NO333507B1 - Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand - Google Patents
Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand Download PDFInfo
- Publication number
- NO333507B1 NO333507B1 NO20092381A NO20092381A NO333507B1 NO 333507 B1 NO333507 B1 NO 333507B1 NO 20092381 A NO20092381 A NO 20092381A NO 20092381 A NO20092381 A NO 20092381A NO 333507 B1 NO333507 B1 NO 333507B1
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- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000002245 particle Substances 0.000 claims abstract description 89
- 229920000642 polymer Polymers 0.000 claims abstract description 30
- 230000005684 electric field Effects 0.000 claims abstract description 29
- 239000000203 mixture Substances 0.000 claims abstract description 28
- 239000011159 matrix material Substances 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 47
- 239000000853 adhesive Substances 0.000 claims description 43
- 230000001070 adhesive effect Effects 0.000 claims description 43
- 238000005325 percolation Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 description 69
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 27
- 239000010410 layer Substances 0.000 description 25
- 239000002904 solvent Substances 0.000 description 21
- 229910052799 carbon Inorganic materials 0.000 description 16
- 239000010408 film Substances 0.000 description 15
- 239000002041 carbon nanotube Substances 0.000 description 11
- 229910021393 carbon nanotube Inorganic materials 0.000 description 10
- 239000002110 nanocone Substances 0.000 description 10
- 229920001169 thermoplastic Polymers 0.000 description 10
- 239000006229 carbon black Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 238000005476 soldering Methods 0.000 description 9
- 229920001187 thermosetting polymer Polymers 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000006641 stabilisation Effects 0.000 description 7
- 238000011105 stabilization Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 6
- 238000000879 optical micrograph Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000004416 thermosoftening plastic Substances 0.000 description 6
- 230000002535 lyotropic effect Effects 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000003575 carbonaceous material Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000000197 pyrolysis Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 230000035876 healing Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920002098 polyfluorene Polymers 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005442 molecular electronic Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0079—Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F1/00—Preventing the formation of electrostatic charges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0003—Protection against electric or thermal overload; cooling arrangements; means for avoiding the formation of cathode films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/62—Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
- H01M4/628—Inhibitors, e.g. gassing inhibitors, corrosion inhibitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/02—Carrying-off electrostatic charges by means of earthing connections
- H05F3/025—Floors or floor coverings specially adapted for discharging static charges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2601/00—Inorganic fillers
- B05D2601/20—Inorganic fillers used for non-pigmentation effect
