GB1328145A - Method of producing integrated cirucits - Google Patents

Method of producing integrated cirucits

Info

Publication number
GB1328145A
GB1328145A GB4919370A GB4919370A GB1328145A GB 1328145 A GB1328145 A GB 1328145A GB 4919370 A GB4919370 A GB 4919370A GB 4919370 A GB4919370 A GB 4919370A GB 1328145 A GB1328145 A GB 1328145A
Authority
GB
United Kingdom
Prior art keywords
regions
type
oct
emitter
current amplification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4919370A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB1328145A publication Critical patent/GB1328145A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/20Storage arrangements; Piling or unpiling
    • B21D43/24Devices for removing sheets from a stack
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G59/00De-stacking of articles
    • B65G59/06De-stacking from the bottom of the stack
    • B65G59/061De-stacking from the bottom of the stack articles being separated substantially along the axis of the stack
    • B65G59/066De-stacking from the bottom of the stack articles being separated substantially along the axis of the stack by means of rotary devices or endless elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/761PN junctions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Bipolar Integrated Circuits (AREA)

Abstract

1328145 Semi-conductor devices ROBERT BOSCH GmbH 16 Oct 1970 [18 Oct 1969] 49193/70 Heading H1K The p + type emitter and collector regions 4, 5 of a lateral transistor forming part of an integrated circuit are prevented from penetrating through to the p type substrate on which is formed the n type epitaxial layer 2 containing the circuit components by the presence of an n + buried layer 3. The emitter and collector regions 4, 5 may thus be formed at the same time as the isolating walls between components, and may have a greater depth than in conventional devices, thus providing a high current amplification factor. Current amplification may be further increased by reducing the base width by means of shallow p type diffused regions 6 contiguous with the regions 4, 5.
GB4919370A 1966-01-15 1970-10-16 Method of producing integrated cirucits Expired GB1328145A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DET0030267 1966-01-15
DE19691952614 DE1952614A1 (en) 1966-01-15 1969-10-18 Method of manufacturing a semiconductor device

Publications (1)

Publication Number Publication Date
GB1328145A true GB1328145A (en) 1973-08-30

Family

ID=25758023

Family Applications (2)

Application Number Title Priority Date Filing Date
GB19270/66A Expired GB1114217A (en) 1966-01-15 1966-05-02 Apparatus for removing metal sheets from a pile
GB4919370A Expired GB1328145A (en) 1966-01-15 1970-10-16 Method of producing integrated cirucits

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB19270/66A Expired GB1114217A (en) 1966-01-15 1966-05-02 Apparatus for removing metal sheets from a pile

Country Status (8)

Country Link
US (1) US3395912A (en)
JP (1) JPS495678B1 (en)
BE (1) BE692402A (en)
CH (1) CH446188A (en)
DE (1) DE1952614A1 (en)
FR (2) FR1514371A (en)
GB (2) GB1114217A (en)
NL (2) NL6700492A (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3527457A (en) * 1968-01-02 1970-09-08 Honeywell Inc Document picker
US3503606A (en) * 1968-01-30 1970-03-31 Joseph M Castellanet Signature feeder
US3942653A (en) * 1971-07-27 1976-03-09 Owens-Corning Fiberglas Corporation Method and apparatus for processing
JPS50148884A (en) * 1974-05-20 1975-11-28
JPS5240139A (en) * 1975-09-25 1977-03-28 Fuji Xerox Co Ltd Paper feed device
CH621282A5 (en) * 1977-04-06 1981-01-30 Inst Fiz An Latvssr Device for arranging and conveying ferromagnetic parts at predetermined distances from one another
JPS5559406U (en) * 1978-10-18 1980-04-22
JPS5568218U (en) * 1978-11-02 1980-05-10
JPS5589217U (en) * 1978-12-15 1980-06-20
FR2457564A1 (en) * 1979-05-23 1980-12-19 Thomson Csf Bipolar integrated circuit pnp transistor - has p-type substrate with p-implantation zones and n-type epitaxial layer
US4306355A (en) * 1979-09-21 1981-12-22 General Battery Corporation Method and apparatus for automatically installing covers on lead-acid battery cells
DE3804946A1 (en) * 1988-02-18 1989-08-31 Tetra Pak Rausing & Co Kg METHOD AND DEVICE FOR SEPARATING LEVEL PARTS
JPH042419U (en) * 1990-04-23 1992-01-10
EP0485343A1 (en) * 1990-11-06 1992-05-13 Willi Maschinenbau Ag Device for unstacking and fanning-out flexible sheet articles
DE4219445A1 (en) * 1992-06-13 1993-12-16 Tetra Pak Gmbh Device for separating stacked sheets of plastic, cardboard or the like
US9914599B2 (en) * 2015-12-04 2018-03-13 GM Global Technology Operations LLC Systems, processes and apparatuses for automated handling of non-ferrous metal objects
CN107186044B (en) * 2017-08-02 2019-03-15 石狮市森科智能科技有限公司 A kind of punching collection device based on hardware die casting
CN110816978A (en) * 2019-11-18 2020-02-21 云南省机械研究设计院 Box device and book machine in advance are rolled over in packing carton paging
CN112476946B (en) * 2020-09-23 2022-06-21 宁波韵升粘结磁体有限公司 Automatic injection molding method for magnetized magnetic steel
CN114226984B (en) * 2021-12-06 2022-11-18 湖北三维半导体集成创新中心有限责任公司 Wafer cutting method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1911884A (en) * 1931-11-05 1933-05-30 American Sheet & Tin Plate Sheet feeder
US2848227A (en) * 1955-09-12 1958-08-19 Harris Intertype Corp Separation of piled metal sheets

Also Published As

Publication number Publication date
DE1952614A1 (en) 1971-05-13
JPS495678B1 (en) 1974-02-08
NL7015232A (en) 1971-04-20
US3395912A (en) 1968-08-06
FR1514371A (en) 1968-02-23
NL6700492A (en) 1967-07-17
FR2031061A5 (en) 1970-11-13
CH446188A (en) 1967-10-31
BE692402A (en) 1967-07-10
GB1114217A (en) 1968-05-22

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees