NL204333A - - Google Patents
Info
- Publication number
- NL204333A NL204333A NL204333DA NL204333A NL 204333 A NL204333 A NL 204333A NL 204333D A NL204333D A NL 204333DA NL 204333 A NL204333 A NL 204333A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0101—Neon [Ne]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01056—Barium [Ba]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01066—Dysprosium [Dy]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01073—Tantalum [Ta]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01084—Polonium [Po]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0133—Ternary Alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US404086A US2933662A (en) | 1954-01-14 | 1954-01-14 | Semiconductor rectifier device |
DES42833A DE1000534B (de) | 1954-01-14 | 1955-02-26 | Flaechengleichrichter bzw. -transistor |
DES43586A DE1017291B (de) | 1954-01-14 | 1955-04-20 | Flaechengleichrichter bzw. Transistor |
US529304A US2780759A (en) | 1954-01-14 | 1955-08-18 | Semiconductor rectifier device |
Publications (1)
Publication Number | Publication Date |
---|---|
NL204333A true NL204333A (ja) | 1900-01-01 |
Family
ID=27437477
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL204333D NL204333A (ja) | 1954-01-14 | ||
NL193055D NL193055A (ja) | 1954-01-14 | ||
NL96864D NL96864C (ja) | 1954-01-14 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL193055D NL193055A (ja) | 1954-01-14 | ||
NL96864D NL96864C (ja) | 1954-01-14 |
Country Status (7)
Country | Link |
---|---|
US (2) | US2933662A (ja) |
BE (1) | BE534817A (ja) |
CH (1) | CH342660A (ja) |
DE (2) | DE1000534B (ja) |
FR (1) | FR1119805A (ja) |
GB (2) | GB777985A (ja) |
NL (3) | NL96864C (ja) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL86185C (ja) * | 1951-06-08 | 1900-01-01 | ||
GB806596A (en) * | 1955-04-01 | 1958-12-31 | Gen Electric Co Ltd | Improvements in or relating to semi-conductor devices |
NL207356A (ja) * | 1955-05-23 | |||
US2889498A (en) * | 1955-11-08 | 1959-06-02 | Westinghouse Electric Corp | Semiconductor rectifier assembly |
DE1206528B (de) * | 1956-07-11 | 1965-12-09 | Bosch Gmbh Robert | Verfahren zur Herstellung einer Halbleiter-anordnung aus n-Germanium |
US2994017A (en) * | 1956-09-07 | 1961-07-25 | Int Rectifier Corp | Air-cooled rectifier assembly |
DE1087706B (de) * | 1956-09-24 | 1960-08-25 | Siemens Ag | Flaechengleichrichteranordnung und Verfahren zu ihrer Herstellung |
DE1192322C2 (de) * | 1956-09-24 | 1966-01-13 | Siemens Ag | Verfahren zur Herstellung einer Halbleiteranordnung |
GB859849A (en) * | 1957-04-03 | 1961-01-25 | Gen Electric Co Ltd | Improvements in or relating to semiconductor devices |
DE1088619B (de) * | 1957-04-18 | 1960-09-08 | Siemens Ag | Flaechengleichrichter- bzw. Flaechentransistoranordnung und Verfahren und Einrichtung zu ihrer Herstellung |
DE1087707B (de) * | 1957-04-18 | 1960-08-25 | Siemens Ag | Verfahren zur Herstellung einer Flaechengleichrichter- bzw. Flaechentransistoranordnung und Vorrichtung zur Durchfuehrung dieses Verfahrens |
DE1062823B (de) * | 1957-07-13 | 1959-08-06 | Telefunken Gmbh | Verfahren zur Herstellung von Kristalloden des Legierungstyps |
US3007088A (en) * | 1957-09-26 | 1961-10-31 | Int Rectifier Corp | Rectifier and means for mounting the same |
