NL7208027A - - Google Patents

Info

Publication number
NL7208027A
NL7208027A NL7208027A NL7208027A NL7208027A NL 7208027 A NL7208027 A NL 7208027A NL 7208027 A NL7208027 A NL 7208027A NL 7208027 A NL7208027 A NL 7208027A NL 7208027 A NL7208027 A NL 7208027A
Authority
NL
Netherlands
Prior art keywords
semiconductor body
substrate
metal layer
temperature
pressure
Prior art date
Application number
NL7208027A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7208027A publication Critical patent/NL7208027A/xx

Links

Classifications

    • H10W72/30—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/352—
    • H10W72/354—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Die Bonding (AREA)
  • Ceramic Products (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
NL7208027A 1971-06-17 1972-06-13 NL7208027A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2844971A GB1389542A (en) 1971-06-17 1971-06-17 Methods of securing a semiconductor body to a support

Publications (1)

Publication Number Publication Date
NL7208027A true NL7208027A (enExample) 1972-12-19

Family

ID=10275803

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7208027A NL7208027A (enExample) 1971-06-17 1972-06-13

Country Status (5)

Country Link
US (1) US3883946A (enExample)
DE (1) DE2229070A1 (enExample)
FR (1) FR2142073B1 (enExample)
GB (1) GB1389542A (enExample)
NL (1) NL7208027A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3499553A1 (de) * 2017-12-13 2019-06-19 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung eines mit einer lotvorform verbundenen bauelements mittels heisspressens unterhalb der schmelztemperatur des lotmaterials

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1490125A (en) * 1975-04-23 1977-10-26 Rolls Royce Electrophoretic method of applying a coating to a metal surface
US3956821A (en) * 1975-04-28 1976-05-18 Fairchild Camera And Instrument Corporation Method of attaching semiconductor die to package substrates
US3981427A (en) * 1975-04-28 1976-09-21 Brookes Ronald R Method of laminating graphite sheets to a metal substrate
US4181249A (en) * 1977-08-26 1980-01-01 Hughes Aircraft Company Eutectic die attachment method for integrated circuits
FR2431900A1 (fr) * 1978-07-25 1980-02-22 Thomson Csf Systeme de soudure d'un laser a semiconducteur sur un socle metallique
IT1210953B (it) * 1982-11-19 1989-09-29 Ates Componenti Elettron Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.
GB2132601B (en) * 1982-12-23 1986-08-20 Ferranti Plc Joining articles of materials of different expansion coefficients
SU1114253A1 (ru) * 1983-02-03 1987-03-23 Научно-Исследовательский Институт Производственного Объединения "Тэз Им.М.И.Калинина" Способ изготовлени выпр мительных элементов
JPS59193036A (ja) * 1983-04-16 1984-11-01 Toshiba Corp 半導体装置の製造方法
GB8323065D0 (en) * 1983-08-26 1983-09-28 Rca Corp Flux free photo-detector soldering
US4582240A (en) * 1984-02-08 1986-04-15 Gould Inc. Method for low temperature, low pressure metallic diffusion bonding of piezoelectric components
US4605833A (en) * 1984-03-15 1986-08-12 Westinghouse Electric Corp. Lead bonding of integrated circuit chips
US4609139A (en) * 1984-05-14 1986-09-02 Rca Corporation Method of burnishing malleable films on semiconductor substrates
US4576326A (en) * 1984-05-14 1986-03-18 Rca Corporation Method of bonding semiconductor devices to heatsinks
US4810671A (en) * 1986-06-12 1989-03-07 Intel Corporation Process for bonding die to substrate using a gold/silicon seed
US4771018A (en) * 1986-06-12 1988-09-13 Intel Corporation Process of attaching a die to a substrate using gold/silicon seed
ES2035837T3 (es) * 1986-08-18 1993-05-01 Siemens Aktiengesellschaft Componente de capa de relleno.
US4829020A (en) * 1987-10-23 1989-05-09 The United States Of America As Represented By The United States Department Of Energy Substrate solder barriers for semiconductor epilayer growth
DE4220875A1 (de) * 1992-06-25 1994-01-13 Eupec Gmbh & Co Kg Verfahren zum Verbinden eines Halbleiterkörpers mit Kontaktscheiben
JP3579740B2 (ja) * 1998-04-18 2004-10-20 Ｔｄｋ株式会社 電子部品の製造方法
US6758387B1 (en) * 1999-10-20 2004-07-06 Senju Metal Industry Co., Ltd. Solder coated material and method for its manufacture
FI108376B (fi) * 2000-03-21 2002-01-15 Outokumpu Oy Menetelmõ sõhk÷õjohtavan liitoksen muodostamiseksi
KR100387488B1 (ko) * 2001-04-25 2003-06-18 현대자동차주식회사 레이저 클래딩 공법을 이용한 밸브 시트 제조방법
JP2003209144A (ja) * 2002-01-16 2003-07-25 Seiko Epson Corp 半導体装置及びその製造方法、半導体装置の製造装置並びに電子機器
US7436058B2 (en) * 2002-05-09 2008-10-14 Intel Corporation Reactive solder material
US9214442B2 (en) 2007-03-19 2015-12-15 Infineon Technologies Ag Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip
US8587116B2 (en) 2010-09-30 2013-11-19 Infineon Technologies Ag Semiconductor module comprising an insert
CN103305909B (zh) * 2012-03-14 2016-01-20 东莞市中镓半导体科技有限公司 一种用于GaN生长的复合衬底的制备方法
US10596782B2 (en) * 2015-06-04 2020-03-24 Sumitomo Electric Industries, Ltd. Substrate for printed circuit board and printed circuit board
CN106735982A (zh) * 2016-12-09 2017-05-31 徐超 一种电机绕组引线与绕组间电磁线连接方法
EP3499554A1 (de) * 2017-12-13 2019-06-19 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung einer sandwichanordnung aus zwei bauelementen mit dazwischen befindlichem lot mittels heisspressens unterhalb der schmelztemperatur des lotmaterials einer lotvorform

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL275554A (enExample) * 1961-04-19 1900-01-01
NL283249A (enExample) * 1961-09-19 1900-01-01
US3333324A (en) * 1964-09-28 1967-08-01 Rca Corp Method of manufacturing semiconductor devices
GB1199955A (en) * 1967-07-07 1970-07-22 Mullard Ltd Improvements in or relating to Methods of Manufacturing Semiconductor Devices
GB1256518A (enExample) * 1968-11-30 1971-12-08
GB1297046A (enExample) * 1969-08-25 1972-11-22
GB1374626A (en) * 1970-10-30 1974-11-20 Matsushita Electronics Corp Method of making a semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3499553A1 (de) * 2017-12-13 2019-06-19 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung eines mit einer lotvorform verbundenen bauelements mittels heisspressens unterhalb der schmelztemperatur des lotmaterials
WO2019115077A1 (de) * 2017-12-13 2019-06-20 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung eines mit einer lotvorform verbundenen bauelements

Also Published As

Publication number Publication date
FR2142073B1 (enExample) 1977-12-23
FR2142073A1 (enExample) 1973-01-26
GB1389542A (en) 1975-04-03
US3883946A (en) 1975-05-20
DE2229070A1 (de) 1973-01-11

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