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Priority Applications (28)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO20092381A NO333507B1 (no) | 2009-06-22 | 2009-06-22 | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
EP10792390.6A EP2446448A4 (en) | 2009-06-22 | 2010-06-22 | CONNECTING SOLAR CELL TABS TO AN OMNIBUS BAR OF SOLAR CELL, AND SOLAR CELL THUS PRODUCED |
AU2010263374A AU2010263374A1 (en) | 2009-06-22 | 2010-06-22 | Connecting solar cell tabs to a solar cell busbar and a solar cell so produced |
EP10737388.8A EP2446721B1 (en) | 2009-06-22 | 2010-06-22 | Method of manufacture of an anisotropic conducting body |
KR1020127001528A KR101858759B1 (ko) | 2009-06-22 | 2010-06-22 | 정전 방전 장치 및 그의 제조 방법 |
HUE10792384A HUE042710T2 (hu) | 2009-06-22 | 2010-06-22 | Eljárás elektrosztatikus kisütési eszköz elõállítására |
PCT/NO2010/000242 WO2010151142A1 (en) | 2009-06-22 | 2010-06-22 | Anisotropic conducting body and method of manufacture |
AU2010263367A AU2010263367B2 (en) | 2009-06-22 | 2010-06-22 | Electrostatic discharge device and method for manufacturing the same |
JP2012517432A JP5536882B2 (ja) | 2009-06-22 | 2010-06-22 | 静電気放電デバイスおよびその製造方法 |
SG2011095080A SG177315A1 (en) | 2009-06-22 | 2010-06-22 | Connecting solar cell tabs to a solar cell busbar and a solar cell so produced |
US13/380,227 US9437347B2 (en) | 2009-06-22 | 2010-06-22 | Method for manufacturing an electrostatic discharge device |
JP2012517434A JP2012531060A (ja) | 2009-06-22 | 2010-06-22 | 太陽電池タブの太陽電池母線への接続、及び製造された太陽電池 |
PCT/NO2010/000241 WO2010151141A1 (en) | 2009-06-22 | 2010-06-22 | Electrostatic discharge device and method for manufacturing the same |
PCT/NO2010/000249 WO2010151148A1 (en) | 2009-06-22 | 2010-06-22 | Connecting solar cell tabs to a solar cell busbar and a solar cell so produced |
LTEP10792384.9T LT2446447T (lt) | 2009-06-22 | 2010-06-22 | Elektrostatinės iškrovos įrenginio gamybos metodas |
US13/380,189 US10561048B2 (en) | 2009-06-22 | 2010-06-22 | Anisotropic conducting body and method of manufacture |
DK10792384.9T DK2446447T3 (en) | 2009-06-22 | 2010-06-22 | PROCEDURE FOR MANUFACTURING AN ELECTROSTATIC DISCHARGING DEVICE |
EP10792384.9A EP2446447B1 (en) | 2009-06-22 | 2010-06-22 | Method for manufacturing an electrostatic discharge device |
SG2011095072A SG177314A1 (en) | 2009-06-22 | 2010-06-22 | Electrostatic discharge device and method for manufacturing the same |
CN2010800332524A CN102483969A (zh) | 2009-06-22 | 2010-06-22 | 太阳能电池集流条与太阳能电池主栅的连接以及由此制得的太阳能电池 |
CN201080033253.9A CN102483970B (zh) | 2009-06-22 | 2010-06-22 | 静电放电装置以及制造该装置的方法 |
SI201031858T SI2446447T1 (sl) | 2009-06-22 | 2010-06-22 | Metoda za proizvodnjo elektrostatične naprave za razelektritev |
US13/380,200 US20120240992A1 (en) | 2009-06-22 | 2010-06-22 | Connecting solar cell tabs to a solar cell busbar and a solar cell so produced |
KR1020127001527A KR20120101627A (ko) | 2009-06-22 | 2010-06-22 | 태양 전지 탭을 태양 전지 버스바에 접속하는 방법 및 이 방법으로 제조된 태양 전지 |
US13/326,579 US10090076B2 (en) | 2009-06-22 | 2011-12-15 | Anisotropic conductive polymer material |
US15/228,671 US20170034964A1 (en) | 2009-06-22 | 2016-08-04 | Electrostatic discharge device and method for manufacturing the same |
HRP20190370TT HRP20190370T1 (hr) | 2009-06-22 | 2019-02-26 | Postupak proizvodnje uređaja za elektrostatičko izbijanje |
US16/555,816 US20200245514A1 (en) | 2009-06-22 | 2019-08-29 | Anisotropic conducting body and method for manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO20092381A NO333507B1 (no) | 2009-06-22 | 2009-06-22 | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20092381L NO20092381L (no) | 2010-12-23 |
