NL2031383B1 - Pressure Sintering Apparatus, and corresponding Pressure Sintering Method - Google Patents

Pressure Sintering Apparatus, and corresponding Pressure Sintering Method Download PDF

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Publication number
NL2031383B1
NL2031383B1 NL2031383A NL2031383A NL2031383B1 NL 2031383 B1 NL2031383 B1 NL 2031383B1 NL 2031383 A NL2031383 A NL 2031383A NL 2031383 A NL2031383 A NL 2031383A NL 2031383 B1 NL2031383 B1 NL 2031383B1
Authority
NL
Netherlands
Prior art keywords
component
sintering
tool part
substrate
pressure
Prior art date
Application number
NL2031383A
Other languages
English (en)
Dutch (nl)
Inventor
Gerardus Johannes Boschman Franciscus
Original Assignee
Boschman Tech Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL2031383A priority Critical patent/NL2031383B1/en
Application filed by Boschman Tech Bv filed Critical Boschman Tech Bv
Priority to CN202380029660.XA priority patent/CN118922934A/zh
Priority to TW112110940A priority patent/TW202406424A/zh
Priority to KR1020247032316A priority patent/KR20240163652A/ko
Priority to PCT/NL2023/050149 priority patent/WO2023182885A1/en
Priority to JP2024554909A priority patent/JP2025510631A/ja
Priority to EP23714370.6A priority patent/EP4497157A1/en
Priority to CA3245722A priority patent/CA3245722A1/en
Priority to US18/848,071 priority patent/US20250239565A1/en
Application granted granted Critical
Publication of NL2031383B1 publication Critical patent/NL2031383B1/en
Priority to MX2024011555A priority patent/MX2024011555A/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01365—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07125—Means for controlling the bonding environment, e.g. valves or vacuum pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
NL2031383A 2022-03-23 2022-03-23 Pressure Sintering Apparatus, and corresponding Pressure Sintering Method NL2031383B1 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL2031383A NL2031383B1 (en) 2022-03-23 2022-03-23 Pressure Sintering Apparatus, and corresponding Pressure Sintering Method
TW112110940A TW202406424A (zh) 2022-03-23 2023-03-23 加壓燒結設備及對應加壓燒結方法
KR1020247032316A KR20240163652A (ko) 2022-03-23 2023-03-23 압력 소결 방법 및 대응하는 압력 소결 장치
PCT/NL2023/050149 WO2023182885A1 (en) 2022-03-23 2023-03-23 Pressure sintering method and corresponding pressure sintering apparatus
CN202380029660.XA CN118922934A (zh) 2022-03-23 2023-03-23 加压烧结方法及对应加压烧结设备
JP2024554909A JP2025510631A (ja) 2022-03-23 2023-03-23 加圧焼結方法および対応する加圧焼結装置
EP23714370.6A EP4497157A1 (en) 2022-03-23 2023-03-23 Pressure sintering method and corresponding pressure sintering apparatus
CA3245722A CA3245722A1 (en) 2022-03-23 2023-03-23 PRESSURE SINTERING PROCESS AND CORRESPONDING PRESSURE SINTERING APPARATUS
US18/848,071 US20250239565A1 (en) 2022-03-23 2023-03-23 Pressure sintering method and corresponding pressure sintering apparatus
MX2024011555A MX2024011555A (es) 2022-03-23 2024-09-20 Metodo de sinterizacion a presion y aparato de sinterizacion a presion correspondiente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2031383A NL2031383B1 (en) 2022-03-23 2022-03-23 Pressure Sintering Apparatus, and corresponding Pressure Sintering Method

Publications (1)

Publication Number Publication Date
NL2031383B1 true NL2031383B1 (en) 2023-10-06

Family

ID=82482611

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2031383A NL2031383B1 (en) 2022-03-23 2022-03-23 Pressure Sintering Apparatus, and corresponding Pressure Sintering Method

Country Status (10)

Country Link
US (1) US20250239565A1 (enExample)
EP (1) EP4497157A1 (enExample)
JP (1) JP2025510631A (enExample)
KR (1) KR20240163652A (enExample)
CN (1) CN118922934A (enExample)
CA (1) CA3245722A1 (enExample)
MX (1) MX2024011555A (enExample)
NL (1) NL2031383B1 (enExample)
TW (1) TW202406424A (enExample)
WO (1) WO2023182885A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT527921B1 (de) * 2024-04-25 2025-08-15 Smt Maschinen Und Vertriebs Gmbh & Co Kg Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090023250A1 (en) * 2007-07-20 2009-01-22 Infineon Technologies Ag Apparatus and method for producing semiconductor modules
JP4770379B2 (ja) * 2005-10-13 2011-09-14 富士電機株式会社 金属部材の接合方法およびその組立治具
US20150257280A1 (en) * 2014-03-06 2015-09-10 Infineon Technologies Ag Method for producing a dried paste layer, method for producing a sintering connection, method for producing a power semiconductor module and continuous installation
US20210104488A1 (en) * 2014-09-29 2021-04-08 Danfoss Silicon Power Gmbh Process and device for low-temperature pressure sintering

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4770379B2 (ja) * 2005-10-13 2011-09-14 富士電機株式会社 金属部材の接合方法およびその組立治具
US20090023250A1 (en) * 2007-07-20 2009-01-22 Infineon Technologies Ag Apparatus and method for producing semiconductor modules
US20150257280A1 (en) * 2014-03-06 2015-09-10 Infineon Technologies Ag Method for producing a dried paste layer, method for producing a sintering connection, method for producing a power semiconductor module and continuous installation
US20210104488A1 (en) * 2014-09-29 2021-04-08 Danfoss Silicon Power Gmbh Process and device for low-temperature pressure sintering

Also Published As

Publication number Publication date
CA3245722A1 (en) 2023-09-28
KR20240163652A (ko) 2024-11-19
MX2024011555A (es) 2024-12-06
JP2025510631A (ja) 2025-04-15
WO2023182885A1 (en) 2023-09-28
TW202406424A (zh) 2024-02-01
CN118922934A (zh) 2024-11-08
US20250239565A1 (en) 2025-07-24
EP4497157A1 (en) 2025-01-29

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