NL7010204A - - Google Patents
Info
- Publication number
- NL7010204A NL7010204A NL7010204A NL7010204A NL7010204A NL 7010204 A NL7010204 A NL 7010204A NL 7010204 A NL7010204 A NL 7010204A NL 7010204 A NL7010204 A NL 7010204A NL 7010204 A NL7010204 A NL 7010204A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
- H10D84/401—Combinations of FETs or IGBTs with BJTs
- H10D84/403—Combinations of FETs or IGBTs with BJTs and with one or more of diodes, resistors or capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/112—Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
- H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
- H10D84/615—Combinations of vertical BJTs and one or more of resistors or capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/61—Formation of materials, e.g. in the shape of layers or pillars of insulating materials using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/012—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS]
- H10W10/0121—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS] in regions recessed from the surface, e.g. in trenches or grooves
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/012—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS]
- H10W10/0125—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS] comprising introducing electrical impurities in local oxidation regions, e.g. to alter LOCOS oxide growth characteristics
- H10W10/0126—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS] comprising introducing electrical impurities in local oxidation regions, e.g. to alter LOCOS oxide growth characteristics introducing electrical active impurities in local oxidation regions to create channel stoppers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
- H10W10/13—Isolation regions comprising dielectric materials formed using local oxidation of silicon [LOCOS], e.g. sealed interface localised oxidation [SILO] or side-wall mask isolation [SWAMI]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W15/00—Highly-doped buried regions of integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W15/00—Highly-doped buried regions of integrated devices
- H10W15/01—Manufacture or treatment
Priority Applications (34)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NLAANVRAGE7010204,A NL170902C (nl) | 1970-07-10 | 1970-07-10 | Halfgeleiderinrichting, in het bijzonder monolithische geintegreerde halfgeleiderschakeling. |
| SE08804/71A SE368479B (enExample) | 1970-07-10 | 1971-07-07 | |
| CA117580A CA926029A (en) | 1970-07-10 | 1971-07-07 | Semiconductor device having a transistor |
| CH1000871A CH535496A (de) | 1970-07-10 | 1971-07-07 | Monolithische, integrierte Schaltung |
| GB3184471A GB1360243A (en) | 1970-07-10 | 1971-07-07 | Semiconductor devices |
| CH1000771A CH533364A (de) | 1970-07-10 | 1971-07-07 | Monolitische, intergrierte Schaltung |
| CH1001371A CH542517A (de) | 1970-07-10 | 1971-07-07 | Halbleitervorrichtung mit einem Transistor und Verfahren zur Herstellung der Halbleitervorrichtung |
| GB3183971A GB1364676A (en) | 1970-07-10 | 1971-07-07 | Semiconductor integrated device |
| CA117,581A CA1102012A (en) | 1970-07-10 | 1971-07-07 | Semiconductor device, in particular integrated monolithic circuit, and method of manufacturing same |
| GB1028374A GB1364677A (en) | 1970-07-10 | 1971-07-07 | Semiconductor devices and methods of making semiconductor devices |
| SE08805/71A SE368480B (enExample) | 1970-07-10 | 1971-07-07 | |
| GB3184571A GB1353997A (en) | 1970-07-10 | 1971-07-07 | Semiconductor integrated devices |
| DE19712133981 DE2133981C3 (de) | 1970-07-10 | 1971-07-08 | Halbleiterbauelement mit einem Halbleiterkörper mit einem Transistor und Verfahren zu seiner Herstellung |
| ES393040A ES393040A1 (es) | 1970-07-10 | 1971-07-08 | Un dispositivo semiconductor. |
| BE769735A BE769735A (fr) | 1970-07-10 | 1971-07-08 | Dispositif semiconducteur, en particulier circuit monolithique integre,et procede de fabrication de ce dispositif |
| ES393035A ES393035A1 (es) | 1970-07-10 | 1971-07-08 | Un dispositivo semiconductor. |
