NL8701402A - Pengestel voor het zonder naden spuitgieten en werkwijze daarvoor. - Google Patents
Pengestel voor het zonder naden spuitgieten en werkwijze daarvoor. Download PDFInfo
- Publication number
- NL8701402A NL8701402A NL8701402A NL8701402A NL8701402A NL 8701402 A NL8701402 A NL 8701402A NL 8701402 A NL8701402 A NL 8701402A NL 8701402 A NL8701402 A NL 8701402A NL 8701402 A NL8701402 A NL 8701402A
- Authority
- NL
- Netherlands
- Prior art keywords
- seam
- pins
- lip means
- avoidance
- pin frame
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 17
- 238000001746 injection moulding Methods 0.000 title claims description 5
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 238000000465 moulding Methods 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims 3
- 150000002739 metals Chemical class 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/028,493 US4778146A (en) | 1987-03-20 | 1987-03-20 | Leadframe for flash-free insert molding and method therefor |
| US2849387 | 1987-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL8701402A true NL8701402A (nl) | 1988-10-17 |
Family
ID=21843744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL8701402A NL8701402A (nl) | 1987-03-20 | 1987-06-16 | Pengestel voor het zonder naden spuitgieten en werkwijze daarvoor. |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4778146A (de) |
| JP (1) | JPS64753A (de) |
| DE (1) | DE3809451A1 (de) |
| GB (1) | GB2204824B (de) |
| NL (1) | NL8701402A (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5118271A (en) * | 1991-02-22 | 1992-06-02 | Motorola, Inc. | Apparatus for encapsulating a semiconductor device |
| MX9205128A (es) * | 1991-09-30 | 1993-04-01 | Motorola Inc | Metodo para procesar un bloque de circuito integrado semiconductor. |
| US5886397A (en) * | 1996-09-05 | 1999-03-23 | International Rectifier Corporation | Crushable bead on lead finger side surface to improve moldability |
| DE19736895A1 (de) * | 1996-09-05 | 1998-04-16 | Int Rectifier Corp | Gehäuse für Halbleiterbauteile |
| US5939775A (en) * | 1996-11-05 | 1999-08-17 | Gcb Technologies, Llc | Leadframe structure and process for packaging intergrated circuits |
| TWI242815B (en) * | 2001-12-13 | 2005-11-01 | Ushio Electric Inc | Method for thermal processing semiconductor wafer |
| DE10227936C1 (de) * | 2002-06-21 | 2003-05-15 | Heraeus Gmbh W C | Verfahren zur Herstellung von Systemträgern aus metallischem Trägerband sowie Metallstreifen mit Trägerbereich für elektrische Bauelemente |
| MY154596A (en) * | 2007-07-25 | 2015-06-30 | Carsem M Sdn Bhd | Thin plastic leadless package with exposed metal die paddle |
| CN102553700A (zh) * | 2011-07-06 | 2012-07-11 | 洛阳宇航重工机械有限公司 | 一种破碎氧化铝结壳块的斗提生产线装置和方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4109373A (en) * | 1975-03-10 | 1978-08-29 | General Electric Company | Method for manufacturing semiconductor devices |
| US4490902A (en) * | 1982-09-03 | 1985-01-01 | General Motors Corporation | Lead frame for molded integrated circuit package |
| US4615857A (en) * | 1984-11-30 | 1986-10-07 | Motorola, Inc. | Encapsulation means and method for reducing flash |
| JPS61144033A (ja) * | 1984-12-18 | 1986-07-01 | Toshiba Corp | 半導体装置の樹脂封止成形方法 |
-
1987
- 1987-03-20 US US07/028,493 patent/US4778146A/en not_active Expired - Fee Related
- 1987-06-16 NL NL8701402A patent/NL8701402A/nl not_active Application Discontinuation
- 1987-07-01 GB GB8715463A patent/GB2204824B/en not_active Expired - Lifetime
-
1988
- 1988-03-18 JP JP63065557A patent/JPS64753A/ja active Pending
- 1988-03-21 DE DE3809451A patent/DE3809451A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JPS64753A (en) | 1989-01-05 |
| GB8715463D0 (en) | 1987-08-05 |
| US4778146A (en) | 1988-10-18 |
| DE3809451A1 (de) | 1988-09-29 |
| GB2204824B (en) | 1990-06-13 |
| GB2204824A (en) | 1988-11-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BV | The patent application has lapsed |