FI912435A - Latentkatalysatorer, haerdningsinhiberade epoxihartskompositioner och laminat som framstaellts av dessa. - Google Patents

Latentkatalysatorer, haerdningsinhiberade epoxihartskompositioner och laminat som framstaellts av dessa. Download PDF

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Publication number
FI912435A
FI912435A FI912435A FI912435A FI912435A FI 912435 A FI912435 A FI 912435A FI 912435 A FI912435 A FI 912435A FI 912435 A FI912435 A FI 912435A FI 912435 A FI912435 A FI 912435A
Authority
FI
Finland
Prior art keywords
acid
polyepoxide
boric acid
mixture
catalyst
Prior art date
Application number
FI912435A
Other languages
English (en)
Other versions
FI912435A0 (fi
Inventor
James L Bertram
Charlie Z Hotz
Louis L Walker
Joseph Gan
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/526,488 external-priority patent/US5169473A/en
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of FI912435A0 publication Critical patent/FI912435A0/fi
Publication of FI912435A publication Critical patent/FI912435A/fi

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6611—Wire connections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Retarders (AREA)
  • Wrappers (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
FI912435A 1990-05-21 1991-05-20 Latentkatalysatorer, haerdningsinhiberade epoxihartskompositioner och laminat som framstaellts av dessa. FI912435A (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52648790A 1990-05-21 1990-05-21
US07/526,488 US5169473A (en) 1990-05-21 1990-05-21 Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions

Publications (2)

Publication Number Publication Date
FI912435A0 FI912435A0 (fi) 1991-05-20
FI912435A true FI912435A (fi) 1991-11-22

Family

ID=27062123

Family Applications (1)

Application Number Title Priority Date Filing Date
FI912435A FI912435A (fi) 1990-05-21 1991-05-20 Latentkatalysatorer, haerdningsinhiberade epoxihartskompositioner och laminat som framstaellts av dessa.

Country Status (15)

Country Link
EP (1) EP0458502B1 (fi)
JP (5) JP3080245B2 (fi)
KR (1) KR100229301B1 (fi)
CN (3) CN1035823C (fi)
AT (1) ATE243227T1 (fi)
AU (1) AU657264B2 (fi)
BR (1) BR9102108A (fi)
CA (1) CA2042858A1 (fi)
DE (1) DE69133280T2 (fi)
FI (1) FI912435A (fi)
IL (1) IL98185A (fi)
MY (1) MY141502A (fi)
NO (1) NO911933L (fi)
PT (1) PT97724A (fi)
SG (1) SG43193A1 (fi)

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US5407977A (en) * 1993-04-20 1995-04-18 The Dow Chemical Company Solvent system
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GB9421405D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
GB9421407D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Curable epoxy resin accelerated by boric acid and its analogs
US5508328A (en) * 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid
JP4080546B2 (ja) † 1997-01-21 2008-04-23 ダウ グローバル テクノロジーズ インコーポレイティド エポキシ硬化系のための潜触媒
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9817799D0 (en) * 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
WO2001042253A2 (en) 1999-12-13 2001-06-14 The Dow Chemical Company Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
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JP4534344B2 (ja) * 2000-11-27 2010-09-01 住友ベークライト株式会社 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
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JP4558359B2 (ja) * 2004-03-22 2010-10-06 財団法人川村理化学研究所 エポキシ樹脂組成物及びそれを用いた銅張積層板
CN1960997B (zh) 2004-05-28 2014-05-07 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
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EP1754733A1 (en) * 2005-07-26 2007-02-21 Huntsman Advanced Materials (Switzerland) GmbH Composition
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US20090234080A1 (en) * 2005-09-27 2009-09-17 Sumitomo Dakelite Co., Ltd. Process for producing latent catalyst and epoxy resin composition
CN101341181B (zh) * 2005-12-22 2013-09-04 陶氏环球技术有限责任公司 可固化环氧树脂组合物及由其制造的层压材料
JP5114111B2 (ja) * 2006-09-07 2013-01-09 日東シンコー株式会社 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート
JP5114112B2 (ja) * 2006-09-07 2013-01-09 日東シンコー株式会社 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート
CA2690295C (en) 2007-06-11 2014-12-30 Georg Degen Catalyst for curing epoxides
US8193297B2 (en) 2007-06-12 2012-06-05 Basf Se Catalyst for curing epoxides
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JP5581208B2 (ja) 2007-07-18 2014-08-27 データレース リミテッド レーザー感受性被覆配合物
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US10556985B2 (en) * 2015-11-17 2020-02-11 Evonik Operations Gmbh Nitrogen-containing heterocyclic epoxy curing agents, compositions and methods
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CN107446535A (zh) * 2017-08-16 2017-12-08 浙江林境新材料科技有限公司 一种复合板
CN108565041B (zh) * 2018-04-20 2020-04-28 四川省银河化学股份有限公司 一种高电导耐焊接型低温银浆及其制备方法
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Also Published As

Publication number Publication date
IL98185A0 (en) 1992-06-21
JP3269621B2 (ja) 2002-03-25
EP0458502A2 (en) 1991-11-27
JP3321429B2 (ja) 2002-09-03
BR9102108A (pt) 1991-12-24
CN1118793A (zh) 1996-03-20
JP3333762B2 (ja) 2002-10-15
IL98185A (en) 1994-06-24
NO911933L (no) 1991-11-22
SG43193A1 (en) 1997-10-17
AU657264B2 (en) 1995-03-09
CN1050618C (zh) 2000-03-22
EP0458502B1 (en) 2003-06-18
JP2000136288A (ja) 2000-05-16
JP2002178342A (ja) 2002-06-26
PT97724A (pt) 1992-03-31
EP0458502A3 (en) 1992-12-02
AU7721191A (en) 1991-11-21
JP3383658B2 (ja) 2003-03-04
JPH11310627A (ja) 1999-11-09
CN1118794A (zh) 1996-03-20
JP3080245B2 (ja) 2000-08-21
FI912435A0 (fi) 1991-05-20
JPH04227924A (ja) 1992-08-18
KR910020060A (ko) 1991-12-19
DE69133280T2 (de) 2004-05-06
CN1035823C (zh) 1997-09-10
DE69133280D1 (de) 2003-07-24
ATE243227T1 (de) 2003-07-15
CN1050617C (zh) 2000-03-22
JP2000309626A (ja) 2000-11-07
KR100229301B1 (ko) 1999-11-01
NO911933D0 (no) 1991-05-16
CN1056699A (zh) 1991-12-04
MY141502A (en) 2010-05-14
CA2042858A1 (en) 1991-11-22

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