NO167107C - Apparat for maaling av varmespenninger i trykkdeler. - Google Patents
Apparat for maaling av varmespenninger i trykkdeler.Info
- Publication number
- NO167107C NO167107C NO851625A NO851625A NO167107C NO 167107 C NO167107 C NO 167107C NO 851625 A NO851625 A NO 851625A NO 851625 A NO851625 A NO 851625A NO 167107 C NO167107 C NO 167107C
- Authority
- NO
- Norway
- Prior art keywords
- measured values
- basis
- temperature
- fluid temperature
- tube
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L23/00—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B35/00—Control systems for steam boilers
- F22B35/18—Applications of computers to steam boiler control
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M99/00—Subject matter not provided for in other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Biochemistry (AREA)
- Thermal Sciences (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Control Of Steam Boilers And Waste-Gas Boilers (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Measuring Fluid Pressure (AREA)
- Monitoring And Testing Of Nuclear Reactors (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Control Of Turbines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59081158A JPS60226603A (ja) | 1984-04-24 | 1984-04-24 | ボイラ熱応力予測装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
NO851625L NO851625L (no) | 1985-10-25 |
NO167107B NO167107B (no) | 1991-06-24 |
NO167107C true NO167107C (no) | 1991-10-02 |
Family
ID=13738634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO851625A NO167107C (no) | 1984-04-24 | 1985-04-23 | Apparat for maaling av varmespenninger i trykkdeler. |
Country Status (10)
Country | Link |
---|---|
US (1) | US4792912A (no) |
EP (1) | EP0165675B2 (no) |
JP (1) | JPS60226603A (no) |
KR (1) | KR900005780B1 (no) |
AU (2) | AU590195B2 (no) |
DE (1) | DE3578532D1 (no) |
FI (1) | FI86109C (no) |
IN (1) | IN164821B (no) |
NO (1) | NO167107C (no) |
ZA (1) | ZA853058B (no) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4888953A (en) * | 1987-11-13 | 1989-12-26 | Babcock-Hitachi Kabushiki Kaisha | Apparatus for controlling boiler/turbine plant |
US5157619A (en) * | 1988-10-31 | 1992-10-20 | Westinghouse Electric Corp. | Abnormal thermal loading effects monitoring system |
US5050108A (en) * | 1989-11-30 | 1991-09-17 | Aptech Engineering, Inc. | Method for extending the useful life of boiler tubes |
US5018356A (en) * | 1990-10-10 | 1991-05-28 | Westinghouse Electric Corp. | Temperature control of a steam turbine steam to minimize thermal stresses |
JP3042066B2 (ja) * | 1991-09-05 | 2000-05-15 | 株式会社日立製作所 | プラントの制御システム |
US5621654A (en) * | 1994-04-15 | 1997-04-15 | Long Island Lighting Company | System and method for economic dispatching of electrical power |
JP2001082391A (ja) * | 1999-09-10 | 2001-03-27 | Ishikawajima Harima Heavy Ind Co Ltd | 流体機械の熱流体解析・熱応力解析方法 |
KR20010103232A (ko) | 2000-05-08 | 2001-11-23 | 윤덕용 | 콘크리트 구조물의 온도응력 측정장치 및 방법 |
DE10060706A1 (de) * | 2000-12-07 | 2002-06-13 | Flowtec Ag | Verfahren und eine Vorrichtung zur System- und/oder Prozeßüberwachung |
EP2837777A1 (en) * | 2013-08-16 | 2015-02-18 | ABB Technology AG | Method for calculating thermal stress in a thick-walled component of a thermal system |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2002543B (en) * | 1977-07-29 | 1982-02-17 | Hitachi Ltd | Rotor-stress preestimating turbine control system |
US4173891A (en) * | 1978-01-12 | 1979-11-13 | Rockwell International Corporation | Method and apparatus for measuring gas flow |
GB1601890A (en) * | 1978-05-31 | 1981-11-04 | Sira Institute | Apparatus and method for indicating stress in an object |
SE427502B (sv) * | 1979-03-16 | 1983-04-11 | Memoteknik Ab | Vermegenomgangsmetare |
JPS5651631A (en) * | 1979-10-02 | 1981-05-09 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Measuring instrument for surface temperature distribution |
JPS5717810A (en) * | 1980-07-07 | 1982-01-29 | Nippon Denso Co Ltd | Alarm method and device for vehicle |
JPS5835304A (ja) * | 1981-08-28 | 1983-03-02 | 株式会社日立製作所 | 高圧給水加熱器のウオ−ミング方法及び同装置 |
-
1984
- 1984-04-24 JP JP59081158A patent/JPS60226603A/ja active Granted
-
1985
- 1985-04-20 IN IN302/MAS/85A patent/IN164821B/en unknown
- 1985-04-22 FI FI851582A patent/FI86109C/fi not_active IP Right Cessation
- 1985-04-23 NO NO851625A patent/NO167107C/no not_active IP Right Cessation
- 1985-04-24 DE DE8585302879T patent/DE3578532D1/de not_active Expired - Lifetime
- 1985-04-24 US US06/726,645 patent/US4792912A/en not_active Expired - Lifetime
- 1985-04-24 EP EP85302879A patent/EP0165675B2/en not_active Expired - Lifetime
- 1985-04-24 ZA ZA853058A patent/ZA853058B/xx unknown
- 1985-04-24 AU AU41692/85A patent/AU590195B2/en not_active Ceased
- 1985-04-24 KR KR1019850002764A patent/KR900005780B1/ko not_active IP Right Cessation
-
1990
- 1990-01-29 AU AU48785/90A patent/AU634998B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
FI851582A0 (fi) | 1985-04-22 |
ZA853058B (en) | 1985-12-24 |
FI86109C (fi) | 1992-07-10 |
KR850007484A (ko) | 1985-12-04 |
IN164821B (no) | 1989-06-10 |
FI86109B (fi) | 1992-03-31 |
JPS60226603A (ja) | 1985-11-11 |
EP0165675B1 (en) | 1990-07-04 |
DE3578532D1 (de) | 1990-08-09 |
AU590195B2 (en) | 1989-11-02 |
NO851625L (no) | 1985-10-25 |
EP0165675A3 (en) | 1987-05-27 |
EP0165675A2 (en) | 1985-12-27 |
KR900005780B1 (ko) | 1990-08-11 |
NO167107B (no) | 1991-06-24 |
AU4169285A (en) | 1985-10-31 |
EP0165675B2 (en) | 1994-12-07 |
AU4878590A (en) | 1990-05-17 |
FI851582L (fi) | 1985-10-25 |
JPH0473041B2 (no) | 1992-11-19 |
US4792912A (en) | 1988-12-20 |
AU634998B2 (en) | 1993-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM1K | Lapsed by not paying the annual fees |