HK1014082A1 - Pellet for encapsulating lead frames - Google Patents
Pellet for encapsulating lead framesInfo
- Publication number
- HK1014082A1 HK1014082A1 HK98115283A HK98115283A HK1014082A1 HK 1014082 A1 HK1014082 A1 HK 1014082A1 HK 98115283 A HK98115283 A HK 98115283A HK 98115283 A HK98115283 A HK 98115283A HK 1014082 A1 HK1014082 A1 HK 1014082A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- pellet
- lead frames
- encapsulating lead
- encapsulating
- frames
- Prior art date
Links
- 239000008188 pellet Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
- B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9302265A NL9302265A (nl) | 1993-12-24 | 1993-12-24 | Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets. |
PCT/NL1994/000317 WO1995018461A1 (en) | 1993-12-24 | 1994-12-13 | Method and pellet for encapsulating lead frames and device for manufacturing pellets |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1014082A1 true HK1014082A1 (en) | 1999-09-17 |
Family
ID=19863318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK98115283A HK1014082A1 (en) | 1993-12-24 | 1998-12-23 | Pellet for encapsulating lead frames |
Country Status (11)
Country | Link |
---|---|
US (1) | US5843360A (ja) |
EP (1) | EP0738425B1 (ja) |
JP (1) | JP3403409B2 (ja) |
KR (1) | KR100361707B1 (ja) |
CN (1) | CN1139497A (ja) |
DE (1) | DE69431804D1 (ja) |
HK (1) | HK1014082A1 (ja) |
MY (1) | MY120098A (ja) |
NL (1) | NL9302265A (ja) |
SG (1) | SG67319A1 (ja) |
WO (1) | WO1995018461A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3246848B2 (ja) * | 1995-02-22 | 2002-01-15 | アピックヤマダ株式会社 | 汎用ゲート位置樹脂モールド装置および樹脂モールド方法 |
SG66304A1 (en) | 1996-04-25 | 1999-07-20 | Fastech System S Pte Ltd | Injection moulding apparatus and method |
NL1010862C2 (nl) * | 1998-12-21 | 2000-06-23 | 3P Licensing Bv | Samenstel van eenheidsdoseringen vormmateriaal voor het omhullen van elektronische componenten. |
US20080057528A1 (en) * | 2006-08-30 | 2008-03-06 | Kimberly-Clark Worldwide, Inc. | Detection of hydrogen peroxide released by enzyme-catalyzed oxidation of an analyte |
WO2010056212A2 (en) * | 2008-11-17 | 2010-05-20 | Pyxis Systems Integration Pte Ltd | Method for encapsulating semiconductor dies |
JP7034891B2 (ja) * | 2018-11-20 | 2022-03-14 | Towa株式会社 | 樹脂成形装置および樹脂成形品の製造方法 |
CN109834910B (zh) * | 2019-04-02 | 2020-12-08 | 江西瑞溢新材料科技有限公司 | 一种注塑封装设备 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2338607A (en) * | 1938-08-16 | 1944-01-04 | Grotelite Company | Method of preparing cartridges |
JPS5886315U (ja) * | 1981-12-07 | 1983-06-11 | 坂東 一雄 | 半導体樹脂封入成形用金型装置 |
US5043199A (en) * | 1988-10-31 | 1991-08-27 | Fujitsu Limited | Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet |
NL8802879A (nl) * | 1988-11-22 | 1990-06-18 | Ireneus Johannes Theodorus Mar | Werkwijze voor het verpakken van een afgepaste, voor het omhullen van een component bestemde hoeveelheid thermohardende kunststof, met deze werkwijze verkregen verpakking, werkwijze voor het bedrijven van een matrijs en matrijs voor het uitvoeren van deze werkwijze. |
US5061542A (en) * | 1989-08-28 | 1991-10-29 | United Technologies Corporation | Stabilizing foam inserts for resin transfer molding |
JP2582466B2 (ja) * | 1990-07-09 | 1997-02-19 | 九州日本電気株式会社 | 半導体装置の製造方法 |
JP2686682B2 (ja) * | 1991-10-16 | 1997-12-08 | いすゞ自動車株式会社 | 成形品の製造方法 |
NL9200127A (nl) * | 1992-01-23 | 1993-08-16 | Ireneus Johannes Theodorus Mar | Werkwijze voor het in een vormholte persen van een door een reactie uithardende kunststof, een daarbij te gebruiken pilvormig pershulpmateriaal alsmede een houder uit dergelijk materiaal. |
DE4218086A1 (de) * | 1992-06-01 | 1993-12-02 | David Briscoe | Werbesäule |
-
1993
- 1993-12-24 NL NL9302265A patent/NL9302265A/nl not_active Application Discontinuation
-
1994
- 1994-12-13 EP EP95903040A patent/EP0738425B1/en not_active Expired - Lifetime
- 1994-12-13 CN CN94194622A patent/CN1139497A/zh active Pending
- 1994-12-13 KR KR1019960703192A patent/KR100361707B1/ko not_active IP Right Cessation
- 1994-12-13 SG SG1996004755A patent/SG67319A1/en unknown
- 1994-12-13 DE DE69431804T patent/DE69431804D1/de not_active Expired - Lifetime
- 1994-12-13 JP JP51794395A patent/JP3403409B2/ja not_active Expired - Fee Related
- 1994-12-13 WO PCT/NL1994/000317 patent/WO1995018461A1/en active IP Right Grant
- 1994-12-16 MY MYPI94003377A patent/MY120098A/en unknown
-
1996
- 1996-06-21 US US08/666,466 patent/US5843360A/en not_active Expired - Fee Related
-
1998
- 1998-12-23 HK HK98115283A patent/HK1014082A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0738425B1 (en) | 2002-11-27 |
KR100361707B1 (ko) | 2003-02-11 |
EP0738425A1 (en) | 1996-10-23 |
KR960706691A (ko) | 1996-12-09 |
CN1139497A (zh) | 1997-01-01 |
MY120098A (en) | 2005-09-30 |
DE69431804D1 (de) | 2003-01-09 |
WO1995018461A1 (en) | 1995-07-06 |
NL9302265A (nl) | 1995-07-17 |
JPH09507610A (ja) | 1997-07-29 |
SG67319A1 (en) | 1999-09-21 |
JP3403409B2 (ja) | 2003-05-06 |
US5843360A (en) | 1998-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20061213 |