NO333507B1 true NO333507B1 (no) | 2013-06-24 |
Family
ID=41804771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20092381A NO333507B1 (no) | 2009-06-22 | 2009-06-22 | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
Country Status (14)
Country | Link |
---|---|
US (5) | US10561048B2 (ko) |
EP (3) | EP2446448A4 (ko) |
JP (2) | JP2012531060A (ko) |
KR (2) | KR20120101627A (ko) |
CN (2) | CN102483969A (ko) |
AU (2) | AU2010263374A1 (ko) |
DK (1) | DK2446447T3 (ko) |
HR (1) | HRP20190370T1 (ko) |
HU (1) | HUE042710T2 (ko) |
LT (1) | LT2446447T (ko) |
NO (1) | NO333507B1 (ko) |
SG (2) | SG177314A1 (ko) |
SI (1) | SI2446447T1 (ko) |
WO (3) | WO2010151141A1 (ko) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO333507B1 (no) * | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
CN102376793A (zh) * | 2010-08-26 | 2012-03-14 | 宇威光电股份有限公司 | 太阳能电池模块 |
US10071902B2 (en) | 2010-12-08 | 2018-09-11 | Condalign As | Method for assembling conductive particles into conductive pathways and sensors thus formed |
EP2652059A2 (en) * | 2010-12-15 | 2013-10-23 | Condalign AS | Method for forming uv-curable conductive compositions and a composition thus formed |
WO2012081991A1 (en) * | 2010-12-15 | 2012-06-21 | Condalign As | Method for forming an anisotropic conductive paper and a paper thus formed |
US9780354B2 (en) | 2010-12-21 | 2017-10-03 | Condalign As | Battery electrode material and method for making the same |
WO2012085084A2 (en) * | 2010-12-21 | 2012-06-28 | Condalign As | Method for forming conductive structures in a solar cell |
DE102011078998A1 (de) * | 2011-07-12 | 2013-01-17 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauelement und Verfahren zum Herstellen eines lichtemittierenden Bauelements |
US9818499B2 (en) * | 2011-10-13 | 2017-11-14 | Flexcon Company, Inc. | Electrically conductive materials formed by electrophoresis |
US8673184B2 (en) | 2011-10-13 | 2014-03-18 | Flexcon Company, Inc. | Systems and methods for providing overcharge protection in capacitive coupled biomedical electrodes |
US9775235B2 (en) | 2013-03-15 | 2017-09-26 | Flexcon Company, Inc. | Systems and methods for providing surface connectivity of oriented conductive channels |
KR101580113B1 (ko) * | 2013-05-15 | 2015-12-29 | 한국항공우주연구원 | 전기장을 이용한 기능성 나노복합재 제조방법 |
KR101983161B1 (ko) * | 2013-12-06 | 2019-05-28 | 삼성전기주식회사 | 이에스디 페이스트 및 그 제조 방법 |
CN103676331B (zh) * | 2013-12-27 | 2017-01-04 | 京东方科技集团股份有限公司 | 一种导电取向层及制备方法、显示基板、显示装置 |
US10914644B2 (en) * | 2014-03-25 | 2021-02-09 | The Procter & Gamble Company | Apparatus for sensing material strain |
EP2947662A1 (en) | 2014-05-21 | 2015-11-25 | Condalign AS | A method for arranging particles at an interface |
WO2016086089A1 (en) * | 2014-11-26 | 2016-06-02 | The University, Of Akron | Electric field alignment in polymer solutions |
KR102422077B1 (ko) * | 2015-11-05 | 2022-07-19 | 삼성디스플레이 주식회사 | 도전성 접착 필름 및 이를 이용한 전자기기의 접착 방법 |
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CN105967818A (zh) * | 2016-02-24 | 2016-09-28 | 叶集试验区华农种植专业合作社 | 一种梨春季萌芽期适用肥料及其制备方法 |
KR101932337B1 (ko) * | 2017-04-12 | 2018-12-26 | 한국과학기술원 | 도전 입자의 이동을 제한하는 폴리머 층을 포함하는 이방성 전도 필름 및 수직 방향 초음파를 이용한 그 제조 방법 |
US20190355277A1 (en) | 2018-05-18 | 2019-11-21 | Aidmics Biotechnology (Hk) Co., Limited | Hand-made circuit board |
