NL8403011A - Werkwijze voor het neerslaan van titaansilicide bij lage temperatuur. - Google Patents
Werkwijze voor het neerslaan van titaansilicide bij lage temperatuur. Download PDFInfo
- Publication number
- NL8403011A NL8403011A NL8403011A NL8403011A NL8403011A NL 8403011 A NL8403011 A NL 8403011A NL 8403011 A NL8403011 A NL 8403011A NL 8403011 A NL8403011 A NL 8403011A NL 8403011 A NL8403011 A NL 8403011A
- Authority
- NL
- Netherlands
- Prior art keywords
- titanium
- silicon
- process according
- containing material
- gaseous
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/42—Silicides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
- H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
- H10D64/0112—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors using conductive layers comprising silicides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
- H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
- H10D64/01304—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H10D64/01306—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon
- H10D64/01308—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon the conductor further comprising a non-elemental silicon additional conductive layer, e.g. a metal silicide layer formed by the reaction of silicon with an implanted metal
- H10D64/01312—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon the conductor further comprising a non-elemental silicon additional conductive layer, e.g. a metal silicide layer formed by the reaction of silicon with an implanted metal the additional layer comprising a metal or metal silicide formed by deposition, i.e. without a silicidation reaction, e.g. sputter deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/547,050 US4557943A (en) | 1983-10-31 | 1983-10-31 | Metal-silicide deposition using plasma-enhanced chemical vapor deposition |
| US54705083 | 1983-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL8403011A true NL8403011A (nl) | 1985-05-17 |
Family
ID=24183136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL8403011A NL8403011A (nl) | 1983-10-31 | 1984-10-03 | Werkwijze voor het neerslaan van titaansilicide bij lage temperatuur. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4557943A (https=) |
| JP (1) | JPS6096763A (https=) |
| DE (1) | DE3439853A1 (https=) |
| FR (1) | FR2554132B1 (https=) |
| GB (1) | GB2148946B (https=) |
| NL (1) | NL8403011A (https=) |
Families Citing this family (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2505736B2 (ja) * | 1985-06-18 | 1996-06-12 | キヤノン株式会社 | 半導体装置の製造方法 |
| US4668530A (en) * | 1985-07-23 | 1987-05-26 | Massachusetts Institute Of Technology | Low pressure chemical vapor deposition of refractory metal silicides |
| US4709655A (en) * | 1985-12-03 | 1987-12-01 | Varian Associates, Inc. | Chemical vapor deposition apparatus |
| US4796562A (en) * | 1985-12-03 | 1989-01-10 | Varian Associates, Inc. | Rapid thermal cvd apparatus |
| US4732801A (en) * | 1986-04-30 | 1988-03-22 | International Business Machines Corporation | Graded oxide/nitride via structure and method of fabrication therefor |
| US4766006A (en) * | 1986-05-15 | 1988-08-23 | Varian Associates, Inc. | Low pressure chemical vapor deposition of metal silicide |
| US4800105A (en) * | 1986-07-22 | 1989-01-24 | Nihon Shinku Gijutsu Kabushiki Kaisha | Method of forming a thin film by chemical vapor deposition |
| NL8700820A (nl) * | 1987-04-08 | 1988-11-01 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