| DE2133982A DE2133982C2 (de) | 1970-07-10 | 1971-07-08 | Integriertes Halbleiterbauelement mit einer von einer vergrabenen Schicht gebildeten leitenden Verbindung |
| ES393041A ES393041A1 (es) | 1970-07-10 | 1971-07-08 | Un dispositivo semiconductor. |
| AT594371A AT351596B (de) | 1970-07-10 | 1971-07-08 | Halbleiteranordnung, insbesondere monolithische integrierte schaltung mit von zum teil durch eine versenkte isolierschicht gebildete isolierzonen umgebenen inseln |
| BE769734A BE769734A (fr) | 1970-07-10 | 1971-07-08 | Dispositif semiconducteur comportant un transistor |
| BE769729A BE769729A (fr) | 1970-07-10 | 1971-07-08 | Dispositif semiconducteur, en particulier un circuit integre monolithique et procede de fabrication de ce dispositif |
| DE2133976A DE2133976C3 (de) | 1970-07-10 | 1971-07-08 | Monolithisch integrierte Halbleiteranordnung |
| FR7125298A FR2098324B1 (enExample) | 1970-07-10 | 1971-07-09 | |
| FR7125299A FR2098325B1 (enExample) | 1970-07-10 | 1971-07-09 | |
| FR7125293A FR2098319B1 (enExample) | 1970-07-10 | 1971-07-09 | |
| JP46050732A JPS5010101B1 (enExample) | 1970-07-10 | 1971-07-10 | |
| JP46050731A JPS517550B1 (enExample) | 1970-07-10 | 1971-07-10 | |
| JP46050730A JPS4945629B1 (enExample) | 1970-07-10 | 1971-07-10 | |
| BR4395/71A BR7104395D0 (pt) | 1970-07-10 | 1971-07-12 | Dispositivo semicondutor mais especialmente um circuito integrado monolitico |
| HK593/72*UA HK59376A (en) | 1970-07-10 | 1976-09-23 | Semiconductor integrated device |
| HK585/76*UA HK58576A (en) | 1970-07-10 | 1976-09-23 | Improvements in and relating to semiconductor integrated devices |
| HK590/76*UA HK59076A (en) | 1970-07-10 | 1976-09-23 | Improvements in and relating to semiconductor devices |
| HK594/76*UA HK59476A (en) | 1970-07-10 | 1976-09-23 | Semiconductor devices and methods of making semiconductor devices |
| US07/021,563 US4903109A (en) | 1970-07-10 | 1987-03-02 | Semiconductor devices having local oxide isolation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NLAANVRAGE7010204,A NL170902C (nl) | 1970-07-10 | 1970-07-10 | Halfgeleiderinrichting, in het bijzonder monolithische geintegreerde halfgeleiderschakeling. |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NL7010204A true NL7010204A (enExample) | 1972-01-12 |
| NL170902B NL170902B (nl) | 1982-08-02 |
| NL170902C NL170902C (nl) | 1983-01-03 |
Family
ID=19810544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NLAANVRAGE7010204,A NL170902C (nl) | 1970-07-10 | 1970-07-10 | Halfgeleiderinrichting, in het bijzonder monolithische geintegreerde halfgeleiderschakeling. |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US4903109A (enExample) |
| JP (1) | JPS4945629B1 (enExample) |
| BE (1) | BE769729A (enExample) |
| BR (1) | BR7104395D0 (enExample) |
| CH (1) | CH535496A (enExample) |
| DE (1) | DE2133976C3 (enExample) |
| ES (1) | ES393035A1 (enExample) |
| FR (1) | FR2098319B1 (enExample) |
| GB (1) | GB1364676A (enExample) |
| HK (2) | HK59476A (enExample) |
| NL (1) | NL170902C (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6093620A (en) * | 1971-02-02 | 2000-07-25 | National Semiconductor Corporation | Method of fabricating integrated circuits with oxidized isolation |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT979178B (it) * | 1972-05-11 | 1974-09-30 | Ibm | Resistore per dispositivi a circuito integrato |
| DE2235865A1 (de) * | 1972-07-21 | 1974-01-31 | Licentia Gmbh | Halbleiteranordnung aus einer vielzahl von in einem gemeinsamen halbleiterkoerper untergebrachten halbleiterbauelementen |
| JPS598065B2 (ja) * | 1976-01-30 | 1984-02-22 | 松下電子工業株式会社 | Mos集積回路の製造方法 |
| DE2708639A1 (de) * | 1977-02-28 | 1978-08-31 | Siemens Ag | Transistoranordnung auf einem halbleiterplaettchen |
| FR2480036A1 (fr) * | 1980-04-04 | 1981-10-09 | Thomson Csf | Structure de dispositif a semi-conducteur a anneau de garde et a fonctionnement unipolaire |
| JPS5931052A (ja) * | 1982-08-13 | 1984-02-18 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
| US5290396A (en) * | 1991-06-06 | 1994-03-01 | Lsi Logic Corporation | Trench planarization techniques |
