NL7904979A - Halfgeleiderinrichting. - Google Patents
Halfgeleiderinrichting. Download PDFInfo
- Publication number
- NL7904979A NL7904979A NL7904979A NL7904979A NL7904979A NL 7904979 A NL7904979 A NL 7904979A NL 7904979 A NL7904979 A NL 7904979A NL 7904979 A NL7904979 A NL 7904979A NL 7904979 A NL7904979 A NL 7904979A
- Authority
- NL
- Netherlands
- Prior art keywords
- layer
- contact
- metal
- type
- ohmic
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 238000011065 in-situ storage Methods 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 230000005496 eutectics Effects 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 8
- 229910002696 Ag-Au Inorganic materials 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 23
- 238000001451 molecular beam epitaxy Methods 0.000 claims 3
- 239000002356 single layer Substances 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000011109 contamination Methods 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 108091006146 Channels Proteins 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 6
- 238000005275 alloying Methods 0.000 description 5
- 229910017401 Au—Ge Inorganic materials 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 238000003887 surface segregation Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 102000004129 N-Type Calcium Channels Human genes 0.000 description 2
- 108090000699 N-Type Calcium Channels Proteins 0.000 description 2
- 229910018885 Pt—Au Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000002028 premature Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- -1 Au Chemical class 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 238000013213 extrapolation Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000012048 forced swim test Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/812—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02463—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/452—Ohmic electrodes on AIII-BV compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/018—Compensation doping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/02—Contacts, special
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/088—J-Fet, i.e. junction field effect transistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US91962478 | 1978-06-27 | ||
| US05/919,624 US4186410A (en) | 1978-06-27 | 1978-06-27 | Nonalloyed ohmic contacts to n-type Group III(a)-V(a) semiconductors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7904979A true NL7904979A (nl) | 1980-01-02 |
Family
ID=25442374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7904979A NL7904979A (nl) | 1978-06-27 | 1979-06-26 | Halfgeleiderinrichting. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4186410A (fr) |
| JP (1) | JPS554999A (fr) |
| BE (1) | BE877189A (fr) |
| CA (1) | CA1125924A (fr) |
| DE (1) | DE2925791A1 (fr) |
| FR (1) | FR2430090B1 (fr) |
| GB (1) | GB2024506B (fr) |
| IT (1) | IT1121920B (fr) |
| NL (1) | NL7904979A (fr) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4226649A (en) * | 1979-09-11 | 1980-10-07 | The United States Of America As Represented By The Secretary Of The Navy | Method for epitaxial growth of GaAs films and devices configuration independent of GaAs substrate utilizing molecular beam epitaxy and substrate removal techniques |
| US4301188A (en) * | 1979-10-01 | 1981-11-17 | Bell Telephone Laboratories, Incorporated | Process for producing contact to GaAs active region |
| JPS5874084A (ja) * | 1981-10-29 | 1983-05-04 | Fujitsu Ltd | 半導体装置 |
| EP0105324A4 (fr) * | 1982-04-12 | 1986-07-24 | Motorola Inc | CONTACT OHMIQUE POUR GaAs DE TYPE N. |
| US4461071A (en) * | 1982-08-23 | 1984-07-24 | Xerox Corporation | Photolithographic process for fabricating thin film transistors |
| JPS5972723A (ja) * | 1982-10-19 | 1984-04-24 | Matsushita Electric Ind Co Ltd | ３−５族化合物半導体のオ−ミツク電極の形成方法 |
