NL6810761A - - Google Patents

Info

Publication number
NL6810761A
NL6810761A NL6810761A NL6810761A NL6810761A NL 6810761 A NL6810761 A NL 6810761A NL 6810761 A NL6810761 A NL 6810761A NL 6810761 A NL6810761 A NL 6810761A NL 6810761 A NL6810761 A NL 6810761A
Authority
NL
Netherlands
Prior art keywords
conductors
conductor
semi
integrated circuit
synthetic material
Prior art date
Application number
NL6810761A
Other languages
English (en)
Other versions
NL157456B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6810761.A priority Critical patent/NL157456B/xx
Priority to DE1937664A priority patent/DE1937664C3/de
Priority to GB37572/69A priority patent/GB1271576A/en
Priority to DK404469AA priority patent/DK123553B/da
Priority to CH1141569A priority patent/CH506883A/de
Priority to ES369959A priority patent/ES369959A1/es
Priority to SE10615/69*A priority patent/SE355260B/xx
Priority to AT726469A priority patent/AT312686B/de
Priority to FR6925687A priority patent/FR2014777A1/fr
Priority to BE736743A priority patent/BE736743A/fr
Priority to US845921A priority patent/US3646409A/en
Priority to DE2004768A priority patent/DE2004768C3/de
Publication of NL6810761A publication Critical patent/NL6810761A/xx
Publication of NL157456B publication Critical patent/NL157456B/xx

Links

Classifications

    • H10W40/778—
    • H10W40/70—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/5524—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
NL6810761.A 1968-07-30 1968-07-30 Halfgeleiderinrichting in een isolerende kunststofomhulling. NL157456B (nl)

Priority Applications (12)

Application Number Priority Date Filing Date Title
NL6810761.A NL157456B (nl) 1968-07-30 1968-07-30 Halfgeleiderinrichting in een isolerende kunststofomhulling.
DE1937664A DE1937664C3 (de) 1968-07-30 1969-07-24 Halbleiterbauelement
GB37572/69A GB1271576A (en) 1968-07-30 1969-07-25 Improvements in and relating to semiconductor devices
DK404469AA DK123553B (da) 1968-07-30 1969-07-25 Indskapslet halvlederorgan med køleelement.
CH1141569A CH506883A (de) 1968-07-30 1969-07-25 Halbleiterbauelement
ES369959A ES369959A1 (es) 1968-07-30 1969-07-28 Un dispositivo semiconductor.
SE10615/69*A SE355260B (cg-RX-API-DMAC10.html) 1968-07-30 1969-07-28
AT726469A AT312686B (de) 1968-07-30 1969-07-28 Halbleiterbauelement mit aus Metallstreifen gebildeten Leitern und einer isolierenden Kunststoffhülle
FR6925687A FR2014777A1 (cg-RX-API-DMAC10.html) 1968-07-30 1969-07-28
BE736743A BE736743A (fr) 1968-07-30 1969-07-29 Dispositif semiconducteur
US845921A US3646409A (en) 1968-07-30 1969-07-29 Heat-sinking package for semiconductor integrated circuit
DE2004768A DE2004768C3 (de) 1968-07-30 1970-01-29 Halbleiterbauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6810761.A NL157456B (nl) 1968-07-30 1968-07-30 Halfgeleiderinrichting in een isolerende kunststofomhulling.

Publications (2)

Publication Number Publication Date
NL6810761A true NL6810761A (cg-RX-API-DMAC10.html) 1970-02-03
NL157456B NL157456B (nl) 1978-07-17

Family

ID=19804247

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6810761.A NL157456B (nl) 1968-07-30 1968-07-30 Halfgeleiderinrichting in een isolerende kunststofomhulling.