US20200015752A1 (en) * | 2018-07-13 | 2020-01-16 | John R Baxter | Textile utilizing carbon nanotubes |
KR102196530B1 (ko) * | 2018-09-21 | 2020-12-29 | 포항공과대학교 산학협력단 | 전도성 입자 또는 강화 필러를 포함하는 신축성 기판의 제조방법 및 그를 포함하는 신축성 전자기기의 제조방법 |
RU2709609C1 (ru) * | 2018-11-02 | 2019-12-19 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Санкт-Петербургский университет Государственной противопожарной службы Министерства Российской Федерации по делам гражданской обороны, чрезвычайным ситуациям и ликвидации последствий стихийных бедствий" | Способ снижения электризации жидких углеводородов при обращении с ними |
WO2020131799A1 (en) | 2018-12-17 | 2020-06-25 | E Ink Corporation | Anisotropically conductive moisture barrier films and electro-optic assemblies containing the same |
KR20200142622A (ko) * | 2019-06-12 | 2020-12-23 | 삼성디스플레이 주식회사 | 기판 이송 장치 및 이를 이용한 기판 이송 방법 |
DE102020207986A1 (de) | 2020-06-29 | 2021-12-30 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Verkapselung elektrischer Bauteile, Verkapselungsmaterial zur Verwendung in diesem Verfahren sowie verkapseltes elektrisches Bauteil |
WO2024062449A1 (en) * | 2022-09-22 | 2024-03-28 | Novocure Gmbh | Electrode assembly with filler structure between electrode elements |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4170677A (en) * | 1977-11-16 | 1979-10-09 | The United States Of America As Represented By The Secretary Of The Army | Anisotropic resistance bonding technique |
US20030102154A1 (en) * | 1997-03-04 | 2003-06-05 | Tessera, Inc. | Methods of making anisotropic conductive elements for use in microelectronic packaging |
US6837928B1 (en) * | 2001-08-30 | 2005-01-04 | The Board Of Trustees Of The Leland Stanford Junior University | Electric field orientation of carbon nanotubes |
WO2006052142A1 (en) * | 2004-11-03 | 2006-05-18 | Carbon Cones As | Electricity and heat conductive composite |
WO2008009779A1 (en) * | 2006-07-21 | 2008-01-24 | Valtion Teknillinen Tutkimuskeskus | Method for manufacturing conductors and semiconductors |
US20090038832A1 (en) * | 2007-08-10 | 2009-02-12 | Sterling Chaffins | Device and method of forming electrical path with carbon nanotubes |
EP2058868A1 (en) * | 2006-08-29 | 2009-05-13 | Hitachi Chemical Company, Ltd. | Conductive adhesive film and solar cell module |
Family Cites Families (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3773684A (en) * | 1964-06-29 | 1973-11-20 | A Marks | Dipolar electro-optic compositions and method of preparation |
US4024318A (en) * | 1966-02-17 | 1977-05-17 | Exxon Research And Engineering Company | Metal-filled plastic material |
DE2230578A1 (de) | 1972-06-22 | 1974-01-17 | Dynamit Nobel Ag | Antistatischer und/oder elektrisch leitfaehiger bodenbelag sowie verfahren zu seiner herstellung |
US4269881A (en) | 1976-10-18 | 1981-05-26 | Ludlow Corporation | Anti-static mats and carpets |
US4265789A (en) * | 1979-10-22 | 1981-05-05 | Polymer Cencentrates, Inc. | Conductive polymer processable as a thermoplastic |
US4364752A (en) * | 1981-03-13 | 1982-12-21 | Fitch Richard A | Electrostatic precipitator apparatus having an improved ion generating means |
FR2522241A1 (fr) * | 1982-02-22 | 1983-08-26 | Thomson Csf | Procede de fabrication de transducteurs polymeres piezoelectriques par forgeage |
US4548862A (en) * | 1984-09-04 | 1985-10-22 | Minnesota Mining And Manufacturing Company | Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer |
US4657833A (en) * | 1986-02-11 | 1987-04-14 | E. I. Du Pont De Nemours And Company | Photosensitive cathode for deposition of metal structures within organic polymeric films |
