28 | Cognis Ip Management Gmbh | Härter für Überzugmassen (IV) |
EP1754733A1 (en) * | 2005-07-26 | 2007-02-21 | Huntsman Advanced Materials (Switzerland) GmbH | Composition |
RU2008114052A (ru) | 2005-09-15 | 2009-10-20 | Циба Спешиалти Кемикэлз Холдинг Инк. (Ch) | Композиции покрытий для маркировки подложек, содержащие латентный активатор |
US20090234080A1 (en) * | 2005-09-27 | 2009-09-17 | Sumitomo Dakelite Co., Ltd. | Process for producing latent catalyst and epoxy resin composition |
CN101341181B (zh) * | 2005-12-22 | 2013-09-04 | 陶氏环球技术有限责任公司 | 可固化环氧树脂组合物及由其制造的层压材料 |
JP5114112B2 (ja) * | 2006-09-07 | 2013-01-09 | 日東シンコー株式会社 | 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート |
JP5114111B2 (ja) * | 2006-09-07 | 2013-01-09 | 日東シンコー株式会社 | 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート |
US8053546B2 (en) | 2007-06-11 | 2011-11-08 | Basf Se | Catalyst for curing epoxides |
WO2008152005A1 (de) | 2007-06-12 | 2008-12-18 | Basf Se | Katalysator für die härtung von epoxiden |
DE502008001542D1 (de) | 2007-06-13 | 2010-11-25 | Basf Se | Katalysator für die härtung von epoxiden |
JP5260639B2 (ja) | 2007-06-14 | 2013-08-14 | ビーエーエスエフ ソシエタス・ヨーロピア | エポキシドの硬化のための触媒 |
US9333786B2 (en) | 2007-07-18 | 2016-05-10 | Datalase, Ltd. | Laser-sensitive coating formulations |
TWI534171B (zh) * | 2007-07-26 | 2016-05-21 | Ajinomoto Kk | 樹脂組成物 |
EP2334691A1 (en) | 2008-08-28 | 2011-06-22 | Dow Global Technologies LLC | Phosphorus-containing compounds and polymeric compositions comprising same |
CN102197076A (zh) | 2008-10-23 | 2011-09-21 | 巴斯夫欧洲公司 | 吸热添加剂 |
US9267042B2 (en) | 2008-10-27 | 2016-02-23 | Datalase Ltd. | Coating composition for marking substrates |
CA2755854A1 (en) | 2009-03-17 | 2010-09-23 | Dow Global Technologies Llc | Curable compositions containing cyclic diamine and cured products therefrom |
DE102009027826A1 (de) | 2009-04-29 | 2010-11-04 | Evonik Degussa Gmbh | Katalyse von Epoxidharzformulierungen |
KR100925986B1 (ko) | 2009-06-20 | 2009-11-10 | 정송옥 | 상·하수도 노후관 갱생용의 잠재성 중온 속경화형 에폭시 수지 조성물의 제조방법. |
US8871892B2 (en) * | 2009-11-12 | 2014-10-28 | Dow Global Technologies Llc | Polyoxazolidone resins |
CN101728038A (zh) * | 2009-12-04 | 2010-06-09 | 上海长园维安电子线路保护股份有限公司 | 热固性正温度系数热敏电阻器的制造方法及所用导电胶 |
EP2452978A1 (de) | 2010-11-16 | 2012-05-16 | Basf Se | Verfahren zur Herstellung von mit Kohlenstoff-Füllstoffen gefüllten Epoxidharzformmassen |
EP2678369B1 (de) * | 2011-02-23 | 2015-05-06 | AlzChem AG | Hochlatente härter für epoxidharze |
WO2012136273A1 (de) | 2011-04-08 | 2012-10-11 | Basf Se | Hyperverzweigte polymere zur modifikation der zähigkeit von anionisch gehärteten epoxidharz-systemen |
CN102443168B (zh) * | 2011-10-10 | 2016-03-09 | 苏州科技学院 | 一种多孔固体胺及其制备方法 |
CN104364287A (zh) * | 2012-06-15 | 2015-02-18 | 陶氏环球技术有限责任公司 | 用于可固化组合物的潜伏型催化剂 |
DK2695903T3 (en) * | 2012-08-08 | 2019-01-14 | Siemens Ag | Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process |
SG11201504129SA (en) * | 2012-12-11 | 2015-06-29 | Clarient Diagnostic Services Inc | Photoactivated chemical bleaching of dyes |
JP5758463B2 (ja) * | 2013-03-26 | 2015-08-05 | 太陽インキ製造株式会社 | エポキシ樹脂組成物、穴埋め充填用組成物およびこれらを用いたプリント配線板 |
CN105209536B (zh) * | 2013-05-14 | 2018-01-09 | 3M创新有限公司 | 包含含吡嗪化合物的环氧树脂 |
DE102013008723A1 (de) | 2013-05-23 | 2014-11-27 | Deutsche Institute Für Textil- Und Faserforschung Denkendorf | Polymerisierbare Reaktionsmischung zur Herstellung von Epoxidharzen und deren Verwendung |
JP5503783B1 (ja) * | 2013-06-04 | 2014-05-28 | 市郎 海谷 | 男性性不全者用陰圧式補助器具 |
JP6240940B2 (ja) * | 2014-02-06 | 2017-12-06 | 株式会社Adeka | エポキシ樹脂組成物 |
