DK148327C - Pulver til brug ved toer sensibilisering for stroemloes metallisering - Google Patents

Pulver til brug ved toer sensibilisering for stroemloes metallisering

Info

Publication number
DK148327C
DK148327C DK330081A DK330081A DK148327C DK 148327 C DK148327 C DK 148327C DK 330081 A DK330081 A DK 330081A DK 330081 A DK330081 A DK 330081A DK 148327 C DK148327 C DK 148327C
Authority
DK
Denmark
Prior art keywords
sensibilization
throttle
powder used
current metallization
metallization
Prior art date
Application number
DK330081A
Other languages
English (en)
Other versions
DK330081A (da
DK148327B (da
Inventor
Gunnar Soerensen
Leo Gulvad Svendsen
Original Assignee
Neselco As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neselco As filed Critical Neselco As
Priority to DK330081A priority Critical patent/DK148327C/da
Priority to IE1755/82A priority patent/IE54368B1/en
Priority to US06/400,884 priority patent/US4495216A/en
Priority to CA000407941A priority patent/CA1213993A/en
Priority to JP57127777A priority patent/JPS5848661A/ja
Priority to NO822555A priority patent/NO822555L/no
Priority to DE8282106695T priority patent/DE3266828D1/de
Priority to EP82106695A priority patent/EP0071218B1/en
Priority to IL66389A priority patent/IL66389A/xx
Priority to AU86414/82A priority patent/AU549498B2/en
Publication of DK330081A publication Critical patent/DK330081A/da
Publication of DK148327B publication Critical patent/DK148327B/da
Application granted granted Critical
Publication of DK148327C publication Critical patent/DK148327C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Chemically Coating (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DK330081A 1981-07-24 1981-07-24 Pulver til brug ved toer sensibilisering for stroemloes metallisering DK148327C (da)

Priority Applications (10)

Application Number Priority Date Filing Date Title
DK330081A DK148327C (da) 1981-07-24 1981-07-24 Pulver til brug ved toer sensibilisering for stroemloes metallisering
US06/400,884 US4495216A (en) 1981-07-24 1982-07-22 Powder for use in dry sensitization for electroless plating
IE1755/82A IE54368B1 (en) 1981-07-24 1982-07-22 Powder for use in dry sensitization for electroless metal deposition
JP57127777A JPS5848661A (ja) 1981-07-24 1982-07-23 乾式感受性化処理に使用される粉末
CA000407941A CA1213993A (en) 1981-07-24 1982-07-23 Dry sensitization plastic powder for electroless metal deposition
NO822555A NO822555L (no) 1981-07-24 1982-07-23 Pulver til bruk ved toerrsensibilisering for stroemloes metallisering.
DE8282106695T DE3266828D1 (en) 1981-07-24 1982-07-23 Powder for use in dry sensitization for electroless metal deposition
EP82106695A EP0071218B1 (en) 1981-07-24 1982-07-23 Powder for use in dry sensitization for electroless metal deposition
IL66389A IL66389A (en) 1981-07-24 1982-07-25 Powder for use in dry sensitization for electroless metal deposition
AU86414/82A AU549498B2 (en) 1981-07-24 1982-07-26 A powder for use in dry sensitization for electroless metal deposition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK330081 1981-07-24
DK330081A DK148327C (da) 1981-07-24 1981-07-24 Pulver til brug ved toer sensibilisering for stroemloes metallisering

Publications (3)

Publication Number Publication Date
DK330081A DK330081A (da) 1983-01-25
DK148327B DK148327B (da) 1985-06-10
DK148327C true DK148327C (da) 1985-11-04

Family

ID=8121361

Family Applications (1)

Application Number Title Priority Date Filing Date
DK330081A DK148327C (da) 1981-07-24 1981-07-24 Pulver til brug ved toer sensibilisering for stroemloes metallisering

Country Status (10)

