|
NL281483A
(enExample)
*
|
1961-10-31 |
1900-01-01 |
|
|
|
FR1393375A
(fr)
*
|
1964-01-24 |
1965-03-26 |
Radiotechnique |
Procédé de réalisation d'un contact ohmique sur du silicium de forte résistivité
|
|
GB1004020A
(en)
*
|
1964-04-24 |
1965-09-08 |
Standard Telephones Cables Ltd |
Improvements in or relating to the mounting of electrical components
|
|
DE1514565B2
(de)
*
|
1965-09-08 |
1970-10-08 |
Semikron, Gesellschaft für Gleichrichterbau und Elektronik mbH, 85OO Nürnberg |
Verfahren zur Herstellung von Halbleiteranordnungen
|
|
DE1298632B
(de)
*
|
1965-10-26 |
1969-07-03 |
Siemens Ag |
Verfahren zum sperrfreien Verbinden eines Halbleiterkoerpers mit einer metallischen Tragplatte
|
|
US3447236A
(en)
*
|
1966-02-11 |
1969-06-03 |
Western Electric Co |
Method of bonding an electrical part to an electrical contact
|
|
US3442007A
(en)
*
|
1966-12-29 |
1969-05-06 |
Kewanee Oil Co |
Process of attaching a collector grid to a photovoltaic cell
|
|
US3505728A
(en)
*
|
1967-09-01 |
1970-04-14 |
Atomic Energy Authority Uk |
Method of making thermoelectric modules
|
|
DE1803489A1
(de)
*
|
1968-10-17 |
1970-05-27 |
Siemens Ag |
Verfahren zum Herstellen eines Halbleiterbauelementes
|
|
US3654694A
(en)
*
|
1969-04-28 |
1972-04-11 |
Hughes Aircraft Co |
Method for bonding contacts to and forming alloy sites on silicone carbide
|
|
US3614547A
(en)
*
|
1970-03-16 |
1971-10-19 |
Gen Electric |
Tungsten barrier electrical connection
|
|
US3686748A
(en)
*
|
1970-04-13 |
1972-08-29 |
William E Engeler |
Method and apparatus for providng thermal contact and electrical isolation of integrated circuits
|
|
US3602777A
(en)
*
|
1970-04-21 |
1971-08-31 |
Westinghouse Electric Corp |
Silicon carbide semiconductor device with heavily doped silicon carbide ohmic contacts
|
|
GB1389542A
(en)
*
|
1971-06-17 |
1975-04-03 |
Mullard Ltd |
Methods of securing a semiconductor body to a support
|
|
US3850604A
(en)
*
|
1972-12-11 |
1974-11-26 |
Gte Laboratories Inc |
Preparation of chalcogenide glass sputtering targets
|
|
US4267953A
(en)
*
|
1978-04-06 |
1981-05-19 |
The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration |
Method for alleviating thermal stress damage in laminates
|
|
US4211354A
(en)
*
|
1978-04-06 |
1980-07-08 |
The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration |
Method for alleviating thermal stress damage in laminates
|
|
DE2926756C2
(de)
*
|
1979-07-03 |
1984-03-22 |
Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt |
Schottky-Dioden-Anordnung
|
|
US4444352A
(en)
*
|
1981-09-17 |
1984-04-24 |
General Electric Company |
Method of thermo-compression diffusion bonding together metal surfaces
|
|
SU1114253A1
(ru)
*
|
1983-02-03 |
1987-03-23 |
Научно-Исследовательский Институт Производственного Объединения "Тэз Им.М.И.Калинина" |
Способ изготовлени выпр мительных элементов
|
|
US4767049A
(en)
*
|
1986-05-19 |
1988-08-30 |
Olin Corporation |
Special surfaces for wire bonding
|
|
EP0330896A3
(de)
*
|
1988-03-03 |
1991-01-09 |
Siemens Aktiengesellschaft |
Verfahren zum Befestigen von Halbleiterbauelementen auf Substraten und Anordnungen zur Durchführung desselben
|
|
US6141870A
(en)
*
|
1997-08-04 |
2000-11-07 |
Peter K. Trzyna |
Method for making electrical device
|