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
US4724187A (en) | 1986-03-25 | 1988-02-09 | Nevamar Corporation | Conductive laminate flooring |
US4830903A (en) * | 1986-08-29 | 1989-05-16 | E. I. Du Pont De Nemours And Company | Catalytic deposition of metals in solid matrices |
JPS63257763A (ja) * | 1987-04-15 | 1988-10-25 | Hitachi Metals Ltd | 画像記録方法 |
US4826912A (en) | 1987-07-29 | 1989-05-02 | Armstrong World Industries, Inc. | Charge dissipative floor tiles |
US5334330A (en) * | 1990-03-30 | 1994-08-02 | The Whitaker Corporation | Anisotropically electrically conductive composition with thermal dissipation capabilities |
US5348784A (en) | 1991-11-04 | 1994-09-20 | United Technical Products, Inc. | Antistatic and conductive carpet tile system |
US5429701A (en) | 1992-04-14 | 1995-07-04 | Industrial Technology Research Institute | Method of electrically interconnecting conductors |
US5443876A (en) * | 1993-12-30 | 1995-08-22 | Minnesota Mining And Manufacturing Company | Electrically conductive structured sheets |
KR100389743B1 (ko) * | 1994-01-27 | 2003-10-04 | 록타이트(아일랜드) 리미티드 | 두세트의전도체사이에이방성전도성경로및결합을제공하기위한조성물및방법 |
US5891366A (en) * | 1994-05-10 | 1999-04-06 | Robert Bosch Gmbh | Anisotropically conducting adhesive, and process for producing an anisotropically conducting adhesive |
US5700398A (en) | 1994-12-14 | 1997-12-23 | International Business Machines Corporation | Composition containing a polymer and conductive filler and use thereof |
US5777292A (en) * | 1996-02-01 | 1998-07-07 | Room Temperature Superconductors Inc. | Materials having high electrical conductivity at room teperatures and methods for making same |
US5817374A (en) * | 1996-05-31 | 1998-10-06 | Electrox Corporation | Process for patterning powders into thick layers |
WO1998006007A1 (en) * | 1996-08-01 | 1998-02-12 | Loctite (Ireland) Limited | A method of forming a monolayer of particles, and products formed thereby |
US6088471A (en) * | 1997-05-16 | 2000-07-11 | Authentec, Inc. | Fingerprint sensor including an anisotropic dielectric coating and associated methods |
JP2002501821A (ja) * | 1998-01-30 | 2002-01-22 | ロックタイト コーポレイション | 粒子の非ランダム単層にコーティングを形成する方法、及びそれによって形成された製品 |
AU3201699A (en) * | 1998-03-24 | 1999-10-18 | Drexel University | Process of making bipolar electrodeposited catalysts and catalysts so made |
US20040246650A1 (en) * | 1998-08-06 | 2004-12-09 | Grigorov Leonid N. | Highly conductive macromolecular materials and improved methods for making same |
US6552883B1 (en) * | 1998-08-06 | 2003-04-22 | Room Temperature Superconductors, Inc. | Devices comprising thin films having temperature-independent high electrical conductivity and methods of making same |
JP3379456B2 (ja) * | 1998-12-25 | 2003-02-24 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
US6218629B1 (en) | 1999-01-20 | 2001-04-17 | International Business Machines Corporation | Module with metal-ion matrix induced dendrites for interconnection |
US7635810B2 (en) * | 1999-03-30 | 2009-12-22 | Daniel Luch | Substrate and collector grid structures for integrated photovoltaic arrays and process of manufacture of such arrays |
US6504524B1 (en) * | 2000-03-08 | 2003-01-07 | E Ink Corporation | Addressing methods for displays having zero time-average field |
GB2361479A (en) * | 2000-04-11 | 2001-10-24 | Secr Defence | Electric-field structuring of composite materials |
