NL7908794A - Werkwijze voor het bekleden van een metalen voorwerp op en bij een rand. - Google Patents
Werkwijze voor het bekleden van een metalen voorwerp op en bij een rand. Download PDFInfo
- Publication number
- NL7908794A NL7908794A NL7908794A NL7908794A NL7908794A NL 7908794 A NL7908794 A NL 7908794A NL 7908794 A NL7908794 A NL 7908794A NL 7908794 A NL7908794 A NL 7908794A NL 7908794 A NL7908794 A NL 7908794A
- Authority
- NL
- Netherlands
- Prior art keywords
- coating
- metal
- edge
- etched
- paint
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- ing And Chemical Polishing (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE7812499A SE435343B (sv) | 1978-12-05 | 1978-12-05 | Forfarande vid beleggning vid skarpa kanter pa metallforemal |
SE7812499 | 1978-12-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7908794A true NL7908794A (nl) | 1980-06-09 |
Family
ID=20336533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7908794A NL7908794A (nl) | 1978-12-05 | 1979-12-05 | Werkwijze voor het bekleden van een metalen voorwerp op en bij een rand. |
Country Status (14)
Country | Link |
---|---|
US (1) | US4321290A (sv) |
JP (1) | JPS6014627B2 (sv) |
AT (1) | AT370012B (sv) |
AU (1) | AU525331B2 (sv) |
BE (1) | BE880447A (sv) |
CA (1) | CA1145207A (sv) |
CH (1) | CH645042A5 (sv) |
DE (1) | DE2948940C2 (sv) |
DK (1) | DK151459C (sv) |
FR (1) | FR2443519A1 (sv) |
GB (1) | GB2040186B (sv) |
IT (1) | IT1119588B (sv) |
NL (1) | NL7908794A (sv) |
SE (1) | SE435343B (sv) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5763294A (en) * | 1980-10-06 | 1982-04-16 | Fuji Photo Film Co Ltd | Photosensitive printing plate for lithography |
JPS59102237U (ja) * | 1982-12-25 | 1984-07-10 | 筒井 将裕 | 端面を防蝕加工した塩ビ鋼板 |
US4601916A (en) * | 1984-07-18 | 1986-07-22 | Kollmorgen Technologies Corporation | Process for bonding metals to electrophoretically deposited resin coatings |
DE3517796A1 (de) * | 1985-05-17 | 1986-11-20 | Hoechst Ag, 6230 Frankfurt | Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten |
US4714646A (en) * | 1986-03-24 | 1987-12-22 | International Business Machines Corporation | Electrophoretic insulation of metal circuit board core |
US5422167A (en) * | 1993-09-17 | 1995-06-06 | Infosight Corporation | High temperature-resistant, thermally-printable label for attachment to hot metal stock and method thereof |
US5590460A (en) | 1994-07-19 | 1997-01-07 | Tessera, Inc. | Method of making multilayer circuit |
US5714234A (en) * | 1996-06-10 | 1998-02-03 | Infosight Corporation | Identification tag with preform attachment |
US6423907B1 (en) * | 1998-02-09 | 2002-07-23 | Tessera, Inc. | Components with releasable leads |
US6492201B1 (en) * | 1998-07-10 | 2002-12-10 | Tessera, Inc. | Forming microelectronic connection components by electrophoretic deposition |
US7000313B2 (en) * | 2001-03-08 | 2006-02-21 | Ppg Industries Ohio, Inc. | Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
US6713587B2 (en) | 2001-03-08 | 2004-03-30 | Ppg Industries Ohio, Inc. | Electrodepositable dielectric coating compositions and methods related thereto |
