NL7304183A - - Google Patents
Info
- Publication number
- NL7304183A NL7304183A NL7304183A NL7304183A NL7304183A NL 7304183 A NL7304183 A NL 7304183A NL 7304183 A NL7304183 A NL 7304183A NL 7304183 A NL7304183 A NL 7304183A NL 7304183 A NL7304183 A NL 7304183A
- Authority
- NL
- Netherlands
- Prior art keywords
- layer
- photoresist
- pads
- leads
- exposed
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/036—Manufacturing methods by patterning a pre-deposited material
- H01L2224/03622—Manufacturing methods by patterning a pre-deposited material using masks
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/1147—Manufacturing methods using a lift-off mask
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
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- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/01015—Phosphorus [P]
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- H01L2924/01019—Potassium [K]
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- H01L2924/01024—Chromium [Cr]
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01039—Yttrium [Y]
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- H01L2924/01072—Hafnium [Hf]
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- H01L2924/01078—Platinum [Pt]
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- H01L2924/01079—Gold [Au]
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- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01084—Polonium [Po]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US00238116A US3821785A (en) | 1972-03-27 | 1972-03-27 | Semiconductor structure with bumps |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7304183A true NL7304183A (ja) | 1973-10-01 |
Family
ID=22896575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7304183A NL7304183A (ja) | 1972-03-27 | 1973-03-26 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3821785A (ja) |
JP (1) | JPS52670B2 (ja) |
CA (1) | CA984060A (ja) |
DE (1) | DE2314731C3 (ja) |
FR (1) | FR2178007B1 (ja) |
GB (1) | GB1377601A (ja) |
IT (1) | IT981659B (ja) |
NL (1) | NL7304183A (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3906541A (en) * | 1974-03-29 | 1975-09-16 | Gen Electric | Field effect transistor devices and methods of making same |
JPS5130673U (ja) * | 1974-08-26 | 1976-03-05 | ||
US3959522A (en) * | 1975-04-30 | 1976-05-25 | Rca Corporation | Method for forming an ohmic contact |
JPS51147253A (en) * | 1975-06-13 | 1976-12-17 | Nec Corp | Structure of electrode terminal |
US4293637A (en) * | 1977-05-31 | 1981-10-06 | Matsushita Electric Industrial Co., Ltd. | Method of making metal electrode of semiconductor device |
DE3135007A1 (de) * | 1981-09-04 | 1983-03-24 | Licentia Gmbh | Mehrschichtenkontakt fuer eine halbleiteranordnung |
JPS59193036A (ja) * | 1983-04-16 | 1984-11-01 | Toshiba Corp | 半導体装置の製造方法 |
US5134460A (en) * | 1986-08-11 | 1992-07-28 | International Business Machines Corporation | Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding |
US4742023A (en) * | 1986-08-28 | 1988-05-03 | Fujitsu Limited | Method for producing a semiconductor device |
US4875617A (en) * | 1987-01-20 | 1989-10-24 | Citowsky Elya L | Gold-tin eutectic lead bonding method and structure |
US4937006A (en) * | 1988-07-29 | 1990-06-26 | International Business Machines Corporation | Method and apparatus for fluxless solder bonding |
US5130779A (en) * | 1990-06-19 | 1992-07-14 | International Business Machines Corporation | Solder mass having conductive encapsulating arrangement |
KR960016007B1 (ko) * | 1993-02-08 | 1996-11-25 | 삼성전자 주식회사 | 반도체 칩 범프의 제조방법 |
US6428942B1 (en) * | 1999-10-28 | 2002-08-06 | Fujitsu Limited | Multilayer circuit structure build up method |
US6214646B1 (en) * | 2000-02-29 | 2001-04-10 | Lucent Technologies Inc. | Soldering optical subassemblies |
US6818545B2 (en) * | 2001-03-05 | 2004-11-16 | Megic Corporation | Low fabrication cost, fine pitch and high reliability solder bump |
US20040140219A1 (en) * | 2003-01-21 | 2004-07-22 | Texas Instruments Incorporated | System and method for pulse current plating |
DE102004024644A1 (de) * | 2004-05-18 | 2005-12-22 | Infineon Technologies Ag | Verfahren zum Aufbringen metallischer Strukturen auf Substrate und Halbleiterbauelement |
US7730790B2 (en) * | 2004-08-10 | 2010-06-08 | Nordson Corporation | Shear test device |
DE102005055280B3 (de) * | 2005-11-17 | 2007-04-12 | Infineon Technologies Ag | Verbindungselement zwischen Halbleiterchip und Schaltungsträger sowie Verfahren zur Herstellung und Verwendung des Verbindungselements |
TWI298204B (en) * | 2005-11-21 | 2008-06-21 | Advanced Semiconductor Eng | Structure of bumps forming on an under metallurgy layer and method for making the same |
WO2007093799A1 (en) * | 2006-02-17 | 2007-08-23 | Dage Precision Industries Ltd. | Shear test apparatus and method |
DE102008042107A1 (de) * | 2008-09-15 | 2010-03-18 | Robert Bosch Gmbh | Elektronisches Bauteil sowie Verfahren zu seiner Herstellung |
TWM397591U (en) * | 2010-04-22 | 2011-02-01 | Mao Bang Electronic Co Ltd | Bumping structure |
KR102430984B1 (ko) * | 2015-09-22 | 2022-08-09 | 삼성전자주식회사 | 반도체 장치 및 이의 제조 방법 |
US10903151B2 (en) * | 2018-05-23 | 2021-01-26 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1196834A (en) * | 1967-03-29 | 1970-07-01 | Hitachi Ltd | Improvement of Electrode Structure in a Semiconductor Device. |
FR1569479A (ja) * | 1967-07-13 | 1969-05-30 |
-
1972
- 1972-03-27 US US00238116A patent/US3821785A/en not_active Expired - Lifetime
-
1973
- 1973-03-02 CA CA165,113A patent/CA984060A/en not_active Expired
- 1973-03-06 GB GB1088173A patent/GB1377601A/en not_active Expired
- 1973-03-24 DE DE2314731A patent/DE2314731C3/de not_active Expired
- 1973-03-26 NL NL7304183A patent/NL7304183A/xx unknown
- 1973-03-26 FR FR7310813A patent/FR2178007B1/fr not_active Expired
- 1973-03-27 IT IT22206/73A patent/IT981659B/it active
- 1973-03-27 JP JP48034978A patent/JPS52670B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS52670B2 (ja) | 1977-01-10 |
FR2178007B1 (ja) | 1978-08-04 |
DE2314731B2 (de) | 1980-06-04 |
CA984060A (en) | 1976-02-17 |
DE2314731A1 (de) | 1973-10-11 |
DE2314731C3 (de) | 1982-10-14 |
IT981659B (it) | 1974-10-10 |
US3821785A (en) | 1974-06-28 |
FR2178007A1 (ja) | 1973-11-09 |
JPS499187A (ja) | 1974-01-26 |
GB1377601A (en) | 1974-12-18 |
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