US6417245B1 (en) * | 2000-07-20 | 2002-07-09 | The Research Foundation Of State University Of Ny | Method for the preparation of conjugated polymers |
CN1498416A (zh) * | 2001-01-23 | 2004-05-19 | \ | 导电聚合物材料和它们的制造方法和用途 |
US20050206028A1 (en) | 2001-02-15 | 2005-09-22 | Integral Technologies, Inc. | Low cost electrically conductive flooring tile manufactured from conductive loaded resin-based materials |
CN1543399B (zh) | 2001-03-26 | 2011-02-23 | 艾考斯公司 | 含碳纳米管的涂层 |
US6623787B2 (en) | 2001-07-26 | 2003-09-23 | Electrochemicals Inc. | Method to improve the stability of dispersions of carbon |
US6733613B2 (en) * | 2002-07-25 | 2004-05-11 | S. Kumar Khanna | Method for curing an anisotropic conductive compound |
US7097757B1 (en) * | 2002-07-30 | 2006-08-29 | Fractal Systems, Inc. | Polymers having an ordered structural state |
US7034403B2 (en) * | 2003-04-10 | 2006-04-25 | 3M Innovative Properties Company | Durable electronic assembly with conductive adhesive |
JP4039975B2 (ja) | 2003-04-25 | 2008-01-30 | 信越ポリマー株式会社 | 線材タイプの異方導電性コネクタ |
US7062848B2 (en) * | 2003-09-18 | 2006-06-20 | Hewlett-Packard Development Company, L.P. | Printable compositions having anisometric nanostructures for use in printed electronics |
US7018917B2 (en) * | 2003-11-20 | 2006-03-28 | Asm International N.V. | Multilayer metallization |
US6970285B2 (en) * | 2004-03-02 | 2005-11-29 | Hewlett-Packard Development Company, L.P. | Phase change electrophoretic imaging for rewritable applications |
US8052932B2 (en) * | 2006-12-22 | 2011-11-08 | Research Triangle Institute | Polymer nanofiber-based electronic nose |
JP2005306992A (ja) * | 2004-04-21 | 2005-11-04 | Dainippon Ink & Chem Inc | 機能性硬化膜 |
CN101084260A (zh) | 2004-08-31 | 2007-12-05 | 海珀里昂催化国际有限公司 | 通过挤出制备的导电热固性材料 |
TWI463615B (zh) | 2004-11-04 | 2014-12-01 | Taiwan Semiconductor Mfg Co Ltd | 以奈米管為基礎之具方向性導電黏著 |
US7595790B2 (en) * | 2005-01-31 | 2009-09-29 | Panasonic Corporation | Pressure sensitive conductive sheet, method of manufacturing the same, and touch panel using the same |
US8253179B2 (en) * | 2005-05-13 | 2012-08-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of the same |
EP1902493A1 (en) * | 2005-07-08 | 2008-03-26 | Cypak AB | Use of heat-activated adhesive for manufacture and a device so manufactured |
EP1948854B1 (en) * | 2005-10-31 | 2012-06-13 | The Trustees of Princeton University | Electrohydrodynamic printing and manufacturing |
US20070213429A1 (en) * | 2006-03-10 | 2007-09-13 | Chih-Min Cheng | Anisotropic conductive adhesive |
JP5129935B2 (ja) | 2006-06-13 | 2013-01-30 | 日東電工株式会社 | シート状複合材料及びその製造方法 |
CN101029212A (zh) * | 2007-04-28 | 2007-09-05 | 北京市航天焊接材料厂 | 一种环氧树脂各向异性导电胶 |
GB0710425D0 (en) * | 2007-06-01 | 2007-07-11 | Hexcel Composites Ltd | Improved structural adhesive materials |
WO2009053470A1 (en) * | 2007-10-24 | 2009-04-30 | Queen Mary And Westfield College, University Of London | Conductive polymer composite |
JP2010041040A (ja) * | 2008-07-10 | 2010-02-18 | Semiconductor Energy Lab Co Ltd | 光電変換装置および光電変換装置の製造方法 |
EP2154312A1 (en) | 2008-08-14 | 2010-02-17 | Tarkett France | Surface covering with static control properties |
NO333507B1 (no) * | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
US10090076B2 (en) * | 2009-06-22 | 2018-10-02 | Condalign As | Anisotropic conductive polymer material |
WO2011052382A1 (en) * | 2009-10-30 | 2011-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US10071902B2 (en) * | 2010-12-08 | 2018-09-11 | Condalign As | Method for assembling conductive particles into conductive pathways and sensors thus formed |
