NL6602553A - - Google Patents
Info
- Publication number
- NL6602553A NL6602553A NL6602553A NL6602553A NL6602553A NL 6602553 A NL6602553 A NL 6602553A NL 6602553 A NL6602553 A NL 6602553A NL 6602553 A NL6602553 A NL 6602553A NL 6602553 A NL6602553 A NL 6602553A
- Authority
- NL
- Netherlands
- Prior art keywords
- silicon
- cathode
- substrate
- conductivity type
- produced
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
Abstract
A semi-conductor device containing an abrupt PN junction is produced by sputtering silicon of one conductivity type on to silicon of the opposite conductivity type. The process takes place in an inert atmosphere and is stated to result in an epitaxial deposit. Fig. 1 (not shown) depicts the sputtering chamber (10) in which a silicon substrate (20) is placed between an anode (16) and a cathode (13), the latter consisting of the silicon to be deposited. In the chamber atmosphere - which consists of an inert gas such as Argon containing not more than 0.002% oxygen - a glow discharge is set up and the positive gas ions thus produced bombard the silicon cathode to release silicon particles which are sputtered on to the substrate. A nickel mask may be placed between the cathode and the substrate during the deposition. A similar mask may be used in the subsequent provision of evaporated-on aluminium electrodes.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US44985565A | 1965-04-21 | 1965-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL6602553A true NL6602553A (en) | 1966-10-24 |
Family
ID=23785755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6602553A NL6602553A (en) | 1965-04-21 | 1966-02-28 |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1544322A1 (en) |
GB (1) | GB1077320A (en) |
NL (1) | NL6602553A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2142045B (en) * | 1983-06-15 | 1987-12-31 | British Telecomm | Growth of semiconductors |
GB8421162D0 (en) * | 1984-08-21 | 1984-09-26 | British Telecomm | Growth of semi-conductors |
-
1965
- 1965-12-03 GB GB5135265A patent/GB1077320A/en not_active Expired
-
1966
- 1966-02-28 NL NL6602553A patent/NL6602553A/xx unknown
- 1966-04-19 DE DE19661544322 patent/DE1544322A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
GB1077320A (en) | 1967-07-26 |
DE1544322A1 (en) | 1970-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1101106A (en) | Amorphous alloys | |
GB1536412A (en) | Photocathodes | |
GB1294025A (en) | Rf sputtering | |
ES333127A1 (en) | A procedure for depositing by cathodized spraying on a substrate a thin metal layer. (Machine-translation by Google Translate, not legally binding) | |
GB485528A (en) | Improvements in and relating to light sensitive devices and methods of manufacturing the same | |
GB1242492A (en) | Improvements relating to the coating of a substrate by r.f. sputtering | |
GB809330A (en) | Improvements in p-n junction semiconductor units | |
ES390345A1 (en) | Process for the deposition of metals or oxides on a metallic support by cathodic sputtering and applications thereof | |
GB1389338A (en) | Surge protective devices and methods of making same | |
GB1118758A (en) | Improvements in or relating to the sputtering of conductive materials | |
GB1244618A (en) | A method of forming a metal contact on an element and a vacuum deposition system that may be used in performing this method | |
NL6602553A (en) | ||
GB1358438A (en) | Process for the manufacture of a semiconductor component or an integrated semiconductor circuit | |
GB1301653A (en) | ||
ES389693A1 (en) | Film deposition | |
US3463715A (en) | Method of cathodically sputtering a layer of silicon having a reduced resistivity | |
GB1181559A (en) | Improvements in or relating to the Deposition of Insulating Films of Silicon Nitride. | |
US3198422A (en) | Vacuum sputtering pump | |
GB923143A (en) | Hot electron, cold lattice, semi-conductor cathode | |
GB1207091A (en) | Method of manufacturing and electronic discharge tube including a photocathode | |
GB1321005A (en) | Method for increasing the electron emissivity of a semiconductor electron emitter | |
GB1115055A (en) | Film deposition in an evacuated chamber | |
GB1145348A (en) | Improvements in and relating to sputtering | |
US3589994A (en) | Sputtering technique | |
JPS5585671A (en) | Sputtering apparatus |