GB1077851A - Transistors - Google Patents
TransistorsInfo
- Publication number
- GB1077851A GB1077851A GB2036762A GB2036762A GB1077851A GB 1077851 A GB1077851 A GB 1077851A GB 2036762 A GB2036762 A GB 2036762A GB 2036762 A GB2036762 A GB 2036762A GB 1077851 A GB1077851 A GB 1077851A
- Authority
- GB
- United Kingdom
- Prior art keywords
- channel
- region
- source
- metal
- alloyed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 238000005275 alloying Methods 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 230000005669 field effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66893—Unipolar field-effect transistors with a PN junction gate, i.e. JFET
- H01L29/66901—Unipolar field-effect transistors with a PN junction gate, i.e. JFET with a PN homojunction gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
1,077,851. Transistors. ULTRA ELECTRONICS Ltd. Feb. 28, 1964 [Nov. 28, 1962], No. 20367/62. Heading H1K. A constriction is formed in the channel of a field-effect transistor by modifying the characteristics of the semi-conductor body between a surface of the body lying in the 100 crystallographic plane and the 111 crystallographic planes lying within the body, so as to define a boundary of the channel in the constricted region. As shown, a groove separating the source and drain areas is formed by evaporating a metal (e.g. aluminium) on to the semiconductor surface, alloying the metal into the surface, and then removing the alloyed portion by etching. The groove may be rectangular in plan (Fig. 6), so that the drain surrounds the source. Alternatively, the alloyed region may be left in place, forming a rectifying junction with the channel region.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2036762A GB1077851A (en) | 1962-05-28 | 1962-05-28 | Transistors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2036762A GB1077851A (en) | 1962-05-28 | 1962-05-28 | Transistors |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1077851A true GB1077851A (en) | 1967-08-02 |
Family
ID=10144765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2036762A Expired GB1077851A (en) | 1962-05-28 | 1962-05-28 | Transistors |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1077851A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0087251A2 (en) * | 1982-02-22 | 1983-08-31 | Kabushiki Kaisha Toshiba | Process for manufacturing a buried gate field effect transistor |
GB2125621A (en) * | 1982-08-20 | 1984-03-07 | Telefunken Electronic Gmbh | Method for the manufacture of a field effect transistor |
US4903109A (en) * | 1970-07-10 | 1990-02-20 | U.S. Philips Corp. | Semiconductor devices having local oxide isolation |
-
1962
- 1962-05-28 GB GB2036762A patent/GB1077851A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4903109A (en) * | 1970-07-10 | 1990-02-20 | U.S. Philips Corp. | Semiconductor devices having local oxide isolation |
EP0087251A2 (en) * | 1982-02-22 | 1983-08-31 | Kabushiki Kaisha Toshiba | Process for manufacturing a buried gate field effect transistor |
EP0087251A3 (en) * | 1982-02-22 | 1986-04-16 | Kabushiki Kaisha Toshiba | Process for manufacturing a buried gate field effect transistor |
GB2125621A (en) * | 1982-08-20 | 1984-03-07 | Telefunken Electronic Gmbh | Method for the manufacture of a field effect transistor |
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