NL8500638A - Werkwijze en inrichting voor het reinigen van vormen door omgekeerd sputteren. - Google Patents

Werkwijze en inrichting voor het reinigen van vormen door omgekeerd sputteren. Download PDF

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Publication number
NL8500638A
NL8500638A NL8500638A NL8500638A NL8500638A NL 8500638 A NL8500638 A NL 8500638A NL 8500638 A NL8500638 A NL 8500638A NL 8500638 A NL8500638 A NL 8500638A NL 8500638 A NL8500638 A NL 8500638A
Authority
NL
Netherlands
Prior art keywords
mold
cleaned
vacuum chamber
cathode
anode
Prior art date
Application number
NL8500638A
Other languages
English (en)
Dutch (nl)
Original Assignee
Asm Fico Tooling
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Fico Tooling filed Critical Asm Fico Tooling
Publication of NL8500638A publication Critical patent/NL8500638A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
NL8500638A 1984-03-06 1985-03-06 Werkwijze en inrichting voor het reinigen van vormen door omgekeerd sputteren. NL8500638A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/586,853 US4534921A (en) 1984-03-06 1984-03-06 Method and apparatus for mold cleaning by reverse sputtering
US58685384 1984-03-06

Publications (1)

Publication Number Publication Date
NL8500638A true NL8500638A (nl) 1985-10-01

Family

ID=24347355

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8500638A NL8500638A (nl) 1984-03-06 1985-03-06 Werkwijze en inrichting voor het reinigen van vormen door omgekeerd sputteren.

Country Status (6)

Country Link
US (1) US4534921A (de)
JP (1) JPS616285A (de)
DE (1) DE3508004A1 (de)
FR (1) FR2578482A1 (de)
GB (1) GB2155844B (de)
NL (1) NL8500638A (de)

Families Citing this family (34)

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JPH067542B2 (ja) * 1984-11-22 1994-01-26 株式会社日立製作所 製造装置
US4934920A (en) * 1987-06-17 1990-06-19 Mitsubishi Denki Kabushiki Kaisha Apparatus for producing semiconductor device
JPH01144636A (ja) * 1987-11-17 1989-06-06 Mitsubishi Electric Corp 半導体製造装置
AT388884B (de) * 1988-02-05 1989-09-11 Miba Gleitlager Ag Verfahren zum reinigen eines metallischen werkstueckes mit oberflaechenteilen aus verschiedenem werkstoff durch ionenbeschuss aus einer gasentladung
US4946518A (en) * 1989-03-14 1990-08-07 Motorola, Inc. Method for improving the adhesion of a plastic encapsulant to copper containing leadframes
US4877482A (en) * 1989-03-23 1989-10-31 Motorola Inc. Nitride removal method
US4896813A (en) * 1989-04-03 1990-01-30 Toyo Kohan Co., Ltd. Method and apparatus for cold rolling clad sheet
US5075256A (en) * 1989-08-25 1991-12-24 Applied Materials, Inc. Process for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer
US5213650A (en) * 1989-08-25 1993-05-25 Applied Materials, Inc. Apparatus for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer
DE69020553T2 (de) * 1990-07-24 1995-12-21 Inst Elektroniki Im U A Arifov Elektrische Lichtbogenbehandlung von Teilchen.
AU639469B2 (en) * 1990-07-26 1993-07-29 Institut Elektroniki Imeni U.A.Arifova Akademii Nauk Uzbexkoi Ssr Method and apparatuses for electric arc treatment of parts
US5462771A (en) * 1992-11-09 1995-10-31 Akira Motoki Method of manufacturing electromagnetic wave shielding plastic molding
US5373140A (en) * 1993-03-16 1994-12-13 Vernay Laboratories, Inc. System for cleaning molding equipment using a laser
JPH06285868A (ja) * 1993-03-30 1994-10-11 Bridgestone Corp 加硫金型の清浄方法
DE4427259A1 (de) * 1994-07-30 1996-02-01 Mtu Muenchen Gmbh Verfahren und Vorrichtung zur Reinigung oder Vorwärmung von Bauteiloberflächen
DE19549487C2 (de) * 1995-01-05 2000-11-16 Steag Micro Tech Gmbh Anlage zur chemischen Naßbehandlung
JPH0957757A (ja) * 1995-03-27 1997-03-04 Toyoda Gosei Co Ltd 成形品及びその製造方法並びに成形用金型装置
US5769953A (en) * 1995-05-01 1998-06-23 Bridgestone Corporation Plasma and heating method of cleaning vulcanizing mold for ashing residue
IL114097A (en) * 1995-06-11 2000-08-13 Sizary Mat Purification Ltd Cleaning system and method
JPH09123206A (ja) * 1995-10-30 1997-05-13 Towa Kk 電子部品の樹脂封止成形装置
ES2164947T3 (es) * 1996-02-15 2002-03-01 Bridgestone Corp Metodo para limpiar un molde de vulcanizacion.
GB9603295D0 (en) * 1996-02-16 1996-04-17 Boc Group Plc Process and apparatus for surface cleaning
KR0174982B1 (ko) * 1996-02-23 1999-02-01 김광호 프리히팅을 이용한 타블렛 먼지 제거 장치 및 제거방법
EP0883162A3 (de) 1997-06-05 2001-04-18 Sizary Limited Reinigungsvorrichtung für Halbleiterscheibe
AU3052099A (en) * 1998-03-30 1999-10-18 Sizary Ltd. Semiconductor purification apparatus and method
JP4627916B2 (ja) * 2001-03-29 2011-02-09 キヤノンアネルバ株式会社 イオン化装置
DE10254762A1 (de) * 2002-11-22 2004-06-09 Transcoject Gesellschaft für medizinische Geräte mbH & Co. KG Verfahren zur Herstellung und/oder Handhabung eines hochreinen Gegenstandes
US7635418B2 (en) * 2004-12-03 2009-12-22 Nordson Corporation Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
US20060201910A1 (en) * 2004-12-22 2006-09-14 Nordson Corporation Methods for removing extraneous amounts of molding material from a substrate
US20080057528A1 (en) * 2006-08-30 2008-03-06 Kimberly-Clark Worldwide, Inc. Detection of hydrogen peroxide released by enzyme-catalyzed oxidation of an analyte
JP5137635B2 (ja) * 2007-03-16 2013-02-06 キヤノン株式会社 インプリント方法、チップの製造方法及びインプリント装置
MY151567A (en) * 2008-01-25 2014-06-13 Novartis Ag Apparatus, carrier and method for the plasma treatment of molds
US20130255717A1 (en) * 2012-04-03 2013-10-03 Kla-Tencor Corporation System and method for cleaning surfaces and components of mask and wafer inspection systems based on the positive column of a glow discharge plasma
RU2726051C1 (ru) * 2019-12-16 2020-07-08 федеральное государственное бюджетное образовательное учреждение высшего образования "Волгоградский государственный аграрный университет" (ФГБОУ ВО Волгоградский ГАУ) Способ упрочнения лезвий рабочих органов орудий для разработки почвогрунтов

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3233137A (en) * 1961-08-28 1966-02-01 Litton Systems Inc Method and apparatus for cleansing by ionic bombardment
US3669861A (en) * 1967-08-28 1972-06-13 Texas Instruments Inc R. f. discharge cleaning to improve adhesion
US3654108A (en) * 1969-09-23 1972-04-04 Air Reduction Method for glow cleaning
US3968018A (en) * 1969-09-29 1976-07-06 Warner-Lambert Company Sputter coating method
US3776762A (en) * 1971-10-18 1973-12-04 Kote Corp Du Dry lubrication
JPS5010232A (de) * 1973-06-01 1975-02-01
FR2237311B1 (de) * 1973-07-12 1977-05-13 Ibm France
DE2647088B2 (de) * 1976-10-19 1979-04-05 Kernforschungsanlage Juelich Gmbh, 5170 Juelich Verfahren und Vorrichtung zum Reinigen von Oberflächen
US4126530A (en) * 1977-08-04 1978-11-21 Telic Corporation Method and apparatus for sputter cleaning and bias sputtering
US4313815A (en) * 1978-04-07 1982-02-02 Varian Associates, Inc. Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor
US4278493A (en) * 1980-04-28 1981-07-14 International Business Machines Corporation Method for cleaning surfaces by ion milling
JPS6053752B2 (ja) * 1980-09-19 1985-11-27 日本真空技術株式会社 プラズマクリ−ニング装置
GB2104827B (en) * 1981-07-01 1985-09-11 Kras Corp Molding of electronic components
GB2108533A (en) * 1981-10-30 1983-05-18 British Steel Corp Ion plating
JPS58193370A (ja) * 1982-05-06 1983-11-11 Toshiba Corp 表面処理方法及びその適用方法

Also Published As

Publication number Publication date
US4534921A (en) 1985-08-13
FR2578482A1 (fr) 1986-09-12
GB2155844A (en) 1985-10-02
GB8505653D0 (en) 1985-04-03
GB2155844B (en) 1987-12-02
JPS616285A (ja) 1986-01-11
DE3508004A1 (de) 1986-07-10

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