| US4651179A (en) * | 1983-01-21 | 1987-03-17 | Rca Corporation | Low resistance gallium arsenide field effect transistor |
| US4545109A (en) * | 1983-01-21 | 1985-10-08 | Rca Corporation | Method of making a gallium arsenide field effect transistor |
| US4583110A (en) * | 1984-06-14 | 1986-04-15 | International Business Machines Corporation | Intermetallic semiconductor ohmic contact |
| US4652896A (en) * | 1985-06-27 | 1987-03-24 | The United States Of America As Represented By The Secretary Of The Air Force | Modulation doped GaAs/AlGaAs field effect transistor |
| US4816881A (en) * | 1985-06-27 | 1989-03-28 | United State Of America As Represented By The Secretary Of The Navy | A TiW diffusion barrier for AuZn ohmic contacts to p-type InP |
| US4632713A (en) * | 1985-07-31 | 1986-12-30 | Texas Instruments Incorporated | Process of making Schottky barrier devices formed by diffusion before contacting |
| US4738937A (en) * | 1985-10-22 | 1988-04-19 | Hughes Aircraft Company | Method of making ohmic contact structure |
| DE3609274A1 (de) * | 1986-03-19 | 1987-09-24 | Siemens Ag | Verfahren zur herstellung eines selbstjustiert positionierten metallkontaktes |
| EP0272303A1 (fr) * | 1986-06-24 | 1988-06-29 | AT&T Corp. | Procede de fabrication de dispositifs dans des substrats semi-conducteurs iii-v et dispositifs ainsi formes |
| DE3630284A1 (de) * | 1986-09-05 | 1988-03-17 | Licentia Gmbh | Verfahren zum herstellen eines feldeffekt-transistors |
| US4853346A (en) * | 1987-12-31 | 1989-08-01 | International Business Machines Corporation | Ohmic contacts for semiconductor devices and method for forming ohmic contacts |
| US4952527A (en) * | 1988-02-19 | 1990-08-28 | Massachusetts Institute Of Technology | Method of making buffer layers for III-V devices using solid phase epitaxy |
| DE3842863A1 (de) * | 1988-12-20 | 1990-06-21 | Fraunhofer Ges Forschung | Feldeffekttransistor und verfahren zum herstellen eines feldeffekttransistors |
| US5393698A (en) * | 1989-02-01 | 1995-02-28 | California Institute Of Technology | Method for fabricating semiconductor devices |
| US5036023A (en) * | 1989-08-16 | 1991-07-30 | At&T Bell Laboratories | Rapid thermal processing method of making a semiconductor device |
| US5011792A (en) * | 1990-02-12 | 1991-04-30 | At&T Bell Laboratories | Method of making ohmic resistance WSb, contacts to III-V semiconductor materials |
| US5100835A (en) * | 1991-03-18 | 1992-03-31 | Eastman Kodak Company | Shallow ohmic contacts to N-GaAs |
| US5160793A (en) * | 1991-06-07 | 1992-11-03 | Eastman Kodak Company | Shallow ohmic contacts to n-Alx Ga1-x As |
| US5342795A (en) * | 1992-04-30 | 1994-08-30 | Texas Instruments Incorporated | Method of fabricating power VFET gate-refill |
| US5468661A (en) * | 1993-06-17 | 1995-11-21 | Texas Instruments Incorporated | Method of making power VFET device |
| JP3502651B2 (ja) * | 1993-02-08 | 2004-03-02 | トリクイント セミコンダクター テキサス、エルピー | 電極形成法 |
| JPH07307306A (ja) * | 1994-05-10 | 1995-11-21 | Nissan Motor Co Ltd | 半導体装置の製造方法 |
| US5646069A (en) * | 1995-06-07 | 1997-07-08 | Hughes Aircraft Company | Fabrication process for Alx In1-x As/Gay In1-y As power HFET ohmic contacts |
| US5811322A (en) * | 1996-07-15 | 1998-09-22 | W. L. Gore & Associates, Inc. | Method of making a broadband backside illuminated MESFET with collecting microlens |
| US8587020B2 (en) | 1997-11-19 | 2013-11-19 | Epistar Corporation | LED lamps |
| US6633120B2 (en) | 1998-11-19 | 2003-10-14 | Unisplay S.A. | LED lamps |
| EP1091393B1 (fr) * | 1999-02-18 | 2008-04-09 | The Furukawa Electric Co., Ltd. | Electrode pour dispositif a semi-conducteur et son procede de fabrication |
| JP2003522412A (ja) * | 2000-02-04 | 2003-07-22 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 埋込形チャネル電界効果トランジスタを含む半導体デバイスの製造方法 |
