NO154370C - Fremgangsmaate til toerr, selektiv sensibilisering av et isolerende substrats overflate. - Google Patents

Fremgangsmaate til toerr, selektiv sensibilisering av et isolerende substrats overflate.

Info

Publication number
NO154370C
NO154370C NO80803710A NO803710A NO154370C NO 154370 C NO154370 C NO 154370C NO 80803710 A NO80803710 A NO 80803710A NO 803710 A NO803710 A NO 803710A NO 154370 C NO154370 C NO 154370C
Authority
NO
Norway
Prior art keywords
sensibilization
tour
selective
procedure
substrate surface
Prior art date
Application number
NO80803710A
Other languages
English (en)
Other versions
NO803710L (no
NO154370B (no
Inventor
Gunnar Soerensen
Leo Gulvad Svendsen
Original Assignee
Neselco As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neselco As filed Critical Neselco As
Publication of NO803710L publication Critical patent/NO803710L/no
Publication of NO154370B publication Critical patent/NO154370B/no
Publication of NO154370C publication Critical patent/NO154370C/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/225—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 using contact-printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
    • G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
NO80803710A 1979-04-11 1980-12-09 Fremgangsmaate til toerr, selektiv sensibilisering av et isolerende substrats overflate. NO154370C (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DK150779A DK153337C (da) 1979-04-11 1979-04-11 Fremgangsmaade til toer sensibilisering af en isolerende overflade

Publications (3)

Publication Number Publication Date
NO803710L NO803710L (no) 1980-12-09
NO154370B NO154370B (no) 1986-05-26
NO154370C true NO154370C (no) 1986-09-03

Family

ID=8105559

Family Applications (1)

Application Number Title Priority Date Filing Date
NO80803710A NO154370C (no) 1979-04-11 1980-12-09 Fremgangsmaate til toerr, selektiv sensibilisering av et isolerende substrats overflate.

Country Status (12)

Country Link
US (1) US4504529A (no)
EP (1) EP0026211B1 (no)
JP (1) JPH0210593B2 (no)
CA (1) CA1162778A (no)
DE (1) DE3067809D1 (no)
DK (1) DK153337C (no)
IE (1) IE49192B1 (no)
IL (1) IL59807A (no)
IT (1) IT1128410B (no)
NO (1) NO154370C (no)
WO (1) WO1980002222A1 (no)
ZA (1) ZA802121B (no)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK427780A (da) * 1980-10-10 1982-04-11 Neselco As Pulver til brug ved toer sensibilisering for stroemloes metallisering
DK148327C (da) * 1981-07-24 1985-11-04 Neselco As Pulver til brug ved toer sensibilisering for stroemloes metallisering
DE3134507A1 (de) * 1981-09-01 1983-03-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt "verfahren zur selektiven chemischen metallabscheidung"
DK153572C (da) * 1982-02-18 1988-12-19 Platonec Aps Pulver til brug ved toer aktivering for stroemloes metallisering, fremgangsmaade til fremstilling deraf samt anvendelse deraf
IT1184408B (it) * 1985-04-09 1987-10-28 Telettra Lab Telefon Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi
US5244525A (en) * 1987-11-02 1993-09-14 Kimberly-Clark Corporation Methods for bonding, cutting and printing polymeric materials using xerographic printing of IR absorbing material
US4851320A (en) * 1988-05-23 1989-07-25 Tektronix, Inc. Method of forming a pattern of conductor runs on a dielectric sheet
US5213850A (en) * 1989-03-24 1993-05-25 Nippon Paint Co., Ltd. Process for plating a metallic deposit between functional pattern lines on a substrate
EP0487291B1 (en) 1990-11-19 1999-09-29 Loctite Corporation Photocurable silicon composition, and method of making same
US5269980A (en) * 1991-08-05 1993-12-14 Northeastern University Production of polymer particles in powder form using an atomization technique
DE4142658A1 (de) * 1991-12-19 1993-06-24 Siemens Ag Verfahren zum aufbringen von lot auf eine leiterplatte
US5304447A (en) * 1992-02-11 1994-04-19 Elf Technologies, Inc. Plateable toner and method for producing the same
DE4319759A1 (de) * 1993-06-15 1994-12-22 Bayer Ag Pulvermischungen zum Metallisieren von Substratoberflächen
DE19731346C2 (de) * 1997-06-06 2003-09-25 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und ein Verfahren zu deren Herstellung
DE19942054A1 (de) * 1999-09-03 2001-12-06 Schott Glas Verfahren zur Herstellung einer gedruckten Schaltung
IL159175A0 (en) * 2001-06-04 2004-06-01 Qinetiq Ltd Patterning method
GB2381274A (en) * 2001-10-29 2003-04-30 Qinetiq Ltd High resolution patterning method
GB2382798A (en) * 2001-12-04 2003-06-11 Qinetiq Ltd Inkjet printer which deposits at least two fluids on a substrate such that the fluids react chemically to form a product thereon
US20040265531A1 (en) * 2003-06-30 2004-12-30 Mckean Dennis R. Sliders bonded by a debondable silicon-based encapsulant
EP2003939A1 (en) 2007-06-14 2008-12-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method for preparing a pattern for a 3-dimensional electric circuit
US9017773B2 (en) * 2010-01-14 2015-04-28 The Regents Of The University Of California Universal solution for growing thin films of electrically conductive nanostructures
JP6546094B2 (ja) 2012-10-12 2019-07-17 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア ポリアニリン膜ならびにその用途および方法
SG10201709347VA (en) 2013-05-15 2017-12-28 Univ California Polyaniline membranes formed by phase inversion for forward osmosis applications
HUE056589T2 (hu) 2014-04-08 2022-03-28 Univ California Polianilin-alapú, klórreszisztens, hidrofil szûrõmembránok

Family Cites Families (33)

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GB299903A (en) * 1927-08-02 1928-11-02 Albert Ivan Gates Warren Improvements in processes for coating non-conducting substances with metals
GB567503A (en) * 1943-06-02 1945-02-16 Frank Enoch Kerridge Improvements in or relating to the production of metallic designs on non-metallic materials
US2910351A (en) * 1955-01-03 1959-10-27 Gen Electric Method of making printed circuit
US2947625A (en) * 1955-12-21 1960-08-02 Ibm Method of manufacturing printed circuits
US2966429A (en) * 1956-08-31 1960-12-27 Gen Electric Method of and apparatus for making printed circuits
US3043685A (en) * 1957-07-18 1962-07-10 Xerox Corp Xerographic and magnetic image recording and reproducing
US2939804A (en) * 1958-01-23 1960-06-07 Uarco Inc Resin particle coated with metal
NL113853C (no) * 1959-07-22
US3231374A (en) * 1960-09-02 1966-01-25 Rca Corp Methods for preparing etch resists using an electrostatic image developer composition
US3275436A (en) * 1962-07-24 1966-09-27 Xerox Corp Method of image reproduction utilizing a uniform releasable surface film
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US3942983A (en) * 1967-06-09 1976-03-09 Minnesota Mining And Manufacturing Company Electroless deposition of a non-noble metal on light generated nuclei of a metal more noble than silver
FR1593570A (no) * 1967-09-14 1970-06-01
NL157659B (nl) * 1967-09-22 1978-08-15 Philips Nv Werkwijze voor het langs fotografische weg vervaardigen van elektrisch geleidende koperpatronen.
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CA929705A (en) * 1969-01-13 1973-07-10 Ransburg Corporation Deposition materials and methods
US3691993A (en) * 1970-11-23 1972-09-19 Ibm Apparatus for transferring developed image
DE2159467A1 (de) * 1970-12-02 1972-07-13 Minolta Camera Kk Verfahren zur Herstellung eines flüssigen Entwicklers für die Elektrophotographie
US3745045A (en) * 1971-01-06 1973-07-10 R Brenneman Electrical contact surface using an ink containing a plating catalyst
US3880689A (en) * 1971-09-30 1975-04-29 Eastman Kodak Co Magnetic developer containing an electroless plating sensitizer, and method of using same
BE789988A (fr) * 1971-10-12 1973-04-12 Xerox Corp Composition de revelateur et procede pour son emploi
CA986770A (en) * 1972-04-10 1976-04-06 Jack C. Goldfrank Pressure fixable magnetic toners
JPS511434B2 (no) * 1972-05-15 1976-01-17
JPS5187042A (no) * 1975-01-29 1976-07-30 Hitachi Metals Ltd
JPS5196330A (no) * 1975-02-21 1976-08-24
US4042730A (en) * 1976-03-29 1977-08-16 Bell Telephone Laboratories, Incorporated Process for electroless plating using separate sensitization and activation steps
JPS5841760B2 (ja) * 1976-05-29 1983-09-14 神崎製紙株式会社 呈色剤の製造方法
NL7704238A (nl) * 1977-04-19 1978-10-23 Philips Nv Werkwijze voor het additief vervaardigen van bedradingspatronen.
US4307168A (en) * 1977-05-05 1981-12-22 Eastman Kodak Company Amplification of developed electrographic image patterns
JPS54126959A (en) * 1978-03-25 1979-10-02 Nippon Mektron Kk Method of producing circuit board

Also Published As

Publication number Publication date
IE49192B1 (en) 1985-08-21
DE3067809D1 (en) 1984-06-20
DK153337C (da) 1988-11-14
WO1980002222A1 (en) 1980-10-16
NO803710L (no) 1980-12-09
US4504529A (en) 1985-03-12
JPS56500435A (no) 1981-04-02
IE800732L (en) 1980-10-11
IL59807A (en) 1983-11-30
JPH0210593B2 (no) 1990-03-08
CA1162778A (en) 1984-02-28
DK153337B (da) 1988-07-04
EP0026211A1 (en) 1981-04-08
IT8067559A0 (it) 1980-04-10
EP0026211B1 (en) 1984-05-16
NO154370B (no) 1986-05-26
DK150779A (da) 1980-10-12
IT1128410B (it) 1986-05-28
ZA802121B (en) 1981-04-29

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