NL231561A (ja) * | 1957-12-20 | |||
US3064178A (en) * | 1958-05-19 | 1962-11-13 | Union Carbide Corp | Inert-gas arc rectifier |
DE1098618B (de) * | 1958-07-25 | 1961-02-02 | Telefunken Gmbh | Gehaeuse fuer Halbleiteranordnungen kleinster Abmessungen |
US2983853A (en) * | 1958-10-01 | 1961-05-09 | Raytheon Co | Semiconductor assembly structures |
US2994121A (en) * | 1958-11-21 | 1961-08-01 | Shockley William | Method of making a semiconductive switching array |
US3025436A (en) * | 1959-08-19 | 1962-03-13 | Itt | High current rectifier |
DE1109794B (de) * | 1959-08-22 | 1961-06-29 | Elektronik M B H | Verfahren zum Einbau eines Flaechengleichrichterelements in ein luftdicht verschlossenes Gehaeuse |
DE1211293B (de) * | 1960-05-11 | 1966-02-24 | Ass Elect Ind | Halbleiteranordnung mit einem in einen Hohlleiter eingesetzten Halbleiterelement |
DE1185728B (de) * | 1960-05-18 | 1965-01-21 | Siemens Ag | Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement |
US3068382A (en) * | 1960-05-23 | 1962-12-11 | Westinghouse Electric Corp | Hermetically sealed semiconductor devices |
US3010057A (en) * | 1960-09-06 | 1961-11-21 | Westinghouse Electric Corp | Semiconductor device |
DE1191044B (de) * | 1960-12-03 | 1965-04-15 | Siemens Ag | Verfahren zur Herstellung von Halbleiteranordnungen, wie Silizium-Flaechengleichrichter, -Transistoren oder Halbleiterstromtore |
US3217379A (en) * | 1960-12-09 | 1965-11-16 | Texas Instruments Inc | Method for forming pn junctions in indium antimonide with special application to infrared detection |
US3144501A (en) * | 1961-01-19 | 1964-08-11 | Int Rectifier Corp | Seal for semiconductor rectifier |
NL275010A (ja) * | 1961-03-28 | 1900-01-01 | ||
NL135880C (ja) * | 1961-07-12 | 1900-01-01 | ||
DE1277445B (de) * | 1961-08-26 | 1968-09-12 | Siemens Ag | Isolierter, gasdichter, koaxial zu einem Anschlussbolzen liegender Steuerelektroden-anschluss fuer Halbleiterbauelemente |
DE1213924B (de) * | 1961-08-30 | 1966-04-07 | Siemens Ag | Halbleiterbauelement mit einem in einem Gehaeuse gasdicht eingeschlossenen Halbleiterelement |
US3218524A (en) * | 1961-10-12 | 1965-11-16 | Westinghouse Electric Corp | Semiconductor devices |
BE624012A (ja) * | 1961-10-27 | |||
CH397058A (de) * | 1962-01-10 | 1965-08-15 | Bbc Brown Boveri & Cie | Anordnung für das Anschliessen der Steuerelektrode bei einem steuerbaren Halbleiter-Gleichrichter |
DE1248808B (ja) * | 1962-03-23 | 1900-01-01 | ||
GB1004020A (en) * | 1964-04-24 | 1965-09-08 | Standard Telephones Cables Ltd | Improvements in or relating to the mounting of electrical components |
US3413532A (en) * | 1965-02-08 | 1968-11-26 | Westinghouse Electric Corp | Compression bonded semiconductor device |
NL136731C (ja) * | 1965-06-23 | |||
US3581163A (en) * | 1968-04-09 | 1971-05-25 | Gen Electric | High-current semiconductor rectifier assemblies |
SE350874B (ja) * | 1970-03-05 | 1972-11-06 | Asea Ab | |
DE2603813C2 (de) * | 1976-02-02 | 1982-11-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Spannvorrichtung für ein thermisch und elektrisch druckkontaktiertes Halbleiterbauelement in Scheibenzellenbauweise |
DE2638909A1 (de) * | 1976-08-28 | 1978-03-02 | Semikron Gleichrichterbau | Halbleiteranordnung |
