NL9302265A - Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets. - Google Patents

Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets. Download PDF

Info

Publication number
NL9302265A
NL9302265A NL9302265A NL9302265A NL9302265A NL 9302265 A NL9302265 A NL 9302265A NL 9302265 A NL9302265 A NL 9302265A NL 9302265 A NL9302265 A NL 9302265A NL 9302265 A NL9302265 A NL 9302265A
Authority
NL
Netherlands
Prior art keywords
pellet
plastic
plunger
plastic layer
pellet according
Prior art date
Application number
NL9302265A
Other languages
English (en)
Dutch (nl)
Original Assignee
Asm Fico Tooling
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Fico Tooling filed Critical Asm Fico Tooling
Priority to NL9302265A priority Critical patent/NL9302265A/nl
Priority to CN94194622A priority patent/CN1139497A/zh
Priority to JP51794395A priority patent/JP3403409B2/ja
Priority to SG1996004755A priority patent/SG67319A1/en
Priority to PCT/NL1994/000317 priority patent/WO1995018461A1/en
Priority to DE69431804T priority patent/DE69431804D1/de
Priority to KR1019960703192A priority patent/KR100361707B1/ko
Priority to EP95903040A priority patent/EP0738425B1/en
Priority to MYPI94003377A priority patent/MY120098A/en
Publication of NL9302265A publication Critical patent/NL9302265A/nl
Priority to US08/666,466 priority patent/US5843360A/en
Priority to HK98115283A priority patent/HK1014082A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
NL9302265A 1993-12-24 1993-12-24 Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets. NL9302265A (nl)

Priority Applications (11)

Application Number Priority Date Filing Date Title
NL9302265A NL9302265A (nl) 1993-12-24 1993-12-24 Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets.
DE69431804T DE69431804D1 (de) 1993-12-24 1994-12-13 Tablette zur einkapselung von leiterrahmen
JP51794395A JP3403409B2 (ja) 1993-12-24 1994-12-13 リードフレームを封止するための方法とペレットおよびペレットを製造するための装置
SG1996004755A SG67319A1 (en) 1993-12-24 1994-12-13 Method and pellet for encapsulating lead frames and device for manufacturing pellets
PCT/NL1994/000317 WO1995018461A1 (en) 1993-12-24 1994-12-13 Method and pellet for encapsulating lead frames and device for manufacturing pellets
CN94194622A CN1139497A (zh) 1993-12-24 1994-12-13 封装引线框架的方法和预压坯以及预压坯的加工设备
KR1019960703192A KR100361707B1 (ko) 1993-12-24 1994-12-13 리드프레임 캡슐화방법 및 그에 쓰이는 펠릿
EP95903040A EP0738425B1 (en) 1993-12-24 1994-12-13 Pellet for encapsulating lead frames
MYPI94003377A MY120098A (en) 1993-12-24 1994-12-16 Method and pellet for encapsulating lead frames and device for manufacturing pellets
US08/666,466 US5843360A (en) 1993-12-24 1996-06-21 Method and pellet for encapsulating lead frames
HK98115283A HK1014082A1 (en) 1993-12-24 1998-12-23 Pellet for encapsulating lead frames

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9302265 1993-12-24
NL9302265A NL9302265A (nl) 1993-12-24 1993-12-24 Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets.

Publications (1)

Publication Number Publication Date
NL9302265A true NL9302265A (nl) 1995-07-17

Family

ID=19863318

Family Applications (1)

Application Number Title Priority Date Filing Date
NL9302265A NL9302265A (nl) 1993-12-24 1993-12-24 Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets.