Country Link
US (1) US4495216A (da)
EP (1) EP0071218B1 (da)
JP (1) JPS5848661A (da)
AU (1) AU549498B2 (da)
CA (1) CA1213993A (da)
DE (1) DE3266828D1 (da)
DK (1) DK148327C (da)
IE (1) IE54368B1 (da)
IL (1) IL66389A (da)
NO (1) NO822555L (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK148327C (da) * 1981-07-24 1985-11-04 Neselco As Pulver til brug ved toer sensibilisering for stroemloes metallisering
DK153572C (da) * 1982-02-18 1988-12-19 Platonec Aps Pulver til brug ved toer aktivering for stroemloes metallisering, fremgangsmaade til fremstilling deraf samt anvendelse deraf
US5536661A (en) * 1987-03-10 1996-07-16 Novo Nordisk A/S Process for the production of protein products in aspergillus
JPH0791492B2 (ja) * 1986-09-18 1995-10-04 保土谷化学工業株式会社 静電塗装用樹脂粉体組成物
US4798856A (en) * 1987-11-06 1989-01-17 Columbian Chemicals Co. Pigment dispersion in resin
US5304447A (en) * 1992-02-11 1994-04-19 Elf Technologies, Inc. Plateable toner and method for producing the same
US5389229A (en) * 1993-06-18 1995-02-14 Surface Technology, Inc. Prestabilization of particulate matter prior to their dispersion
DE19622886A1 (de) * 1996-06-07 1997-12-11 Boehringer Mannheim Gmbh Trockene Polymerbeadzubereitung
US6268016B1 (en) 1996-06-28 2001-07-31 International Business Machines Corporation Manufacturing computer systems with fine line circuitized substrates
US20030151028A1 (en) * 2002-02-14 2003-08-14 Lawrence Daniel P. Conductive flexographic and gravure ink
US20200017665A1 (en) * 2018-07-10 2020-01-16 Nano And Advanced Materials Institute Limited Germ-repellent material

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2308020A1 (de) * 1973-02-17 1974-08-22 Dynamit Nobel Ag Selbsthaftende pulverbeschichtungen auf basis pvc-copolymerisaten
DE2326978A1 (de) * 1973-05-26 1974-12-19 Neynaber Chemie Gmbh Zusatzmittel zu formmassen auf basis waermehaertbarer kondensationsharze fuer deren formgebende verarbeitung
US3983263A (en) * 1974-06-27 1976-09-28 General Motors Corporation Powdered acrylic paint composition and method
JPS5196330A (da) * 1975-02-21 1976-08-24
US4287253A (en) * 1975-04-08 1981-09-01 Photocircuits Division Of Kollmorgen Corp. Catalytic filler for electroless metallization of hole walls
US4116924A (en) * 1975-07-15 1978-09-26 Hercules Incorporated Pigment concentrations
US4020009A (en) * 1975-09-30 1977-04-26 Shipley Company, Inc. Catalyst composition and method of preparation
US4042730A (en) * 1976-03-29 1977-08-16 Bell Telephone Laboratories, Incorporated Process for electroless plating using separate sensitization and activation steps
US4181759A (en) * 1976-08-05 1980-01-01 Nathan Feldstein Process for metal deposition of a non-conductor substrate
US4115334A (en) * 1976-08-13 1978-09-19 E. I. Du Pont De Nemours And Company Antistatic vinylidene chloride coating composition, and film coated therewith
US4220678A (en) * 1978-08-17 1980-09-02 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
DK153337C (da) * 1979-04-11 1988-11-14 Platonec Aps Fremgangsmaade til toer sensibilisering af en isolerende overflade
DK427780A (da) * 1980-10-10 1982-04-11 Neselco As Pulver til brug ved toer sensibilisering for stroemloes metallisering
US4490283A (en) * 1981-02-27 1984-12-25 Mitech Corporation Flame retardant thermoplastic molding compounds of high electroconductivity
DK148327C (da) * 1981-07-24 1985-11-04 Neselco As Pulver til brug ved toer sensibilisering for stroemloes metallisering

Also Published As

Publication number Publication date
NO822555L (no) 1983-01-25
IL66389A (en) 1985-12-31
IE54368B1 (en) 1989-09-13
CA1213993A (en) 1986-11-12
EP0071218A1 (en) 1983-02-09
EP0071218B1 (en) 1985-10-09
DK330081A (da) 1983-01-25
IE821755L (en) 1983-01-24
DE3266828D1 (en) 1985-11-14
DK148327B (da) 1985-06-10
AU549498B2 (en) 1986-01-30
JPH0428787B2 (da) 1992-05-15
US4495216A (en) 1985-01-22
AU8641482A (en) 1983-01-27
JPS5848661A (ja) 1983-03-22

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