KR102311142B1 (ko) | 2014-02-06 | 2021-10-12 | 가부시키가이샤 아데카 | 신규 화합물 및 그것을 함유하여 이루어지는 에폭시 수지 조성물 |
CN106232739B (zh) | 2014-04-29 | 2019-08-02 | 阿克佐诺贝尔国际涂料股份有限公司 | 用于化学设备的表面的涂覆方法 |
US10465039B2 (en) | 2015-11-17 | 2019-11-05 | Evonik Degussa Gmbh | Epoxy curing agents, compositions and uses thereof |
US10556985B2 (en) * | 2015-11-17 | 2020-02-11 | Evonik Operations Gmbh | Nitrogen-containing heterocyclic epoxy curing agents, compositions and methods |
CN107446535A (zh) * | 2017-08-16 | 2017-12-08 | 浙江林境新材料科技有限公司 | 一种复合板 |
CN108565041B (zh) * | 2018-04-20 | 2020-04-28 | 四川省银河化学股份有限公司 | 一种高电导耐焊接型低温银浆及其制备方法 |
EP3569629B1 (de) * | 2018-05-17 | 2022-07-06 | Evonik Operations GmbH | Schnell härtende epoxysysteme |
JP7036122B2 (ja) * | 2018-09-05 | 2022-03-15 | 三菱ケミカル株式会社 | シートモールディングコンパウンドの製造方法 |
JP7261563B2 (ja) * | 2018-11-02 | 2023-04-20 | 谷川油化興業株式会社 | 熱交換媒体 |
KR102161362B1 (ko) * | 2018-12-24 | 2020-10-05 | 주식회사 하이플럭스 | 내화 조성물 |
DE102019121195A1 (de) * | 2019-08-06 | 2021-02-11 | Alzchem Trostberg Gmbh | Lagerstabile Epoxidharz-Zusammensetzung |
CN111892695B (zh) * | 2020-07-13 | 2022-12-30 | 四川省玻纤集团有限公司 | 耐γ辐照的改性树脂及其制备方法、层压板及其制备工艺与应用 |
CN118421192B (zh) * | 2024-07-04 | 2024-08-30 | 湖南飘峰电气股份有限公司 | 防火耐高温聚酰亚胺电磁线及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4001156A (en) * | 1972-08-03 | 1977-01-04 | Ppg Industries, Inc. | Method of producing epoxy group-containing, quaternary ammonium salt-containing resins |
US4594291A (en) * | 1984-07-17 | 1986-06-10 | The Dow Chemical Company | Curable, partially advanced epoxy resins |
IL75806A (en) * | 1984-07-17 | 1988-10-31 | Dow Chemical Co | Partially advanced epoxy resin compositions and products resulting from reacting and curing said compositions |
US4668758A (en) * | 1985-09-30 | 1987-05-26 | Shell Oil Company | Cure rate control in epoxy resin compositions |
-
1991
- 1991-05-13 DE DE69133280T patent/DE69133280T2/de not_active Expired - Lifetime
- 1991-05-13 EP EP91304277A patent/EP0458502B1/en not_active Expired - Lifetime
- 1991-05-13 SG SG1996005258A patent/SG43193A1/en unknown
- 1991-05-13 AT AT91304277T patent/ATE243227T1/de not_active IP Right Cessation
- 1991-05-16 NO NO91911933A patent/NO911933L/no unknown
- 1991-05-17 CA CA002042858A patent/CA2042858A1/en not_active Abandoned
- 1991-05-17 IL IL9818591A patent/IL98185A/en not_active IP Right Cessation
- 1991-05-17 BR BR919102108A patent/BR9102108A/pt not_active Application Discontinuation
- 1991-05-17 MY MYPI91000833A patent/MY141502A/en unknown
- 1991-05-20 PT PT97724A patent/PT97724A/pt not_active Application Discontinuation
- 1991-05-20 FI FI912435A patent/FI912435A/fi not_active Application Discontinuation
- 1991-05-20 JP JP03114740A patent/JP3080245B2/ja not_active Expired - Lifetime
- 1991-05-20 AU AU77211/91A patent/AU657264B2/en not_active Ceased
- 1991-05-20 CN CN91103442A patent/CN1035823C/zh not_active Expired - Fee Related
- 1991-05-20 KR KR1019910008147A patent/KR100229301B1/ko not_active IP Right Cessation
-
1995
- 1995-06-27 CN CN95107625A patent/CN1050618C/zh not_active Expired - Lifetime
- 1995-06-27 CN CN95107624A patent/CN1050617C/zh not_active Expired - Lifetime
-
1999
- 1999-03-01 JP JP05329299A patent/JP3321429B2/ja not_active Expired - Lifetime
- 1999-09-16 JP JP26274899A patent/JP3333762B2/ja not_active Expired - Lifetime
-
2000
- 2000-04-04 JP JP2000106716A patent/JP3269621B2/ja not_active Expired - Lifetime
-
2001
- 2001-11-08 JP JP2001343762A patent/JP3383658B2/ja not_active Expired - Lifetime
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