NO20060732L - Blyfri loddepasta - Google Patents

Blyfri loddepasta

Info

Publication number
NO20060732L
NO20060732L NO20060732A NO20060732A NO20060732L NO 20060732 L NO20060732 L NO 20060732L NO 20060732 A NO20060732 A NO 20060732A NO 20060732 A NO20060732 A NO 20060732A NO 20060732 L NO20060732 L NO 20060732L
Authority
NO
Norway
Prior art keywords
solder paste
lead
free solder
dye material
solder
Prior art date
Application number
NO20060732A
Other languages
English (en)
Inventor
Tippy Wicker
Phodi Han
Original Assignee
Qualitek Internat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualitek Internat Inc filed Critical Qualitek Internat Inc
Publication of NO20060732L publication Critical patent/NO20060732L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Det er beskrevet blyfri loddepasta egnet for lodding av komponenter i elektroniske eller mikroelektroniske kretser omfattende et loddepulver og et fluksmedium. Fluksmediet innbefatter minst et farget fargestoffmateriale og minst et fluorescerende fargestoffmateriale. Loddepastaen undergår ved smelting en fargeendring fra en farget tilstand til en fargeløs, metallisk tilstand, og den smeltede loddepastaen fluorescerer under sort lys.
NO20060732A 2005-02-15 2006-02-15 Blyfri loddepasta NO20060732L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/058,126 US20060180245A1 (en) 2005-02-15 2005-02-15 Lead-free solder paste

Publications (1)

Publication Number Publication Date
NO20060732L true NO20060732L (no) 2006-08-16

Family

ID=36283969

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20060732A NO20060732L (no) 2005-02-15 2006-02-15 Blyfri loddepasta

Country Status (3)

Country Link
US (1) US20060180245A1 (no)
EP (1) EP1693142A1 (no)
NO (1) NO20060732L (no)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005053553A1 (de) * 2005-11-08 2007-05-16 Heraeus Gmbh W C Lotpasten mit harzfreien Flussmittel
DE602007006433D1 (de) * 2006-02-27 2010-06-24 Edwards Lifesciences Corp Verfahren zur herstellung einer aktiven elektrode unter verwendung von flexibler schaltungstechnologie und flexible schaltung umfassend eine solche elektrode
JP4757070B2 (ja) * 2006-03-27 2011-08-24 富士通株式会社 半田付け用フラックス及び半導体素子の接合方法
US20070284412A1 (en) * 2006-05-31 2007-12-13 Prakash Anna M Solder flux composition
JP4385061B2 (ja) * 2006-08-28 2009-12-16 ハリマ化成株式会社 はんだペースト組成物およびその用途
EP2183076A1 (en) * 2007-07-23 2010-05-12 Henkel Limited Solder flux
JP5043764B2 (ja) * 2008-06-30 2012-10-10 株式会社ジャパンユニックス レーザー式はんだ付け方法及び装置
DE102009031261A1 (de) * 2009-06-30 2011-03-10 Karl Storz Gmbh & Co. Kg Verfahren und Lot zum stoffschlüssigen Fügen zweier Oberflächen
US10987763B2 (en) * 2011-09-23 2021-04-27 Lucas-Milhaupt, Inc. Luminescent braze preforms
CN102528315B (zh) * 2012-01-11 2015-03-11 深圳市唯特偶新材料股份有限公司 一种焊层少空洞的无铅免清洗锡膏及其制备方法
US9731369B2 (en) * 2013-03-13 2017-08-15 Intel Corporation Interconnect alloy material and methods
WO2015028813A1 (en) * 2013-08-29 2015-03-05 Alpha Metals, Inc. Joining to aluminium
CN104416299B (zh) * 2013-09-06 2017-01-04 苏州优诺电子材料科技有限公司 一种水清洗型焊锡膏助焊剂
CN103537822B (zh) * 2013-10-25 2017-02-08 广州汉源新材料股份有限公司 一种预成型焊片喷涂用高浓度助焊剂
CN103706966B (zh) * 2013-12-11 2017-01-25 河南超威电源有限公司 铅酸蓄电池的汇流排的助焊剂
CN106002000A (zh) * 2016-06-23 2016-10-12 深圳市唯特偶新材料股份有限公司 一种焊锡膏及其制备方法
CN110315243B (zh) * 2019-07-03 2021-08-03 郑州机械研究所有限公司 一种铜磷钎料内熔渣的处理方法
CN111451669B (zh) * 2020-03-06 2021-08-13 深圳市唯特偶新材料股份有限公司 一种防飞溅激光焊锡膏制备方法
CN111390429B (zh) * 2020-04-21 2021-09-14 深圳市唯特偶新材料股份有限公司 焊接后成膜具有三防效果的助焊膏及其制备方法
CN112536494A (zh) * 2020-11-25 2021-03-23 深圳市洲明科技股份有限公司 锡膏、led与焊盘的焊接方法、led显示单元及其制作方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3139360A (en) * 1960-12-28 1964-06-30 Voida George Inspectable soldering flux composition
US3899339A (en) * 1972-10-12 1975-08-12 Ibm Water soluble solder resist
US4137369A (en) * 1977-05-03 1979-01-30 Wik-It Electronics Corporation Visual dye indicator of solder wicking action in metal coated copper braid
US4218248A (en) * 1978-04-21 1980-08-19 Scm Corporation Process for the manufacture of metal joining paste
US4373974A (en) * 1981-04-02 1983-02-15 Mcdonnell Douglas Corporation Solder composition
US4505421A (en) * 1981-10-05 1985-03-19 Raychem Corporation Soldering methods and devices
US4670298A (en) * 1985-12-09 1987-06-02 Northern Telecom Limited Fluorescent solder paste mixture
JP2580963B2 (ja) * 1993-07-28 1997-02-12 日本電気株式会社 粒子状はんだペースト
JP2622531B2 (ja) * 1994-06-03 1997-06-18 株式会社イースタン 着色ハンダ材料及びハンダ付け部に着色皮膜を形成する方法
JP3498427B2 (ja) * 1995-06-19 2004-02-16 ソニー株式会社 成形はんだ用フラックス
US5820697A (en) * 1997-04-18 1998-10-13 International Business Machines Corporation Fluorescent water soluble solder flux
US6194085B1 (en) * 1997-09-27 2001-02-27 International Business Machines Corporation Optical color tracer identifier in metal paste that bleed to greensheet
EP1180411A1 (en) * 2000-08-17 2002-02-20 Senju Metal Industry Co., Ltd. Lead-free paste for reflow soldering
US6896172B2 (en) * 2000-08-22 2005-05-24 Senju Metal Industry Co., Ltd. Lead-free solder paste for reflow soldering
JP2003275892A (ja) * 2002-03-20 2003-09-30 Tamura Kaken Co Ltd 無鉛はんだ合金及びソルダペースト組成物
TWI229931B (en) * 2002-05-15 2005-03-21 Amkor Technology Inc Solder ball and conductive wire for a semiconductor package, and its manufacturing method, and its evaporation method