US4161747A (en) * | 1978-02-24 | 1979-07-17 | Nasa | Shock isolator for operating a diode laser on a closed-cycle refrigerator |
US4333101A (en) * | 1979-07-19 | 1982-06-01 | Flight Systems, Inc. | Semiconductor heat sink mounting assembly |
EP0042693B1 (en) * | 1980-06-21 | 1985-03-27 | LUCAS INDUSTRIES public limited company | Semi-conductor power device assembly and method of manufacture thereof |
US4538171A (en) * | 1980-10-30 | 1985-08-27 | Cableform Limited | High power semiconductor heat sink assembly |
JP6464362B2 (ja) * | 2017-02-14 | 2019-02-06 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置及びスクリーン印刷方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2468051A (en) * | 1949-04-26 | escoffery | ||
DE303833C (ja) * | ||||
US1751360A (en) * | 1924-09-22 | 1930-03-18 | Ruben Rectifier Corp | Electric-current rectifier |
US1799854A (en) * | 1926-10-20 | 1931-04-07 | Levy Lucien | Current rectifier |
US1728537A (en) * | 1927-08-25 | 1929-09-17 | Union Switch & Signal Co | Electrical rectifier |
US1905703A (en) * | 1929-12-12 | 1933-04-25 | Gen Electric | Contact rectifier |
US2383735A (en) * | 1943-04-02 | 1945-08-28 | William A Ray | Rectifier |
US2441603A (en) * | 1943-07-28 | 1948-05-18 | Bell Telephone Labor Inc | Electrical translating materials and method of making them |
BE490848A (ja) * | 1948-12-29 | |||
US2662997A (en) * | 1951-11-23 | 1953-12-15 | Bell Telephone Labor Inc | Mounting for semiconductors |
BE525428A (ja) * | 1952-12-30 | |||
BE527420A (ja) * | 1953-03-20 | |||
US2790089A (en) * | 1953-03-23 | 1957-04-23 | Nat Aircraft Corp | Three-element semi-conductor device |
US2734154A (en) * | 1953-07-27 | 1956-02-07 | Semiconductor devices | |
US2781480A (en) * | 1953-07-31 | 1957-02-12 | Rca Corp | Semiconductor rectifiers |
US2720617A (en) * | 1953-11-02 | 1955-10-11 | Raytheon Mfg Co | Transistor packages |
US2861230A (en) * | 1953-11-24 | 1958-11-18 | Gen Electric | Calorized point contact electrode for semiconductor devices |
US2725505A (en) * | 1953-11-30 | 1955-11-29 | Rca Corp | Semiconductor power devices |
US2796563A (en) * | 1955-06-10 | 1957-06-18 | Bell Telephone Labor Inc | Semiconductive devices |
-
0
- NL NL204333D patent/NL204333A/xx unknown
- NL NL193055D patent/NL193055A/xx unknown
- NL NL96864D patent/NL96864C/xx active
- BE BE534817D patent/BE534817A/xx unknown
-
1954
- 1954-01-14 US US404086A patent/US2933662A/en not_active Expired - Lifetime
-
1955
- 1955-01-07 GB GB539/55A patent/GB777985A/en not_active Expired
- 1955-01-13 FR FR1119805D patent/FR1119805A/fr not_active Expired
- 1955-02-26 DE DES42833A patent/DE1000534B/de active Pending
- 1955-04-20 DE DES43586A patent/DE1017291B/de active Pending
- 1955-08-18 US US529304A patent/US2780759A/en not_active Expired - Lifetime
-
1956
- 1956-02-17 CH CH342660D patent/CH342660A/de unknown
- 1956-02-27 GB GB6089/56A patent/GB803295A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL193055A (ja) | 1900-01-01 |
BE534817A (ja) | 1900-01-01 |
US2933662A (en) | 1960-04-19 |
CH342660A (de) | 1959-11-30 |
NL96864C (ja) | 1900-01-01 |
DE1000534B (de) | 1957-01-10 |
FR1119805A (fr) | 1956-06-26 |
GB777985A (en) | 1957-07-03 |
US2780759A (en) | 1957-02-05 |
GB803295A (en) | 1958-10-22 |
DE1017291B (de) | 1957-10-10 |