Country Status (11)

Country Link
US (1) US3646409A (cg-RX-API-DMAC10.html)
AT (1) AT312686B (cg-RX-API-DMAC10.html)
BE (1) BE736743A (cg-RX-API-DMAC10.html)
CH (1) CH506883A (cg-RX-API-DMAC10.html)
DE (1) DE1937664C3 (cg-RX-API-DMAC10.html)
DK (1) DK123553B (cg-RX-API-DMAC10.html)
ES (1) ES369959A1 (cg-RX-API-DMAC10.html)
FR (1) FR2014777A1 (cg-RX-API-DMAC10.html)
GB (1) GB1271576A (cg-RX-API-DMAC10.html)
NL (1) NL157456B (cg-RX-API-DMAC10.html)
SE (1) SE355260B (cg-RX-API-DMAC10.html)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2116353B1 (cg-RX-API-DMAC10.html) * 1970-10-19 1976-04-16 Ates Componenti Elettron
DE2107786C3 (de) * 1971-02-18 1983-01-27 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Halbleiterbauelement
US3767839A (en) * 1971-06-04 1973-10-23 Wells Plastics Of California I Plastic micro-electronic packages
US3721747A (en) * 1972-03-15 1973-03-20 Coilcraft Inc Dual in-line package
IT960675B (it) * 1972-06-03 1973-11-30 Ates Componenti Elettron Assemblaggio per produzione di circuiti integrati con conteni tore di resina
US3836825A (en) * 1972-10-06 1974-09-17 Rca Corp Heat dissipation for power integrated circuit devices
US3801728A (en) * 1972-10-20 1974-04-02 Bell Telephone Labor Inc Microelectronic packages
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
DE2712543C2 (de) * 1976-03-24 1982-11-11 Hitachi, Ltd., Tokyo Anordnung eines Halbleiterbauelements auf einer Montageplatte
IN148328B (cg-RX-API-DMAC10.html) * 1977-04-18 1981-01-17 Rca Corp
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
JPS592364B2 (ja) * 1979-04-27 1984-01-18 富士通株式会社 集合抵抗モジユ−ル
US4642419A (en) * 1981-04-06 1987-02-10 International Rectifier Corporation Four-leaded dual in-line package module for semiconductor devices
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
US4496965A (en) * 1981-05-18 1985-01-29 Texas Instruments Incorporated Stacked interdigitated lead frame assembly
DE3684184D1 (de) * 1985-06-20 1992-04-16 Toshiba Kawasaki Kk Verkapselte halbleiteranordnung.
US5049976A (en) * 1989-01-10 1991-09-17 National Semiconductor Corporation Stress reduction package and process
US5596231A (en) * 1991-08-05 1997-01-21 Asat, Limited High power dissipation plastic encapsulated package for integrated circuit die
US6613978B2 (en) * 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5872395A (en) * 1996-09-16 1999-02-16 International Packaging And Assembly Corporation Bent tip method for preventing vertical motion of heat spreaders during injection molding of IC packages
DE19638438A1 (de) * 1996-09-19 1998-04-02 Siemens Ag Durch Feldeffekt steuerbares, vertikales Halbleiterbauelement
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
TWI268732B (en) * 2004-12-16 2006-12-11 Au Optronics Corp Organic light emitting device
DE102019115500A1 (de) * 2019-06-07 2020-12-10 OSRAM CONTINENTAL GmbH Anordnung und Verfahren zur Herstellung einer Anordnung

Also Published As

Publication number Publication date
DE1937664C3 (de) 1978-11-30
BE736743A (fr) 1970-01-29
US3646409A (en) 1972-02-29
FR2014777A1 (cg-RX-API-DMAC10.html) 1970-04-17
DE1937664A1 (de) 1970-02-05
CH506883A (de) 1971-04-30
DK123553B (da) 1972-07-03
DE1937664B2 (de) 1973-11-22
AT312686B (de) 1974-01-10
SE355260B (cg-RX-API-DMAC10.html) 1973-04-09
ES369959A1 (es) 1971-07-16
NL157456B (nl) 1978-07-17
GB1271576A (en) 1972-04-19

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Legal Events

Date Code Title Description
VJC Lapsed due to non-payment of the due maintenance fee for the patent or patent application
NL80 Information provided on patent owner name for an already discontinued patent

Owner name: PHILIPS