NL7410353A - Werkwijze ter bereiding van 2-azetidinesulfeen- - Google Patents
Werkwijze ter bereiding van 2-azetidinesulfeen-Info
- Publication number
- NL7410353A NL7410353A NL7410353A NL7410353A NL7410353A NL 7410353 A NL7410353 A NL 7410353A NL 7410353 A NL7410353 A NL 7410353A NL 7410353 A NL7410353 A NL 7410353A NL 7410353 A NL7410353 A NL 7410353A
- Authority
- NL
- Netherlands
- Prior art keywords
- sulphines
- azetidine
- preparing
- phthalimido
- acid
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- FSLFXEDHDYJXEO-MGKZRPDYSA-N (4-nitrophenyl)methyl (5r)-6-(1,3-dioxoisoindol-2-yl)-3,3-dimethyl-4,7-dioxo-4$l^{4}-thia-1-azabicyclo[3.2.0]heptane-2-carboxylate Chemical compound O=S([C@H]1N2C(C1N1C(C3=CC=CC=C3C1=O)=O)=O)C(C)(C)C2C(=O)OCC1=CC=C([N+]([O-])=O)C=C1 FSLFXEDHDYJXEO-MGKZRPDYSA-N 0.000 abstract 1
- 238000010504 bond cleavage reaction Methods 0.000 abstract 1
- 230000007017 scission Effects 0.000 abstract 1
- RVEZZJVBDQCTEF-UHFFFAOYSA-N sulfenic acid Chemical compound SO RVEZZJVBDQCTEF-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0104—Zirconium [Zr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01045—Rhodium [Rh]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01056—Barium [Ba]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01073—Tantalum [Ta]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/917—Treatment of workpiece between coating steps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12639—Adjacent, identical composition, components
- Y10T428/12646—Group VIII or IB metal-base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12674—Ge- or Si-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Indole Compounds (AREA)
- Bipolar Transistors (AREA)
- Plural Heterocyclic Compounds (AREA)
- Cephalosporin Compounds (AREA)
- Die Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroplating Methods And Accessories (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Thyristors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US50323055 US2793420A (en) | 1955-04-22 | 1955-04-22 | Electrical contacts to silicon |
US54831055 US2810870A (en) | 1955-04-22 | 1955-11-22 | Switching transistor |
US385368A US3880880A (en) | 1955-04-22 | 1973-08-03 | Substituted 2 -azetidinesulfenic acid |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7410353A true NL7410353A (nl) | 1975-02-05 |
Family
ID=27409714
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL107361D NL107361C (sv) | 1955-04-22 | ||
NL97268D NL97268C (sv) | 1955-04-22 | ||
NL204361D NL204361A (sv) | 1955-04-22 | ||
NL212349D NL212349A (sv) | 1955-04-22 | ||
NL7410353A NL7410353A (nl) | 1955-04-22 | 1974-08-01 | Werkwijze ter bereiding van 2-azetidinesulfeen- |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL107361D NL107361C (sv) | 1955-04-22 | ||
NL97268D NL97268C (sv) | 1955-04-22 | ||
NL204361D NL204361A (sv) | 1955-04-22 | ||
NL212349D NL212349A (sv) | 1955-04-22 |
Country Status (12)
Country | Link |
---|---|
US (3) | US2793420A (sv) |
JP (1) | JPS5041852A (sv) |
BE (2) | BE818419A (sv) |
CA (1) | CA1024519A (sv) |
CH (2) | CH350047A (sv) |
DE (3) | DE1061446B (sv) |
ES (1) | ES428916A1 (sv) |
FR (3) | FR1148115A (sv) |
GB (3) | GB818419A (sv) |
IE (1) | IE39290B1 (sv) |
IL (1) | IL44951A (sv) |
NL (5) | NL7410353A (sv) |
Families Citing this family (91)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE539938A (sv) * | 1954-07-21 | |||
US2981645A (en) * | 1955-04-22 | 1961-04-25 | Ibm | Semiconductor device fabrication |
NL216614A (sv) * | 1956-05-15 | |||
US3054035A (en) * | 1956-05-17 | 1962-09-11 | Gulton Ind Inc | Ceramic components and method of making same |