| US4908548A (en) * | 1987-05-09 | 1990-03-13 | Futaba Denshi Kogyo Kabushiki Kaisha | Fluorescent display device |
| FR2622052B1 (fr) * | 1987-10-19 | 1990-02-16 | Air Liquide | Procede de depot de siliciure de metal refractaire pour la fabrication de circuits integres |
| FR2623014B1 (fr) * | 1987-11-09 | 1990-03-23 | France Etat | Procede de depot selectif d'un siliciure de metal refractaire sur des zones de silicium |
| US5167986A (en) * | 1988-04-15 | 1992-12-01 | Gordon Roy G | Titanium silicide-coated glass windows |
| US5057375A (en) * | 1988-04-15 | 1991-10-15 | Gordon Roy G | Titanium silicide-coated glass windows |
| US4957777A (en) * | 1988-07-28 | 1990-09-18 | Massachusetts Institute Of Technology | Very low pressure chemical vapor deposition process for deposition of titanium silicide films |
| US5104694A (en) * | 1989-04-21 | 1992-04-14 | Nippon Telephone & Telegraph Corporation | Selective chemical vapor deposition of a metallic film on the silicon surface |
| KR930011413B1 (ko) * | 1990-09-25 | 1993-12-06 | 가부시키가이샤 한도오따이 에네루기 겐큐쇼 | 펄스형 전자파를 사용한 플라즈마 cvd 법 |
| JPH06101462B2 (ja) * | 1991-04-30 | 1994-12-12 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 過フッ化炭化水素ポリマ膜を基板に接着する方法および 基板 |
| KR970009274B1 (ko) * | 1991-11-11 | 1997-06-09 | 미쓰비시덴키 가부시키가이샤 | 반도체장치의 도전층접속구조 및 그 제조방법 |
| US5320880A (en) * | 1992-10-20 | 1994-06-14 | Micron Technology, Inc. | Method of providing a silicon film having a roughened outer surface |
| US5814599A (en) * | 1995-08-04 | 1998-09-29 | Massachusetts Insitiute Of Technology | Transdermal delivery of encapsulated drugs |
| US5426003A (en) * | 1994-02-14 | 1995-06-20 | Westinghouse Electric Corporation | Method of forming a plasma sprayed interconnection layer on an electrode of an electrochemical cell |
| US5665640A (en) * | 1994-06-03 | 1997-09-09 | Sony Corporation | Method for producing titanium-containing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor |
| WO1995034092A1 (en) * | 1994-06-03 | 1995-12-14 | Materials Research Corporation | A method of nitridization of titanium thin films |
| US5975912A (en) * | 1994-06-03 | 1999-11-02 | Materials Research Corporation | Low temperature plasma-enhanced formation of integrated circuits |
| US5628829A (en) * | 1994-06-03 | 1997-05-13 | Materials Research Corporation | Method and apparatus for low temperature deposition of CVD and PECVD films |
| US5972790A (en) * | 1995-06-09 | 1999-10-26 | Tokyo Electron Limited | Method for forming salicides |
| US5780050A (en) | 1995-07-20 | 1998-07-14 | Theratech, Inc. | Drug delivery compositions for improved stability of steroids |
| US5947921A (en) * | 1995-12-18 | 1999-09-07 | Massachusetts Institute Of Technology | Chemical and physical enhancers and ultrasound for transdermal drug delivery |
| US6041253A (en) * | 1995-12-18 | 2000-03-21 | Massachusetts Institute Of Technology | Effect of electric field and ultrasound for transdermal drug delivery |
| US6002961A (en) * | 1995-07-25 | 1999-12-14 | Massachusetts Institute Of Technology | Transdermal protein delivery using low-frequency sonophoresis |
| DK1563788T3 (da) | 1995-08-29 | 2015-05-11 | Nitto Denko Corp | Mikroperforering af human hud til stofindgift og overvågningsformål |
| JPH09111460A (ja) * | 1995-10-11 | 1997-04-28 | Anelva Corp | チタン系導電性薄膜の作製方法 |
| EP0925088A2 (en) | 1996-06-28 | 1999-06-30 | Sontra Medical, L.P. | Ultrasound enhancement of transdermal transport |
| US5908659A (en) * | 1997-01-03 | 1999-06-01 | Mosel Vitelic Inc. | Method for reducing the reflectivity of a silicide layer |