| US8435873B2 (en) | 2006-06-08 | 2013-05-07 | Texas Instruments Incorporated | Unguarded Schottky barrier diodes with dielectric underetch at silicide interface |
| JP5313457B2 (ja) * | 2007-03-09 | 2013-10-09 | パナソニック株式会社 | 窒化物半導体装置及びその製造方法 |
| FR2914500B1 (fr) * | 2007-03-30 | 2009-11-20 | Picogiga Internat | Dispositif electronique a contact ohmique ameliore |
| US20080258242A1 (en) * | 2007-04-19 | 2008-10-23 | Northrop Grumman Space And Mission Systems Corp. | Low contact resistance ohmic contact for a high electron mobility transistor and fabrication method thereof |
| US20080303162A1 (en) * | 2007-06-07 | 2008-12-11 | Hidetoshi Ishida | Semiconductor device |
| US11309412B1 (en) * | 2017-05-17 | 2022-04-19 | Northrop Grumman Systems Corporation | Shifting the pinch-off voltage of an InP high electron mobility transistor with a metal ring |
| CN115706156A (zh) * | 2021-08-10 | 2023-02-17 | 华为技术有限公司 | 一种半导体器件及其制备方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1027525A (fr) * | 1962-03-02 | |||
| FR1522197A (fr) * | 1966-06-08 | 1968-04-19 | Western Electric Co | Procédé pour former un contact ohmique sur de l'arséniure de gallium du type n |
| US3490140A (en) * | 1967-10-05 | 1970-01-20 | Bell Telephone Labor Inc | Methods for making semiconductor devices |
| US3684930A (en) * | 1970-12-28 | 1972-08-15 | Gen Electric | Ohmic contact for group iii-v p-types semiconductors |
| US3711745A (en) * | 1971-10-06 | 1973-01-16 | Microwave Ass Inc | Low barrier height gallium arsenide microwave schottky diodes using gold-germanium alloy |
| DD97094A1 (fr) * | 1972-05-26 | 1973-04-12 | ||
| FR2230078B1 (fr) * | 1973-05-18 | 1977-07-29 | Radiotechnique Compelec | |
| US3855613A (en) * | 1973-06-22 | 1974-12-17 | Rca Corp | A solid state switch using an improved junction field effect transistor |
| US3914785A (en) * | 1973-12-03 | 1975-10-21 | Bell Telephone Labor Inc | Germanium doped GaAs layer as an ohmic contact |
| US3928092A (en) * | 1974-08-28 | 1975-12-23 | Bell Telephone Labor Inc | Simultaneous molecular beam deposition of monocrystalline and polycrystalline III(a)-V(a) compounds to produce semiconductor devices |
| US4011583A (en) * | 1974-09-03 | 1977-03-08 | Bell Telephone Laboratories, Incorporated | Ohmics contacts of germanium and palladium alloy from group III-V n-type semiconductors |
| US3898353A (en) * | 1974-10-03 | 1975-08-05 | Us Army | Self aligned drain and gate field effect transistor |
| US3987373A (en) * | 1975-03-19 | 1976-10-19 | Lexel Corporation | Laser having etalon assembly |
| NL7609676A (nl) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Verbindingsaansluiting voor een halfgeleider- inrichting. |
-
1978
- 1978-06-27 US US05/919,624 patent/US4186410A/en not_active Expired - Lifetime
-
1979
- 1979-05-23 CA CA328,207A patent/CA1125924A/fr not_active Expired
- 1979-06-08 GB GB7920019A patent/GB2024506B/en not_active Expired
- 1979-06-22 BE BE0/195898A patent/BE877189A/fr not_active IP Right Cessation
- 1979-06-22 FR FR7916079A patent/FR2430090B1/fr not_active Expired
- 1979-06-25 IT IT23843/79A patent/IT1121920B/it active
- 1979-06-26 DE DE19792925791 patent/DE2925791A1/de active Granted
- 1979-06-26 NL NL7904979A patent/NL7904979A/nl not_active Application Discontinuation
- 1979-06-27 JP JP8028979A patent/JPS554999A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| IT7923843A0 (it) | 1979-06-25 |
| FR2430090A1 (fr) | 1980-01-25 |
| IT1121920B (it) | 1986-04-23 |
| GB2024506B (en) | 1983-04-27 |
| DE2925791A1 (de) | 1980-01-03 |
| US4186410A (en) | 1980-01-29 |
| DE2925791C2 (fr) | 1991-05-29 |
| FR2430090B1 (fr) | 1985-06-28 |
| JPS554999A (en) | 1980-01-14 |
| CA1125924A (fr) | 1982-06-15 |
| BE877189A (fr) | 1979-10-15 |
| GB2024506A (en) | 1980-01-09 |
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