WO2012081991A1 (en) * | 2010-12-15 | 2012-06-21 | Condalign As | Method for forming an anisotropic conductive paper and a paper thus formed |
WO2012085084A2 (en) * | 2010-12-21 | 2012-06-28 | Condalign As | Method for forming conductive structures in a solar cell |
US8673184B2 (en) * | 2011-10-13 | 2014-03-18 | Flexcon Company, Inc. | Systems and methods for providing overcharge protection in capacitive coupled biomedical electrodes |
US9775235B2 (en) * | 2013-03-15 | 2017-09-26 | Flexcon Company, Inc. | Systems and methods for providing surface connectivity of oriented conductive channels |
-
2009
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- 2010-06-22 EP EP10792390.6A patent/EP2446448A4/en not_active Withdrawn
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- 2010-06-22 WO PCT/NO2010/000242 patent/WO2010151142A1/en active Application Filing
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- 2010-06-22 KR KR1020127001528A patent/KR101858759B1/ko active IP Right Grant
- 2010-06-22 US US13/380,189 patent/US10561048B2/en active Active
- 2010-06-22 US US13/380,200 patent/US20120240992A1/en not_active Abandoned
- 2010-06-22 US US13/380,227 patent/US9437347B2/en active Active
-
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- 2016-08-04 US US15/228,671 patent/US20170034964A1/en not_active Abandoned
-
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- 2019-02-26 HR HRP20190370TT patent/HRP20190370T1/hr unknown
- 2019-08-29 US US16/555,816 patent/US20200245514A1/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4170677A (en) * | 1977-11-16 | 1979-10-09 | The United States Of America As Represented By The Secretary Of The Army | Anisotropic resistance bonding technique |
US20030102154A1 (en) * | 1997-03-04 | 2003-06-05 | Tessera, Inc. | Methods of making anisotropic conductive elements for use in microelectronic packaging |
US6837928B1 (en) * | 2001-08-30 | 2005-01-04 | The Board Of Trustees Of The Leland Stanford Junior University | Electric field orientation of carbon nanotubes |
WO2006052142A1 (en) * | 2004-11-03 | 2006-05-18 | Carbon Cones As | Electricity and heat conductive composite |
WO2008009779A1 (en) * | 2006-07-21 | 2008-01-24 | Valtion Teknillinen Tutkimuskeskus | Method for manufacturing conductors and semiconductors |
EP2058868A1 (en) * | 2006-08-29 | 2009-05-13 | Hitachi Chemical Company, Ltd. | Conductive adhesive film and solar cell module |
US20090038832A1 (en) * | 2007-08-10 | 2009-02-12 | Sterling Chaffins | Device and method of forming electrical path with carbon nanotubes |
Non-Patent Citations (3)
Title |
---|
E. SVÅSAND et al., «Chain formation in a complex fluid containing carbon cones and disks in silicon oil», Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2007, vol. 308, ss. 67 - 70, Dated: 01.01.0001 * |
SCHWARZ M-K ET AL: "Alternating electric field induced agglomeration of carbon black filled resins", POLYMER, ELSEVIER SCIENCE PUBLISHERS B.V, GB, vol. 43, no. 10, 1 May 2002 (2002-05-01), pages 3079 - 3082, XP004343311, ISSN: 0032-3861 * |
SVASAND E ET AL: "Behavior of carbon cone particle dispersions in electric and magnetic fields", COLLOIDS AND SURFACES. A, PHYSICACHEMICAL AND ENGINEERING ASPECTS, ELSEVIER, AMSTERDAM, NL, vol. 339, no. 1-3, 1 May 2009 (2009-05-01), pages 211 - 216, XP026076590, ISSN: 0927-7757, [retrieved on 20090225] * |
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