| US6432479B2 (en) | 1997-12-02 | 2002-08-13 | Applied Materials, Inc. | Method for in-situ, post deposition surface passivation of a chemical vapor deposited film |
| US8287483B2 (en) * | 1998-01-08 | 2012-10-16 | Echo Therapeutics, Inc. | Method and apparatus for enhancement of transdermal transport |
| US7066884B2 (en) | 1998-01-08 | 2006-06-27 | Sontra Medical, Inc. | System, method, and device for non-invasive body fluid sampling and analysis |
| US6190315B1 (en) | 1998-01-08 | 2001-02-20 | Sontra Medical, Inc. | Sonophoretic enhanced transdermal transport |
| US6046098A (en) * | 1998-02-23 | 2000-04-04 | Micron Technology, Inc. | Process of forming metal silicide interconnects |
| US20040171980A1 (en) * | 1998-12-18 | 2004-09-02 | Sontra Medical, Inc. | Method and apparatus for enhancement of transdermal transport |
| US6821571B2 (en) | 1999-06-18 | 2004-11-23 | Applied Materials Inc. | Plasma treatment to enhance adhesion and to minimize oxidation of carbon-containing layers |
| US20030078499A1 (en) | 1999-08-12 | 2003-04-24 | Eppstein Jonathan A. | Microporation of tissue for delivery of bioactive agents |
| US6541369B2 (en) | 1999-12-07 | 2003-04-01 | Applied Materials, Inc. | Method and apparatus for reducing fixed charges in a semiconductor device |
| US6795727B2 (en) | 2001-10-17 | 2004-09-21 | Pedro Giammarusti | Devices and methods for promoting transcutaneous movement of substances |
| US8116860B2 (en) * | 2002-03-11 | 2012-02-14 | Altea Therapeutics Corporation | Transdermal porator and patch system and method for using same |
| US9918665B2 (en) | 2002-03-11 | 2018-03-20 | Nitto Denko Corporation | Transdermal porator and patch system and method for using same |
| CA2478822C (en) | 2002-03-11 | 2016-07-12 | Passport Technologies, Inc. | Transdermal drug delivery patch system, method of making same and method of using same |
| US8016811B2 (en) | 2003-10-24 | 2011-09-13 | Altea Therapeutics Corporation | Method for transdermal delivery of permeant substances |
| US20060094945A1 (en) | 2004-10-28 | 2006-05-04 | Sontra Medical Corporation | System and method for analyte sampling and analysis |
| CA2597956C (en) | 2005-02-17 | 2013-07-09 | Velcera Pharmaceuticals | Transmucosal administration of drug compositions for treating and preventing disorders in animals |
| US7432069B2 (en) | 2005-12-05 | 2008-10-07 | Sontra Medical Corporation | Biocompatible chemically crosslinked hydrogels for glucose sensing |
| RU2444980C2 (ru) | 2007-03-07 | 2012-03-20 | Эко Терапьютикс, Инк. | Трансдермальная система мониторинга аналита и способы детекции аналита |
| JP2010525881A (ja) | 2007-04-27 | 2010-07-29 | エコー セラピューティクス, インコーポレイテッド | 被検体の検知または経皮的薬物送達のための皮膚透過装置 |
| WO2010101625A2 (en) | 2009-03-02 | 2010-09-10 | Seventh Sense Biosystems, Inc. | Oxygen sensor |
| CN102405018B (zh) | 2009-03-02 | 2014-11-19 | 第七感生物系统有限公司 | 与血液取样相关联的技术和装置 |
| WO2012018486A2 (en) | 2010-07-26 | 2012-02-09 | Seventh Sense Biosystems, Inc. | Rapid delivery and/or receiving of fluids |
| US9041541B2 (en) | 2010-01-28 | 2015-05-26 | Seventh Sense Biosystems, Inc. | Monitoring or feedback systems and methods |
| US9295417B2 (en) | 2011-04-29 | 2016-03-29 | Seventh Sense Biosystems, Inc. | Systems and methods for collecting fluid from a subject |
| WO2011163347A2 (en) | 2010-06-23 | 2011-12-29 | Seventh Sense Biosystems, Inc. | Sampling devices and methods involving relatively little pain |
| WO2012009613A1 (en) | 2010-07-16 | 2012-01-19 | Seventh Sense Biosystems, Inc. | Low-pressure environment for fluid transfer devices |