US2914715A (en) * | 1956-07-02 | 1959-11-24 | Bell Telephone Labor Inc | Semiconductor diode |
US2898474A (en) * | 1956-09-04 | 1959-08-04 | Ibm | Semiconductor device encapsulation |
NL276978A (sv) * | 1956-09-05 | |||
US2881344A (en) * | 1956-09-28 | 1959-04-07 | Hyman A Michlin | Electroluminescent capacitorphosphor lamp |
US3018539A (en) * | 1956-11-06 | 1962-01-30 | Motorola Inc | Diffused base transistor and method of making same |
US2982893A (en) * | 1956-11-16 | 1961-05-02 | Raytheon Co | Electrical connections to semiconductor bodies |
US2937439A (en) * | 1956-11-21 | 1960-05-24 | Texas Instruments Inc | Method of making ohmic connections to semiconductor devices |
US2929137A (en) * | 1957-01-04 | 1960-03-22 | Texas Instruments Inc | Method of making ohmic connections to silicon semiconductor devices |
NL224227A (sv) * | 1957-01-29 | |||
US2962797A (en) * | 1957-03-12 | 1960-12-06 | John G Mavroides | Power transistors |
US2935453A (en) * | 1957-04-11 | 1960-05-03 | Sylvania Electric Prod | Manufacture of semiconductive translating devices |
US2981874A (en) * | 1957-05-31 | 1961-04-25 | Ibm | High speed, high current transistor |
US3001895A (en) * | 1957-06-06 | 1961-09-26 | Ibm | Semiconductor devices and method of making same |
BE570082A (sv) * | 1957-08-07 | 1900-01-01 | ||
DE1073555B (de) * | 1957-11-14 | 1960-01-21 | Compagnie Generale de Telegra phie sans FiI, Paris | Nichtlineare Transistoi Schaltungsanordnung |
US2957112A (en) * | 1957-12-09 | 1960-10-18 | Westinghouse Electric Corp | Treatment of tantalum semiconductor electrodes |
US3007092A (en) * | 1957-12-23 | 1961-10-31 | Hughes Aircraft Co | Semiconductor devices |
NL235544A (sv) * | 1958-01-28 | |||
BE575275A (sv) * | 1958-02-03 | 1900-01-01 | ||
US3065392A (en) * | 1958-02-07 | 1962-11-20 | Rca Corp | Semiconductor devices |
US2947925A (en) * | 1958-02-21 | 1960-08-02 | Motorola Inc | Transistor and method of making the same |
US3036250A (en) * | 1958-06-11 | 1962-05-22 | Hughes Aircraft Co | Semiconductor device |
US3060656A (en) * | 1958-06-23 | 1962-10-30 | Sylvania Electric Prod | Manufacture of hermetically sealed semiconductor device |
US3021595A (en) * | 1958-07-02 | 1962-02-20 | Texas Instruments Inc | Ohmic contacts for silicon conductor devices and method for making |
BE580254A (sv) * | 1958-07-17 | |||
US3065286A (en) * | 1958-07-25 | 1962-11-20 | Conax Corp | Thermocouple unit |
US3041509A (en) * | 1958-08-11 | 1962-06-26 | Bendix Corp | Semiconductor device |
DE1231996B (de) * | 1958-09-17 | 1967-01-05 | Siemens Ag | Verfahren zum Reinigen von Silizium-Halbleiterkoerpern |
US3071522A (en) * | 1958-10-30 | 1963-01-01 | Bell Telephone Labor Inc | Low resistance contact for semiconductors |
FR1217793A (fr) * | 1958-12-09 | 1960-05-05 | Perfectionnements à la fabrication des éléments semi-conducteurs | |
FR1209312A (fr) * | 1958-12-17 | 1960-03-01 | Hughes Aircraft Co | Perfectionnements aux dispositifs semi-conducteurs du type à jonction |
US3079254A (en) * | 1959-01-26 | 1963-02-26 | George W Crowley | Photographic fabrication of semiconductor devices |
US3219890A (en) * | 1959-02-25 | 1965-11-23 | Transitron Electronic Corp | Semiconductor barrier-layer device and terminal structure thereon |
US3253320A (en) * | 1959-02-25 | 1966-05-31 | Transitron Electronic Corp | Method of making semi-conductor devices with plated area |
US3024179A (en) * | 1959-03-12 | 1962-03-06 | Philco Corp | Semiconductor device fabrication |
US3134159A (en) * | 1959-03-26 | 1964-05-26 | Sprague Electric Co | Method for producing an out-diffused graded-base transistor |
