KR850007484A - 내압튜브의 열응력 예측장치 - Google Patents

내압튜브의 열응력 예측장치 Download PDF

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Publication number
KR850007484A
KR850007484A KR1019850002764A KR850002764A KR850007484A KR 850007484 A KR850007484 A KR 850007484A KR 1019850002764 A KR1019850002764 A KR 1019850002764A KR 850002764 A KR850002764 A KR 850002764A KR 850007484 A KR850007484 A KR 850007484A
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KR
South Korea
Prior art keywords
pressure
thermal stress
tube
measured values
resistant tube
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KR1019850002764A
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English (en)
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KR900005780B1 (ko
Inventor
아쯔시(외 2) 구라모도
Original Assignee
후꾸다 이꾸마사
바부콕구 히다찌 가부시기 가이샤
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Application filed by 후꾸다 이꾸마사, 바부콕구 히다찌 가부시기 가이샤 filed Critical 후꾸다 이꾸마사
Publication of KR850007484A publication Critical patent/KR850007484A/ko
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Publication of KR900005780B1 publication Critical patent/KR900005780B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L23/00—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
    • F22B35/00—Control systems for steam boilers
    • F22B35/18—Applications of computers to steam boiler control
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Biochemistry (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Control Of Steam Boilers And Waste-Gas Boilers (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Measuring Fluid Pressure (AREA)
  • Monitoring And Testing Of Nuclear Reactors (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Control Of Turbines (AREA)

Abstract

내용 없음

Description

내압튜브의 열응력 예측장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 본 발명의 실시예에 관한 보일러 열응력 예측장치의 개략계통도, 제 2도는 제 1도의 헤더의 상세도.
도면의 주요부분에 대한 부호의 설명
(1) : 헤더(header), (2) : 노즐코오너부, (3),(4) : 실측지, (5) : 금속내면 온도검출기, (6) : 금속내면온도실측치, (7) : 금속외면 온도검출기, (8) : 금속외면 온도실측치, (9) : 온도분포 기억장치, (10) : 온도분포기억장치, (11) : 온도분포 연산기, (12) : 금속후육방향 온도분포연산치, (13) : 유체온도 계측기, (14) : 유체온도 검출기, (15) : 유체온도실측기, (16) : 연산사이클 설정기, (17) : 연산사이클 설정치, (18) : 열응력연산기, (19) : 열응력 연산치, (20) : 압력계측기, (21) : 압력검출기, (22) : 증기압력실측기, (23) : 내압응력연산기, (24) : 내압응력연산치, (25) : 응력연산기, (26) : 현재응력연산치, (27) : 수명소비산출기, (28) : 수명소비산출치, (29) : 응력제한치설정기, (30) : 응력제한설정치, (31) : 비교기, (32) : 부하홀드신호발생기, (33) : 부하홀드신호, (34) : 보일러부하제어기, (35) : 부하변화율설정기, (36) : 부하변화율 설정치.

Claims (8)

  1. 내압튜브의 금속부분의 실측치(3),(4)를 기초로 이 튜브의 후육방향에 있어서의 등분의 온도분포를 연산하는 온도분포 연산기(11)와, 이것들의 연산치를 기초로 튜브의 금속부분의 열응력을 계산하는 열응력 연산기(18)를 포함하는 내압튜브의 열응력 예측장치.
  2. 제1항에 있어서, 설측치(3),(4)는 튜브의 금속내면 및 외면온도의 실측치임을 특징으로 하는 내압튜브의 열응력 예측장치.
  3. 제1항에 있어서, 실측치(3),(4)는 튜브내의 유체의 온도, 압력, 유량 및 금속외면 온도의 실측치(3),(4)임을 특징으로 하는 내압튜브의 열응력 예측장치.
  4. 제1항에 있어서, 내압튜브는 보일러에 마련하고 있음을 특징으로 하는 내압튜브의 열응력 예측장치.
  5. 내압튜브의 금속부분의 실측치(3),(4)를 기초로 이 튜브의 후육방향에 있어서의 등분의 온도분포를 연산하는 온도분포연산기(11)와, 이것들의 연산치를 기초로 튜브의 금속부분의 열응력을 계산하는 열응력 연산기(11)와 내열튜브의 유체온도실측치(13)를 기초로 연산사이클을 설정하는 연산사이클 설정기(16)를 포함하였으며, 이 연산사이클은 유체온도실측치(13)변화가 작을때에는 길어지도록 설정되는 내얍튜브의 열응력 예측장치.
  6. 제5항에 있어서, 실측치(3),(4)는 튜브의 금속내면 및 외면온도의 실측치임을 특징으로 하는 내압튜브의 열응력 예측장치.
  7. 제5항에 있어서, 실측치(3),(4)는 튜브내의 유체의 온도, 압력, 유량 및 금속외면 온도의 실측치임을 특징으로 하는 내압튜브의 열응력 예측장치.
  8. 제5항에 있어서, 내압튜브는 보일러에 마련되어 있음을 특징으로 하는 내압튜브의 열응력 예측장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850002764A 1984-04-24 1985-04-24 내압튜브의 열응력 예측장치 KR900005780B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59081158A JPS60226603A (ja) 1984-04-24 1984-04-24 ボイラ熱応力予測装置
JP84-81158 1984-04-24