| US5413966A (en) * | 1990-12-20 | 1995-05-09 | Lsi Logic Corporation | Shallow trench etch |
| US5248625A (en) * | 1991-06-06 | 1993-09-28 | Lsi Logic Corporation | Techniques for forming isolation structures |
| US5252503A (en) * | 1991-06-06 | 1993-10-12 | Lsi Logic Corporation | Techniques for forming isolation structures |
| US5225358A (en) * | 1991-06-06 | 1993-07-06 | Lsi Logic Corporation | Method of forming late isolation with polishing |
| JP3979661B2 (ja) * | 1994-04-15 | 2007-09-19 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 半導体素子と電気的に接触する導体パターンを設けた支持バーによる装置の製造方法 |
| US5783470A (en) * | 1995-12-14 | 1998-07-21 | Lsi Logic Corporation | Method of making CMOS dynamic random-access memory structures and the like |
| KR100456691B1 (ko) * | 2002-03-05 | 2004-11-10 | 삼성전자주식회사 | 이중격리구조를 갖는 반도체 소자 및 그 제조방법 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1077851A (en) * | 1962-05-28 | 1967-08-02 | Ultra Electronics Ltd | Transistors |
| US3254277A (en) * | 1963-02-27 | 1966-05-31 | United Aircraft Corp | Integrated circuit with component defining groove |
| US3386865A (en) * | 1965-05-10 | 1968-06-04 | Ibm | Process of making planar semiconductor devices isolated by encapsulating oxide filled channels |
| US3442011A (en) * | 1965-06-30 | 1969-05-06 | Texas Instruments Inc | Method for isolating individual devices in an integrated circuit monolithic bar |
| US3615929A (en) * | 1965-07-08 | 1971-10-26 | Texas Instruments Inc | Method of forming epitaxial region of predetermined thickness and article of manufacture |
| NL153374B (nl) * | 1966-10-05 | 1977-05-16 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting voorzien van een oxydelaag en halfgeleiderinrichting vervaardigd volgens de werkwijze. |
| US3481801A (en) * | 1966-10-10 | 1969-12-02 | Frances Hugle | Isolation technique for integrated circuits |
| US3534234A (en) * | 1966-12-15 | 1970-10-13 | Texas Instruments Inc | Modified planar process for making semiconductor devices having ultrafine mesa type geometry |
| US3653988A (en) * | 1968-02-05 | 1972-04-04 | Bell Telephone Labor Inc | Method of forming monolithic semiconductor integrated circuit devices |
| US3648125A (en) * | 1971-02-02 | 1972-03-07 | Fairchild Camera Instr Co | Method of fabricating integrated circuits with oxidized isolation and the resulting structure |
-
1970
- 1970-07-10 NL NLAANVRAGE7010204,A patent/NL170902C/xx not_active IP Right Cessation
-
1971
- 1971-07-07 GB GB3183971A patent/GB1364676A/en not_active Expired
- 1971-07-07 CH CH1000871A patent/CH535496A/de not_active IP Right Cessation
- 1971-07-08 ES ES393035A patent/ES393035A1/es not_active Expired
- 1971-07-08 DE DE2133976A patent/DE2133976C3/de not_active Expired
- 1971-07-08 BE BE769729A patent/BE769729A/xx unknown
- 1971-07-09 FR FR7125293A patent/FR2098319B1/fr not_active Expired
- 1971-07-10 JP JP46050730A patent/JPS4945629B1/ja active Pending
- 1971-07-12 BR BR4395/71A patent/BR7104395D0/pt unknown
-
1976
- 1976-09-23 HK HK594/76*UA patent/HK59476A/xx unknown
- 1976-09-23 HK HK593/72*UA patent/HK59376A/xx unknown
-
1987
- 1987-03-02 US US07/021,563 patent/US4903109A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6093620A (en) * | 1971-02-02 | 2000-07-25 | National Semiconductor Corporation | Method of fabricating integrated circuits with oxidized isolation |
Also Published As
| Publication number | Publication date |
|---|---|
| NL170902B (nl) | 1982-08-02 |
| HK59476A (en) | 1976-10-01 |
| HK59376A (en) | 1976-10-01 |
| FR2098319B1 (enExample) | 1976-05-28 |
| BR7104395D0 (pt) | 1973-04-05 |
| CH535496A (de) | 1973-03-31 |
| GB1364676A (en) | 1974-08-29 |
| DE2133976C3 (de) | 1981-07-23 |
| DE2133976A1 (de) | 1972-01-13 |
| NL170902C (nl) | 1983-01-03 |
| JPS4945629B1 (enExample) | 1974-12-05 |
| US4903109A (en) | 1990-02-20 |
| DE2133976B2 (de) | 1979-07-12 |
| ES393035A1 (es) | 1973-08-16 |
| FR2098319A1 (enExample) | 1972-03-10 |
| BE769729A (fr) | 1972-01-10 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| V4 | Discontinued because of reaching the maximum lifetime of a patent |