Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L23/00—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F22—STEAM GENERATION
  • F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
  • F22B35/00—Control systems for steam boilers
  • F22B35/18—Applications of computers to steam boiler control
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
  • G01M99/00—Subject matter not provided for in other groups of this subclass
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N25/00—Investigating or analyzing materials by the use of thermal means
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
  • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
  • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
  • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
  • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
  • H01L2224/29001—Core members of the layer connector
  • H01L2224/29099—Material
  • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
  • H01L2224/29298—Fillers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/00013—Fully indexed content

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Chemical & Material Sciences (AREA)
• General Physics & Mathematics (AREA)
• Combustion & Propulsion (AREA)
• Biochemistry (AREA)
• Thermal Sciences (AREA)
• Analytical Chemistry (AREA)
• Immunology (AREA)
• Pathology (AREA)
• Life Sciences & Earth Sciences (AREA)
• Health & Medical Sciences (AREA)
• General Health & Medical Sciences (AREA)
• Mechanical Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Control Of Steam Boilers And Waste-Gas Boilers (AREA)
• Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
• Measuring Fluid Pressure (AREA)
• Investigating Or Analyzing Materials Using Thermal Means (AREA)
• Monitoring And Testing Of Nuclear Reactors (AREA)
• Control Of Turbines (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=13738634

Family Applications (1)

Country Status (10)

Families Citing this family (10)

Family Cites Families (7)

• 1984
  • 1984-04-24 JP JP59081158A patent/JPS60226603A/ja active Granted
• 1985
  • 1985-04-20 IN IN302/MAS/85A patent/IN164821B/en unknown
  • 1985-04-22 FI FI851582A patent/FI86109C/fi not_active IP Right Cessation
  • 1985-04-23 NO NO851625A patent/NO167107C/no not_active IP Right Cessation
  • 1985-04-24 AU AU41692/85A patent/AU590195B2/en not_active Ceased
  • 1985-04-24 KR KR1019850002764A patent/KR900005780B1/ko not_active IP Right Cessation
  • 1985-04-24 US US06/726,645 patent/US4792912A/en not_active Expired - Lifetime
  • 1985-04-24 EP EP85302879A patent/EP0165675B2/en not_active Expired - Lifetime
  • 1985-04-24 DE DE8585302879T patent/DE3578532D1/de not_active Expired - Lifetime
  • 1985-04-24 ZA ZA853058A patent/ZA853058B/xx unknown
• 1990
  • 1990-01-29 AU AU48785/90A patent/AU634998B2/en not_active Ceased

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