NO20011896L - Höyfrekvent strömdempingslegeme som anvender et magnetisk tapsmateriale med utmerkede karakteristikker vedrörende denkomplekse permeabiliteten - Google Patents

Höyfrekvent strömdempingslegeme som anvender et magnetisk tapsmateriale med utmerkede karakteristikker vedrörende denkomplekse permeabiliteten

Info

Publication number
NO20011896L
NO20011896L NO20011896A NO20011896A NO20011896L NO 20011896 L NO20011896 L NO 20011896L NO 20011896 A NO20011896 A NO 20011896A NO 20011896 A NO20011896 A NO 20011896A NO 20011896 L NO20011896 L NO 20011896L
Authority
NO
Norway
Prior art keywords
high frequency
frequency current
excellent characteristics
damping body
magnetic loss
Prior art date
Application number
NO20011896A
Other languages
English (en)
Norwegian (no)
Other versions
NO20011896D0 (no
Inventor
Koji Kamei
Yoshio Awakura
Shinya Watanabe
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Publication of NO20011896D0 publication Critical patent/NO20011896D0/no
Publication of NO20011896L publication Critical patent/NO20011896L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/90—Magnetic feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/928—Magnetic property
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Thin Magnetic Films (AREA)
  • Hard Magnetic Materials (AREA)
  • Soft Magnetic Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Aerials With Secondary Devices (AREA)
  • Laminated Bodies (AREA)
NO20011896A 2000-04-17 2001-04-17 Höyfrekvent strömdempingslegeme som anvender et magnetisk tapsmateriale med utmerkede karakteristikker vedrörende denkomplekse permeabiliteten NO20011896L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000114667A JP2001297905A (ja) 2000-04-17 2000-04-17 高周波電流抑制体

Publications (2)

Publication Number Publication Date
NO20011896D0 NO20011896D0 (no) 2001-04-17
NO20011896L true NO20011896L (no) 2001-10-18

Family

ID=18626434

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20011896A NO20011896L (no) 2000-04-17 2001-04-17 Höyfrekvent strömdempingslegeme som anvender et magnetisk tapsmateriale med utmerkede karakteristikker vedrörende denkomplekse permeabiliteten

Country Status (10)