US6951707B2 (en) * | 2001-03-08 | 2005-10-04 | Ppg Industries Ohio, Inc. | Process for creating vias for circuit assemblies |
US6588095B2 (en) * | 2001-04-27 | 2003-07-08 | Hewlett-Packard Development Company, Lp. | Method of processing a device by electrophoresis coating |
EP1520454B1 (en) * | 2002-06-27 | 2012-01-25 | PPG Industries Ohio, Inc. | Single or multi-layer printed circuit board with extended breakaway tabs and method of manufacture thereof |
US20060213685A1 (en) * | 2002-06-27 | 2006-09-28 | Wang Alan E | Single or multi-layer printed circuit board with improved edge via design |
JP4970429B2 (ja) * | 2005-05-19 | 2012-07-04 | ハイドロ アルミニウム ドイチュラント ゲー エム ベー ハー | リソストリップのコンディショニング |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US813618A (en) * | 1905-07-10 | 1906-02-27 | Arlington Company | Coated strip and method of making the same. |
US3218187A (en) * | 1962-04-16 | 1965-11-16 | Anaconda Wire & Cable Co | Coating method |
GB1191219A (en) * | 1967-07-04 | 1970-05-13 | Fuji Photo Film Co Ltd | A Method of Producing a Magnetic Recording Medium |
GB1144844A (en) * | 1967-08-03 | 1969-03-12 | Pyrene Co Ltd | Coating of metals |
US3682785A (en) * | 1971-03-30 | 1972-08-08 | Rca Corp | Process for forming an isolated circuit pattern on a conductive substrate |
-
1978
- 1978-12-05 SE SE7812499A patent/SE435343B/sv not_active IP Right Cessation
-
1979
- 1979-11-29 CA CA000340850A patent/CA1145207A/en not_active Expired
- 1979-12-03 US US06/099,754 patent/US4321290A/en not_active Expired - Lifetime
- 1979-12-03 FR FR7929634A patent/FR2443519A1/fr active Granted
- 1979-12-04 IT IT69336/79A patent/IT1119588B/it active
- 1979-12-04 AU AU53422/79A patent/AU525331B2/en not_active Ceased
- 1979-12-04 DK DK515479A patent/DK151459C/da not_active IP Right Cessation
- 1979-12-05 DE DE2948940A patent/DE2948940C2/de not_active Expired
- 1979-12-05 CH CH1080679A patent/CH645042A5/de not_active IP Right Cessation
- 1979-12-05 NL NL7908794A patent/NL7908794A/nl not_active Application Discontinuation
- 1979-12-05 AT AT0771079A patent/AT370012B/de not_active IP Right Cessation
- 1979-12-05 JP JP54156951A patent/JPS6014627B2/ja not_active Expired
- 1979-12-05 BE BE0/198436A patent/BE880447A/fr not_active IP Right Cessation
- 1979-12-05 GB GB7942020A patent/GB2040186B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CH645042A5 (de) | 1984-09-14 |
IT1119588B (it) | 1986-03-10 |
DK515479A (da) | 1980-06-06 |
US4321290A (en) | 1982-03-23 |
DK151459B (da) | 1987-12-07 |
IT7969336A0 (it) | 1979-12-04 |
AU525331B2 (en) | 1982-10-28 |
AU5342279A (en) | 1980-06-12 |
SE435343B (sv) | 1984-09-24 |
JPS6014627B2 (ja) | 1985-04-15 |
CA1145207A (en) | 1983-04-26 |
FR2443519A1 (fr) | 1980-07-04 |
DK151459C (da) | 1988-05-30 |
FR2443519B1 (sv) | 1984-01-13 |
GB2040186A (en) | 1980-08-28 |
SE7812499L (sv) | 1980-06-06 |
GB2040186B (en) | 1983-01-26 |
AT370012B (de) | 1983-02-25 |
ATA771079A (de) | 1982-07-15 |
JPS55116469A (en) | 1980-09-08 |
BE880447A (fr) | 1980-04-01 |
DE2948940C2 (de) | 1986-02-27 |
DE2948940A1 (de) | 1980-06-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
A85 | Still pending on 85-01-01 | ||
BV | The patent application has lapsed |