Country Status (11)

Country Link
US (1) US5843360A (ja)
EP (1) EP0738425B1 (ja)
JP (1) JP3403409B2 (ja)
KR (1) KR100361707B1 (ja)
CN (1) CN1139497A (ja)
DE (1) DE69431804D1 (ja)
HK (1) HK1014082A1 (ja)
MY (1) MY120098A (ja)
NL (1) NL9302265A (ja)
SG (1) SG67319A1 (ja)
WO (1) WO1995018461A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3246848B2 (ja) * 1995-02-22 2002-01-15 アピックヤマダ株式会社 汎用ゲート位置樹脂モールド装置および樹脂モールド方法
SG66304A1 (en) 1996-04-25 1999-07-20 Fastech System S Pte Ltd Injection moulding apparatus and method
NL1010862C2 (nl) * 1998-12-21 2000-06-23 3P Licensing Bv Samenstel van eenheidsdoseringen vormmateriaal voor het omhullen van elektronische componenten.
US20080057528A1 (en) * 2006-08-30 2008-03-06 Kimberly-Clark Worldwide, Inc. Detection of hydrogen peroxide released by enzyme-catalyzed oxidation of an analyte
WO2010056212A2 (en) * 2008-11-17 2010-05-20 Pyxis Systems Integration Pte Ltd Method for encapsulating semiconductor dies
JP7034891B2 (ja) * 2018-11-20 2022-03-14 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法
CN109834910B (zh) * 2019-04-02 2020-12-08 江西瑞溢新材料科技有限公司 一种注塑封装设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5043199A (en) * 1988-10-31 1991-08-27 Fujitsu Limited Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet
JPH0467639A (ja) * 1990-07-09 1992-03-03 Nec Kyushu Ltd 半導体装置の製造方法
WO1993014920A1 (en) * 1992-01-23 1993-08-05 '3P' Licensing B.V. Method for pressing a plastic, which cures by means of a reaction, into a mould cavity, a pressing auxiliary in pill form to be used in this method and a holder composed of such material

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2338607A (en) * 1938-08-16 1944-01-04 Grotelite Company Method of preparing cartridges
JPS5886315U (ja) * 1981-12-07 1983-06-11 坂東　一雄 半導体樹脂封入成形用金型装置
NL8802879A (nl) * 1988-11-22 1990-06-18 Ireneus Johannes Theodorus Mar Werkwijze voor het verpakken van een afgepaste, voor het omhullen van een component bestemde hoeveelheid thermohardende kunststof, met deze werkwijze verkregen verpakking, werkwijze voor het bedrijven van een matrijs en matrijs voor het uitvoeren van deze werkwijze.
US5061542A (en) * 1989-08-28 1991-10-29 United Technologies Corporation Stabilizing foam inserts for resin transfer molding
JP2686682B2 (ja) * 1991-10-16 1997-12-08 いすゞ自動車株式会社 成形品の製造方法
DE4218086A1 (de) * 1992-06-01 1993-12-02 David Briscoe Werbesäule

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5043199A (en) * 1988-10-31 1991-08-27 Fujitsu Limited Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet
JPH0467639A (ja) * 1990-07-09 1992-03-03 Nec Kyushu Ltd 半導体装置の製造方法
WO1993014920A1 (en) * 1992-01-23 1993-08-05 '3P' Licensing B.V. Method for pressing a plastic, which cures by means of a reaction, into a mould cavity, a pressing auxiliary in pill form to be used in this method and a holder composed of such material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 275 (E - 1219) 19 June 1992 (1992-06-19) *

Also Published As

Publication number Publication date
EP0738425B1 (en) 2002-11-27
KR100361707B1 (ko) 2003-02-11
EP0738425A1 (en) 1996-10-23
KR960706691A (ko) 1996-12-09
HK1014082A1 (en) 1999-09-17
CN1139497A (zh) 1997-01-01
MY120098A (en) 2005-09-30
DE69431804D1 (de) 2003-01-09
WO1995018461A1 (en) 1995-07-06
JPH09507610A (ja) 1997-07-29
SG67319A1 (en) 1999-09-21
JP3403409B2 (ja) 2003-05-06
US5843360A (en) 1998-12-01

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A1B A search report has been drawn up
BV The patent application has lapsed