Country Link
US (1) US6921573B2 (ko)
EP (1) EP1148773B1 (ko)
JP (1) JP2001297905A (ko)
KR (1) KR100773197B1 (ko)
CN (1) CN1229827C (ko)
DE (1) DE60106123T2 (ko)
MY (1) MY128406A (ko)
NO (1) NO20011896L (ko)
SG (1) SG96614A1 (ko)
TW (1) TW501149B (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017888A (ja) * 2001-07-04 2003-01-17 Polymatech Co Ltd 電波吸収シート
JP2003023287A (ja) * 2001-07-05 2003-01-24 Polymatech Co Ltd 電波吸収シート
JP2003273571A (ja) * 2002-03-18 2003-09-26 Fujitsu Ltd 素子間干渉電波シールド型高周波モジュール
CN100364019C (zh) * 2002-12-27 2008-01-23 Tdk株式会社 粒状物、磁性薄膜以及磁性元件
WO2004086837A1 (ja) * 2003-03-25 2004-10-07 Shin-Etsu Polymer Co., Ltd. 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付物品、およびそれらの製造方法
JP4417377B2 (ja) * 2004-02-24 2010-02-17 信越ポリマー株式会社 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付構造体、およびそれらの製造方法
US7371471B2 (en) 2004-03-08 2008-05-13 Nec Tokin Corporation Electromagnetic noise suppressing thin film
WO2005086556A1 (ja) * 2004-03-08 2005-09-15 Nec Tokin Corporation 電磁雑音吸収薄膜
JP5156939B2 (ja) * 2006-02-06 2013-03-06 国立大学法人 名古屋工業大学 高周波軟磁性体膜の製造方法
KR100746184B1 (ko) * 2006-02-28 2007-08-03 훙-치 우 테이프 유형 자석
US7342172B1 (en) 2007-01-03 2008-03-11 Apple Inc. Cable with noise suppression
WO2010122877A1 (ja) * 2009-04-22 2010-10-28 アルプス電気株式会社 磁性部材を有するデバイス及びその製造方法
JP6144868B2 (ja) 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法
KR101716344B1 (ko) * 2011-06-28 2017-03-15 조인셋 주식회사 페라이트 시트 어셈블리 및 그 제조방법
JP6283615B2 (ja) 2011-12-21 2018-02-21 アモセンス・カンパニー・リミテッドＡｍｏｓｅｎｓｅ Ｃｏ．， Ｌｔｄ． 無線充電器用磁場遮蔽シート及びその製造方法と、それを用いた無線充電器用受信装置
KR101399022B1 (ko) * 2012-12-27 2014-05-27 주식회사 아모센스 전자파 흡수시트 및 그의 제조방법과 이를 포함하는 전자기기
JP2014195059A (ja) * 2013-02-27 2014-10-09 Shinko Electric Ind Co Ltd 電子装置
KR101443292B1 (ko) * 2013-05-28 2014-09-22 주식회사 아모센스 디지타이저용 자기장 차폐시트 및 이를 구비한 휴대 단말기
JP6661919B2 (ja) * 2015-08-25 2020-03-11 東洋インキＳｃホールディングス株式会社 フレキシブルプリント回路基板用またはフレキシブルフラットケーブル用電磁波抑制シートおよびこれを用いた電磁波抑制粘着シート
JP2017059627A (ja) * 2015-09-15 2017-03-23 日本合成化学工業株式会社 電磁波抑制シートおよびこれを用いた電磁波抑制粘着シート、電磁波抑制用樹脂組成物、電磁波抑制層
CN108022714B (zh) * 2016-10-31 2021-06-08 北京北方华创微电子装备有限公司 一种软磁薄膜及其制备方法
WO2019176612A1 (ja) * 2018-03-12 2019-09-19 マクセルホールディングス株式会社 電磁波吸収体用組成物、電磁波吸収体三次元造形物、それを用いた電子部品及び電子機器、並びにその電子部品及び電子機器の製造方法
CN111902036B (zh) * 2020-08-12 2023-09-22 宁波磁性材料应用技术创新中心有限公司 一种电磁波噪声抑制片材及高频电子设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3631696A1 (de) * 1986-09-18 1988-04-07 Wilde Membran Impuls Tech Metallisiertes, textiles flaechengebilde als schirmschutz gegen elektromagnetische strahlung bei elektrischen und elektronischen geraeten und bauteilen
US5439754A (en) * 1990-07-05 1995-08-08 Kabushiki Kaisha Toshiba Ferromagnetic film, method of manufacturing the same, and magnetic head
CA2092371C (en) * 1993-03-24 1999-06-29 Boris L. Livshits Integrated circuit packaging
JPH0993034A (ja) * 1995-09-22 1997-04-04 Tokin Corp 複合磁性体及びその製造方法ならびに電磁干渉抑制体
JPH1074613A (ja) * 1996-08-30 1998-03-17 Tokin Corp テープ、粘着テープ及び自己融着テープ
JP3900559B2 (ja) * 1996-09-19 2007-04-04 大同特殊鋼株式会社 磁気遮蔽用シートとその製造方法及びこれを用いたケーブル
EP1028611B1 (en) * 1997-06-24 2004-06-09 Bridgestone Corporation Electromagnetic wave shielding and light transmitting plate
WO2000019792A1 (fr) * 1998-09-30 2000-04-06 Hihakaikensa Co., Ltd Blindage de protection contre l'action des ondes radioelectriques ou des ondes magnetiques et structure de blindage pour l'effet de bord
WO2001039219A1 (en) * 1999-11-26 2001-05-31 Fujitsu Limited Magnetic thin film, method for forming magnetic thin film, and recording head
SG96612A1 (en) * 2000-04-04 2003-06-16 Nec Tokin Corp Electronic component of a high frequency current suppression type and bonding wire for the same

Also Published As

Publication number Publication date
US6921573B2 (en) 2005-07-26
JP2001297905A (ja) 2001-10-26
DE60106123D1 (de) 2004-11-11
NO20011896D0 (no) 2001-04-17
TW501149B (en) 2002-09-01
EP1148773A1 (en) 2001-10-24
DE60106123T2 (de) 2005-11-24
MY128406A (en) 2007-01-31
EP1148773B1 (en) 2004-10-06
CN1229827C (zh) 2005-11-30
SG96614A1 (en) 2003-06-16
US20020074144A1 (en) 2002-06-20
KR100773197B1 (ko) 2007-11-02
CN1318849A (zh) 2001-10-24
KR20010098654A (ko) 2001-11-08

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