NL252131A (sv) * | 1959-06-30 | |||
US3075892A (en) * | 1959-09-15 | 1963-01-29 | Westinghouse Electric Corp | Process for making semiconductor devices |
NL243410A (sv) * | 1959-09-16 | 1900-01-01 | ||
US3027501A (en) * | 1959-09-29 | 1962-03-27 | Bell Telephone Labor Inc | Semiconductive device |
CA673999A (en) * | 1959-10-28 | 1963-11-12 | F. Bennett Wesley | Diffusion of semiconductor bodies |
US3202489A (en) * | 1959-12-01 | 1965-08-24 | Hughes Aircraft Co | Gold-aluminum alloy bond electrode attachment |
NL259236A (sv) * | 1959-12-30 | |||
US3219837A (en) * | 1960-02-29 | 1965-11-23 | Sanyo Electric Co | Negative resistance transistors |
DE1152195B (de) * | 1960-03-11 | 1963-08-01 | Intermetall | Verfahren zum Kontaktieren von mit Aluminium legierten Halbleiter-anordnungen |
DE1166382B (de) * | 1960-04-14 | 1964-03-26 | Siemens Ag | Niederohmige Kontakt-Elektrode fuer Halbleiterbauelemente, insbesondere fuer Tunneldioden |
DE1414898A1 (de) * | 1960-11-09 | 1969-01-09 | Lucas Industries Ltd | Verfahren zur Herstellung von Halbleitern |
DE1197552B (de) * | 1961-02-22 | 1965-07-29 | Siemens Ag | Halbleiteranordnung mit einem das Halbleiter-element gasdicht einschliessenden becherfoermigen Gehaeuse und Verfahren zu ihrer Herstellung |
DE1464669B1 (de) * | 1961-03-06 | 1971-02-04 | Itt Ind Gmbh Deutsche | Halbleiterdiode mit stark spannungsabhaengiger Kapazitaet |
US3208887A (en) * | 1961-06-23 | 1965-09-28 | Ibm | Fast switching diodes |
DE1196793B (de) * | 1961-08-28 | 1965-07-15 | Elektronik M B H | Verfahren zum Kontaktieren von Halbleiter-koerpern fuer Halbleiterbauelemente |
DE1294560C2 (de) * | 1961-08-28 | 1975-01-23 | Semikron, Gesellschaft für Gleichrichterbau und Elektronik mbH, 8500 Nürnberg | Verfahren zur weichlotkontaktierung eines halbleiterbauelements |
US3274454A (en) * | 1961-09-21 | 1966-09-20 | Mallory & Co Inc P R | Semiconductor multi-stack for regulating charging of current producing cells |
NL286405A (sv) * | 1961-12-13 | |||
US3287794A (en) * | 1962-03-23 | 1966-11-29 | American Radiator & Standard | Method of soldering semiconductor discs |
US3272659A (en) * | 1962-04-05 | 1966-09-13 | Gen Motors Corp | Tubular thermoelectric array |
NL291461A (sv) * | 1962-04-18 | |||
US3126616A (en) * | 1962-10-10 | 1964-03-31 | figure | |
GB1064290A (en) * | 1963-01-14 | 1967-04-05 | Motorola Inc | Method of making semiconductor devices |
NL303035A (sv) * | 1963-02-06 | 1900-01-01 | ||
US3283271A (en) * | 1963-09-30 | 1966-11-01 | Raytheon Co | Notched semiconductor junction strain transducer |
US3246214A (en) * | 1963-04-22 | 1966-04-12 | Siliconix Inc | Horizontally aligned junction transistor structure |
GB1065192A (en) * | 1963-09-03 | 1967-04-12 | Rosemount Eng Co Ltd | Pressure gauge |
US3295089A (en) * | 1963-10-11 | 1966-12-27 | American Mach & Foundry | Semiconductor device |
US3274670A (en) * | 1965-03-18 | 1966-09-27 | Bell Telephone Labor Inc | Semiconductor contact |
US3422527A (en) * | 1965-06-21 | 1969-01-21 | Int Rectifier Corp | Method of manufacture of high voltage solar cell |
US3421206A (en) * | 1965-10-19 | 1969-01-14 | Sylvania Electric Prod | Method of forming leads on semiconductor devices |
US3463972A (en) * | 1966-06-15 | 1969-08-26 | Fairchild Camera Instr Co | Transistor structure with steep impurity gradients having fast transition between the conducting and nonconducting state |
US3451030A (en) * | 1966-07-01 | 1969-06-17 | Gen Electric | Solder-bonded semiconductor strain gauges |
US3507732A (en) * | 1966-07-05 | 1970-04-21 | Hottinger Messtechnik Baldwin | Protection of strain gage transducers |