Publications (2)

Publication Number Publication Date
KR850007484A true KR850007484A (ko) 1985-12-04
KR900005780B1 KR900005780B1 (ko) 1990-08-11

Family

ID=13738634

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850002764A KR900005780B1 (ko) 1984-04-24 1985-04-24 내압튜브의 열응력 예측장치

Country Status (10)

Country Link
US (1) US4792912A (ko)
EP (1) EP0165675B2 (ko)
JP (1) JPS60226603A (ko)
KR (1) KR900005780B1 (ko)
AU (2) AU590195B2 (ko)
DE (1) DE3578532D1 (ko)
FI (1) FI86109C (ko)
IN (1) IN164821B (ko)
NO (1) NO167107C (ko)
ZA (1) ZA853058B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100662996B1 (ko) * 1999-09-10 2006-12-28 이시카와지마-하리마 주고교 가부시키가이샤 액체기계의 열유체 해석 및 열응력 해석 방법

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4888953A (en) * 1987-11-13 1989-12-26 Babcock-Hitachi Kabushiki Kaisha Apparatus for controlling boiler/turbine plant
US5157619A (en) * 1988-10-31 1992-10-20 Westinghouse Electric Corp. Abnormal thermal loading effects monitoring system
US5050108A (en) * 1989-11-30 1991-09-17 Aptech Engineering, Inc. Method for extending the useful life of boiler tubes
US5018356A (en) * 1990-10-10 1991-05-28 Westinghouse Electric Corp. Temperature control of a steam turbine steam to minimize thermal stresses
JP3042066B2 (ja) * 1991-09-05 2000-05-15 株式会社日立製作所 プラントの制御システム
US5621654A (en) * 1994-04-15 1997-04-15 Long Island Lighting Company System and method for economic dispatching of electrical power
KR20010103232A (ko) 2000-05-08 2001-11-23 윤덕용 콘크리트 구조물의 온도응력 측정장치 및 방법
DE10060706A1 (de) * 2000-12-07 2002-06-13 Flowtec Ag Verfahren und eine Vorrichtung zur System- und/oder Prozeßüberwachung
EP2837777A1 (en) * 2013-08-16 2015-02-18 ABB Technology AG Method for calculating thermal stress in a thick-walled component of a thermal system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2002543B (en) * 1977-07-29 1982-02-17 Hitachi Ltd Rotor-stress preestimating turbine control system
US4173891A (en) * 1978-01-12 1979-11-13 Rockwell International Corporation Method and apparatus for measuring gas flow
GB1601890A (en) * 1978-05-31 1981-11-04 Sira Institute Apparatus and method for indicating stress in an object
SE427502B (sv) * 1979-03-16 1983-04-11 Memoteknik Ab Vermegenomgangsmetare
JPS5651631A (en) * 1979-10-02 1981-05-09 Chiyou Lsi Gijutsu Kenkyu Kumiai Measuring instrument for surface temperature distribution
JPS5717810A (en) * 1980-07-07 1982-01-29 Nippon Denso Co Ltd Alarm method and device for vehicle
JPS5835304A (ja) * 1981-08-28 1983-03-02 株式会社日立製作所 高圧給水加熱器のウオ−ミング方法及び同装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100662996B1 (ko) * 1999-09-10 2006-12-28 이시카와지마-하리마 주고교 가부시키가이샤 액체기계의 열유체 해석 및 열응력 해석 방법

Also Published As

Publication number Publication date
FI86109C (fi) 1992-07-10
IN164821B (ko) 1989-06-10
AU4878590A (en) 1990-05-17
US4792912A (en) 1988-12-20
FI86109B (fi) 1992-03-31
FI851582L (fi) 1985-10-25
AU4169285A (en) 1985-10-31
AU634998B2 (en) 1993-03-11
ZA853058B (en) 1985-12-24
EP0165675A2 (en) 1985-12-27
AU590195B2 (en) 1989-11-02
EP0165675B1 (en) 1990-07-04
EP0165675B2 (en) 1994-12-07
NO851625L (no) 1985-10-25
DE3578532D1 (de) 1990-08-09
NO167107C (no) 1991-10-02
JPS60226603A (ja) 1985-11-11
FI851582A0 (fi) 1985-04-22
EP0165675A3 (en) 1987-05-27
KR900005780B1 (ko) 1990-08-11
JPH0473041B2 (ko) 1992-11-19
NO167107B (no) 1991-06-24

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