NL7908794A - Werkwijze voor het bekleden van een metalen voorwerp op en bij een rand. - Google Patents

Werkwijze voor het bekleden van een metalen voorwerp op en bij een rand. Download PDF

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Publication number
NL7908794A
NL7908794A NL7908794A NL7908794A NL7908794A NL 7908794 A NL7908794 A NL 7908794A NL 7908794 A NL7908794 A NL 7908794A NL 7908794 A NL7908794 A NL 7908794A NL 7908794 A NL7908794 A NL 7908794A
Authority
NL
Netherlands
Prior art keywords
coating
metal
edge
etched
paint
Prior art date
Application number
NL7908794A
Other languages
English (en)
Dutch (nl)
Original Assignee
Thams Johan Petter B
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thams Johan Petter B filed Critical Thams Johan Petter B
Publication of NL7908794A publication Critical patent/NL7908794A/nl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/44Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09581Applying an insulating coating on the walls of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0323Working metal substrate or core, e.g. by etching, deforming
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333Deposition techniques, e.g. coating
    • H05K2203/135Electrophoretic deposition of insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1438Treating holes after another process, e.g. coating holes after coating the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • ing And Chemical Polishing (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Physical Vapour Deposition (AREA)
NL7908794A 1978-12-05 1979-12-05 Werkwijze voor het bekleden van een metalen voorwerp op en bij een rand. NL7908794A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE7812499A SE435343B (sv) 1978-12-05 1978-12-05 Forfarande vid beleggning vid skarpa kanter pa metallforemal
SE7812499 1978-12-05

Publications (1)

Publication Number Publication Date
NL7908794A true NL7908794A (nl) 1980-06-09

Family

ID=20336533

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7908794A NL7908794A (nl) 1978-12-05 1979-12-05 Werkwijze voor het bekleden van een metalen voorwerp op en bij een rand.

Country Status (14)

Country Link
US (1) US4321290A (sv)
JP (1) JPS6014627B2 (sv)
AT (1) AT370012B (sv)
AU (1) AU525331B2 (sv)
BE (1) BE880447A (sv)
CA (1) CA1145207A (sv)
CH (1) CH645042A5 (sv)
DE (1) DE2948940C2 (sv)
DK (1) DK151459C (sv)
FR (1) FR2443519A1 (sv)
GB (1) GB2040186B (sv)
IT (1) IT1119588B (sv)
NL (1) NL7908794A (sv)
SE (1) SE435343B (sv)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763294A (en) * 1980-10-06 1982-04-16 Fuji Photo Film Co Ltd Photosensitive printing plate for lithography
JPS59102237U (ja) * 1982-12-25 1984-07-10 筒井 将裕 端面を防蝕加工した塩ビ鋼板
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
DE3517796A1 (de) * 1985-05-17 1986-11-20 Hoechst Ag, 6230 Frankfurt Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten
US4714646A (en) * 1986-03-24 1987-12-22 International Business Machines Corporation Electrophoretic insulation of metal circuit board core
US5422167A (en) * 1993-09-17 1995-06-06 Infosight Corporation High temperature-resistant, thermally-printable label for attachment to hot metal stock and method thereof
US5590460A (en) 1994-07-19 1997-01-07 Tessera, Inc. Method of making multilayer circuit
US5714234A (en) * 1996-06-10 1998-02-03 Infosight Corporation Identification tag with preform attachment
US6423907B1 (en) * 1998-02-09 2002-07-23 Tessera, Inc. Components with releasable leads
US6492201B1 (en) * 1998-07-10 2002-12-10 Tessera, Inc. Forming microelectronic connection components by electrophoretic deposition
US7000313B2 (en) * 2001-03-08 2006-02-21 Ppg Industries Ohio, Inc. Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
US6713587B2 (en) 2001-03-08 2004-03-30 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions and methods related thereto
US6951707B2 (en) * 2001-03-08 2005-10-04 Ppg Industries Ohio, Inc. Process for creating vias for circuit assemblies
US6588095B2 (en) * 2001-04-27 2003-07-08 Hewlett-Packard Development Company, Lp. Method of processing a device by electrophoresis coating
EP1520454B1 (en) * 2002-06-27 2012-01-25 PPG Industries Ohio, Inc. Single or multi-layer printed circuit board with extended breakaway tabs and method of manufacture thereof
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
JP4970429B2 (ja) * 2005-05-19 2012-07-04 ハイドロ アルミニウム ドイチュラント ゲー エム ベー ハー リソストリップのコンディショニング

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US813618A (en) * 1905-07-10 1906-02-27 Arlington Company Coated strip and method of making the same.
US3218187A (en) * 1962-04-16 1965-11-16 Anaconda Wire & Cable Co Coating method
GB1191219A (en) * 1967-07-04 1970-05-13 Fuji Photo Film Co Ltd A Method of Producing a Magnetic Recording Medium
GB1144844A (en) * 1967-08-03 1969-03-12 Pyrene Co Ltd Coating of metals
US3682785A (en) * 1971-03-30 1972-08-08 Rca Corp Process for forming an isolated circuit pattern on a conductive substrate

Also Published As

Publication number Publication date
CH645042A5 (de) 1984-09-14
IT1119588B (it) 1986-03-10
DK515479A (da) 1980-06-06
US4321290A (en) 1982-03-23
DK151459B (da) 1987-12-07
IT7969336A0 (it) 1979-12-04
AU525331B2 (en) 1982-10-28
AU5342279A (en) 1980-06-12
SE435343B (sv) 1984-09-24
JPS6014627B2 (ja) 1985-04-15
CA1145207A (en) 1983-04-26
FR2443519A1 (fr) 1980-07-04
DK151459C (da) 1988-05-30
FR2443519B1 (sv) 1984-01-13
GB2040186A (en) 1980-08-28
SE7812499L (sv) 1980-06-06
GB2040186B (en) 1983-01-26
AT370012B (de) 1983-02-25
ATA771079A (de) 1982-07-15
JPS55116469A (en) 1980-09-08
BE880447A (fr) 1980-04-01
DE2948940C2 (de) 1986-02-27
DE2948940A1 (de) 1980-06-19

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
A85 Still pending on 85-01-01
BV The patent application has lapsed