US3479736A (en) * | 1966-08-31 | 1969-11-25 | Hitachi Ltd | Method of making a semiconductor device |
US3607379A (en) * | 1968-01-22 | 1971-09-21 | Us Navy | Microelectronic interconnection substrate |
US3632436A (en) * | 1969-07-11 | 1972-01-04 | Rca Corp | Contact system for semiconductor devices |
US3836399A (en) * | 1970-02-16 | 1974-09-17 | Texas Instruments Inc | PHOTOVOLTAIC DIODE WITH FIRST IMPURITY OF Cu AND SECOND OF Cd, Zn, OR Hg |
US3909930A (en) * | 1972-05-23 | 1975-10-07 | Motorola Inc | Method for fabricating a liquid crystal display device |
US3895975A (en) * | 1973-02-13 | 1975-07-22 | Communications Satellite Corp | Method for the post-alloy diffusion of impurities into a semiconductor |
GB1483526A (en) * | 1974-02-08 | 1977-08-24 | Gist Brocades Nv | Azetidine derivatives |
US3958741A (en) * | 1974-03-04 | 1976-05-25 | Ppg Industries, Inc. | Method of mounting silicon anodes in a chlor-alkali cell |
US3905162A (en) * | 1974-07-23 | 1975-09-16 | Silicon Material Inc | Method of preparing high yield semiconductor wafer |
FR2518812A1 (fr) * | 1981-12-23 | 1983-06-24 | Cit Alcatel | Circuit hybride resistant en pression |
US4603805A (en) * | 1985-05-20 | 1986-08-05 | Motorola, Inc. | Method for enhancing the solderability of nickel layers |
GB2188774B (en) * | 1986-04-02 | 1990-10-31 | Westinghouse Electric Corp | Method of forming a conductive pattern on a semiconductor surface |
EP0381411A3 (en) * | 1989-02-01 | 1992-03-11 | Plessey Semiconductors Limited | Methods of joining components |
DE19713984A1 (de) * | 1997-04-04 | 1998-10-08 | Gruendl & Hoffmann | Baugruppe zum Schalten elektrischer Leistungen |
DE19758444C2 (de) * | 1997-04-04 | 1999-12-09 | Gruendl & Hoffmann | Fluidgekühlte, Rechnereinheit - gesteuerte Baugruppe zum Schalten elektrischer Leistungen |
US7841542B1 (en) * | 2006-11-07 | 2010-11-30 | Howard Rosen | System for supplying communications and power to a thermostat over a two-wire system |
DE102007005161B4 (de) * | 2007-01-29 | 2009-04-09 | Nb Technologies Gmbh | Verfahren zur Metallisierung von Substraten |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2402661A (en) * | 1941-03-01 | 1946-06-25 | Bell Telephone Labor Inc | Alternating current rectifier |
BE594959A (sv) * | 1943-07-28 | |||
US2469569A (en) * | 1945-03-02 | 1949-05-10 | Bell Telephone Labor Inc | Point contact negative resistance devices |
NL84061C (sv) * | 1948-06-26 | |||
BE509317A (sv) * | 1951-03-07 | 1900-01-01 | ||
GB1130445A (en) * | 1966-04-26 | 1968-10-16 | Beecham Group Ltd | Penicillins |
US3840556A (en) * | 1971-05-28 | 1974-10-08 | Lilly Co Eli | Penicillin conversion by halogen electrophiles and anti-bacterials derived thereby |
US3843682A (en) * | 1972-05-15 | 1974-10-22 | Lilly Co Eli | 2-chlorosulfinyl-3-imido-azetedin-4-ones |
-
0
- NL NL107361D patent/NL107361C/xx active
- NL NL97268D patent/NL97268C/xx active
- NL NL204361D patent/NL204361A/xx unknown
- NL NL212349D patent/NL212349A/xx unknown
- BE BE546514D patent/BE546514A/xx unknown
-
1955
- 1955-04-22 US US50323055 patent/US2793420A/en not_active Expired - Lifetime
- 1955-11-22 US US54831055 patent/US2810870A/en not_active Expired - Lifetime
-
1956
- 1956-03-26 FR FR1148115D patent/FR1148115A/fr not_active Expired
- 1956-04-05 DE DEW18789A patent/DE1061446B/de active Pending
- 1956-04-20 GB GB1214156A patent/GB818419A/en not_active Expired
- 1956-04-21 CH CH350047D patent/CH350047A/fr unknown
- 1956-11-20 GB GB3550256A patent/GB842103A/en not_active Expired
- 1956-11-21 DE DEI12485A patent/DE1054587B/de active Pending
- 1956-11-21 FR FR1172055D patent/FR1172055A/fr not_active Expired
-
1973