| WO2012021801A2 (en) | 2010-08-13 | 2012-02-16 | Seventh Sense Biosystems, Inc. | Systems and techniques for monitoring subjects |
| EP2992827B1 (en) | 2010-11-09 | 2017-04-19 | Seventh Sense Biosystems, Inc. | Systems and interfaces for blood sampling |
| US20130158468A1 (en) | 2011-12-19 | 2013-06-20 | Seventh Sense Biosystems, Inc. | Delivering and/or receiving material with respect to a subject surface |
| CN103874460B (zh) | 2011-04-29 | 2016-06-22 | 第七感生物系统有限公司 | 一种用于从受验者的皮肤接收血液或其它物质的装置 |
| KR20140034200A (ko) | 2011-04-29 | 2014-03-19 | 세븐쓰 센스 바이오시스템즈, 인크. | 혈액 스폿들 또는 다른 신체 유체들을 수집 및/또는 조작하기 위한 시스템들 및 방법들 |
| US20140066837A1 (en) | 2012-07-26 | 2014-03-06 | Ronald L. Moy | Skin care compositions and methods |
| US10204764B2 (en) * | 2014-10-28 | 2019-02-12 | Applied Materials, Inc. | Methods for forming a metal silicide interconnection nanowire structure |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3540920A (en) * | 1967-08-24 | 1970-11-17 | Texas Instruments Inc | Process of simultaneously vapor depositing silicides of chromium and titanium |
| US3658577A (en) * | 1969-10-01 | 1972-04-25 | Gene F Wakefield | Vapor phase deposition of silicide refractory coatings |
| US4180596A (en) * | 1977-06-30 | 1979-12-25 | International Business Machines Corporation | Method for providing a metal silicide layer on a substrate |
| US4218291A (en) * | 1978-02-28 | 1980-08-19 | Vlsi Technology Research Association | Process for forming metal and metal silicide films |
| US4239819A (en) * | 1978-12-11 | 1980-12-16 | Chemetal Corporation | Deposition method and products |
| JPS5644765A (en) * | 1979-09-20 | 1981-04-24 | Daijietsuto Kogyo Kk | Covered hard metal tool |
| JPS584975A (ja) * | 1981-06-30 | 1983-01-12 | Fujitsu Ltd | 半導体装置の製造方法 |
| US4359490A (en) * | 1981-07-13 | 1982-11-16 | Fairchild Camera & Instrument Corp. | Method for LPCVD co-deposition of metal and silicon to form metal silicide |
| JPS57147431A (en) * | 1981-10-06 | 1982-09-11 | Semiconductor Energy Lab Co Ltd | Plasma gas phase method |
| DE3211752C2 (de) * | 1982-03-30 | 1985-09-26 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum selektiven Abscheiden von aus Siliziden hochschmelzender Metalle bestehenden Schichtstrukturen auf im wesentlichen aus Silizium bestehenden Substraten und deren Verwendung |
| JPS5956574A (ja) * | 1982-09-24 | 1984-04-02 | Fujitsu Ltd | チタン・シリサイド膜の形成方法 |
-
1983
- 1983-10-31 US US06/547,050 patent/US4557943A/en not_active Expired - Fee Related
-
1984
- 1984-08-28 JP JP59179148A patent/JPS6096763A/ja active Granted
- 1984-10-03 NL NL8403011A patent/NL8403011A/nl not_active Application Discontinuation
- 1984-10-16 GB GB08426071A patent/GB2148946B/en not_active Expired
- 1984-10-30 FR FR8416908A patent/FR2554132B1/fr not_active Expired
- 1984-10-31 DE DE19843439853 patent/DE3439853A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| DE3439853A1 (de) | 1985-05-09 |
| GB2148946B (en) | 1986-02-26 |
| GB8426071D0 (en) | 1984-11-21 |
| FR2554132A1 (fr) | 1985-05-03 |
| JPS6096763A (ja) | 1985-05-30 |
| JPS643949B2 (https=) | 1989-01-24 |
| GB2148946A (en) | 1985-06-05 |
| US4557943A (en) | 1985-12-10 |
| FR2554132B1 (fr) | 1988-09-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BA | A request for search or an international-type search has been filed | ||
| BB | A search report has been drawn up | ||
| BC | A request for examination has been filed | ||
| BV | The patent application has lapsed |