Also Published As

Publication number Publication date
EP1693142A1 (en) 2006-08-23
US20060180245A1 (en) 2006-08-17

Similar Documents

Publication Publication Date Title
NO20060732L (no) Blyfri loddepasta
US20160245494A1 (en) Converter-cooling element assembly with metallic solder connection
NO20040106L (no) Forbedringer i og relatert til loddinger
ATE306354T1 (de) Lotmittel zur verwendung bei diffusionslotprozessen
US4670298A (en) Fluorescent solder paste mixture
EP1847580A4 (en) ADHESIVE ADHESIVE AND OPTICAL FILTER
TW200700537A (en) Green phosphor of thiogallate, red phosphor of alkaline earth sulfide and white light emitting device thereof
WO2006076066A3 (en) Light emission device
CN105436825B (zh) 一种led恒流源驱动电路模块的制作方法
DE60010590D1 (de) Verwendung einer bleifreien lotlegierungspaste zum herstellen von leiterplatten
PH12017501161B1 (en) Flux for fast-heating method, and solder paste for fast-heating method
WO2002010477A1 (fr) Pointe de fer de soudage electrique et fer de soudage electrique
CN106122824A (zh) Led灯条smt低温制程
US5714013A (en) Method of forming a colored membrane on soldered portion by employing colored solder materials
DE502006008143D1 (de) Verfahren zum löten von smd-bauteilen auf einer leiterplatte und reflow-lötofen dazu
ATE365195T1 (de) Gelbe tinte, tintensatz und aufzeichnungsmethode, aufzeichnungssystem und aufgezeichnetes material, die die tinte und den tintensatz verwenden
JP4632426B2 (ja) 発光ダイオード組立体の組立方法および発光ダイオード組立体
JP2005005546A (ja) Ｌｅｄ照明装置
TW200519216A (en) Pb-free solder alloy, and solder material and solder joint using same
JP2005317951A (ja) 発光ダイオード組立体の組立方法および発光ダイオード組立体
CN205535106U (zh) 一种ac cob光源模组
Otahal et al. Impact of solder paste drying on the solderability
JP2000151086A5 (no)
CN109659420A (zh) 一种高显色、宽光谱白光led光源
CN209418495U (zh) 一种新型led背光源封装结构

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application