- 1973-08-03 US US385368A patent/US3880880A/en not_active Expired - Lifetime
-
1974
- 1974-05-27 IE IE1117/74A patent/IE39290B1/xx unknown
- 1974-06-02 IL IL44951A patent/IL44951A/en unknown
- 1974-06-04 CA CA201,607A patent/CA1024519A/en not_active Expired
- 1974-07-16 DE DE2434208A patent/DE2434208A1/de not_active Withdrawn
- 1974-08-01 NL NL7410353A patent/NL7410353A/xx not_active Application Discontinuation
- 1974-08-02 FR FR7427015A patent/FR2239470B1/fr not_active Expired
- 1974-08-02 CH CH1066774A patent/CH608805A5/xx not_active IP Right Cessation
- 1974-08-02 BE BE1006107A patent/BE818419A/xx unknown
- 1974-08-02 GB GB3413674A patent/GB1473363A/en not_active Expired
- 1974-08-02 ES ES428916A patent/ES428916A1/es not_active Expired
- 1974-08-03 JP JP8939974A patent/JPS5041852A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
ES428916A1 (es) | 1976-08-16 |
US2793420A (en) | 1957-05-28 |
IL44951A (en) | 1976-09-30 |
FR2239470A1 (sv) | 1975-02-28 |
NL107361C (sv) | 1900-01-01 |
BE546514A (sv) | 1900-01-01 |
DE1054587B (de) | 1959-04-09 |
GB818419A (en) | 1959-08-19 |
GB1473363A (en) | 1977-05-11 |
IL44951A0 (en) | 1974-09-10 |
FR2239470B1 (sv) | 1979-03-09 |
NL204361A (sv) | 1900-01-01 |
NL97268C (sv) | 1900-01-01 |
GB842103A (en) | 1960-07-20 |
DE1061446B (de) | 1959-07-16 |
IE39290L (en) | 1975-02-03 |
CH608805A5 (sv) | 1979-01-31 |
IE39290B1 (en) | 1978-09-13 |
FR1172055A (fr) | 1959-02-05 |
US2810870A (en) | 1957-10-22 |
US3880880A (en) | 1975-04-29 |
CH350047A (fr) | 1960-11-15 |
BE818419A (fr) | 1975-02-03 |
DE2434208A1 (de) | 1975-02-13 |
FR1148115A (fr) | 1957-12-04 |
NL212349A (sv) | 1900-01-01 |
JPS5041852A (sv) | 1975-04-16 |
CA1024519A (en) | 1978-01-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NL7410353A (nl) | Werkwijze ter bereiding van 2-azetidinesulfeen- | |
FR1088704A (fr) | Procédé de préparation de résines synthétiques | |
FR1053743A (fr) | Procédé de préparation d'hydroperoxydes | |
FR1211341A (fr) | Procédé pour la préparation de 2-amino-imidazolines | |
FR1091778A (fr) | Procédé de préparation de pyrrolidines | |
FR1070051A (fr) | Procédé de préparation d'hydroperoxydes | |
FR1083312A (fr) | Procédé pour la préparation de combinaisons silico-organiques | |
FR1086656A (fr) | Procédé de préparation de fer-dicyclopentadiènyle | |
FR1081691A (fr) | Procédé de préparation de triméthylolpropane | |
FR1092984A (fr) | Procédé de préparation de la dl-11-céto-progestérone | |
FR1167712A (fr) | Procédé pour la préparation de caroténoïdes | |
FR1210619A (fr) | Procédé pour la préparation de caroténoïdes | |
FR1167424A (fr) | Procédé de fabrication de compositions de pénicilline | |
FR1089956A (fr) | Procédé de préparation de 4-(p-aminobenzènesulfonyl)-aminopyrimidines | |
FR1060371A (fr) | Procédé de préparation de brome-hydroquinone | |
CH313555A (fr) | Procédé de préparation de polyhalogénométhanes | |
FR1148219A (fr) | Procédé pour la préparation de la 4-stilbènaldéhyde | |
FR1070165A (fr) | Procédé pour la préparation du bichlorure p-xylylénique | |
FR1165026A (fr) | Procédé de préparation de déhydrosteroïdes polyoxygénés | |
FR1186105A (fr) | Procédé de préparation de la 11-bêta, 17-alpha-dihydroxyprégnane-3, 20-dione | |
FR1067026A (fr) | Procédé pour l'humification intégrale de la tourbe | |
FR1083591A (fr) | Procédé pour la fabrication de pièces façonnées par collage | |
FR1091734A (fr) | Procédé de préparation de la cortisone | |
FR1209885A (fr) | Procédé pour la préparation de caroténoïdes | |
FR1215513A (fr) | Procédé pour la préparation de caroténoïdes |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
BV | The patent application has lapsed |