TW202406424A - 加壓燒結設備及對應加壓燒結方法 - Google Patents

加壓燒結設備及對應加壓燒結方法 Download PDF

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Publication number
TW202406424A
TW202406424A TW112110940A TW112110940A TW202406424A TW 202406424 A TW202406424 A TW 202406424A TW 112110940 A TW112110940 A TW 112110940A TW 112110940 A TW112110940 A TW 112110940A TW 202406424 A TW202406424 A TW 202406424A
Authority
TW
Taiwan
Prior art keywords
tool part
component
substrate
sintering
tool
Prior art date
Application number
TW112110940A
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English (en)
Chinese (zh)
Inventor
法蘭西思可思蓋爾古斯喬漢尼斯 波許曼
Original Assignee
荷蘭商波許曼科技有限公司
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Publication date
Application filed by 荷蘭商波許曼科技有限公司 filed Critical 荷蘭商波許曼科技有限公司
Publication of TW202406424A publication Critical patent/TW202406424A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01365—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07125—Means for controlling the bonding environment, e.g. valves or vacuum pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Die Bonding (AREA)
TW112110940A 2022-03-23 2023-03-23 加壓燒結設備及對應加壓燒結方法 TW202406424A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2031383A NL2031383B1 (en) 2022-03-23 2022-03-23 Pressure Sintering Apparatus, and corresponding Pressure Sintering Method
NL2031383 2022-03-23

Publications (1)

Publication Number Publication Date
TW202406424A true TW202406424A (zh) 2024-02-01

Family

ID=82482611

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112110940A TW202406424A (zh) 2022-03-23 2023-03-23 加壓燒結設備及對應加壓燒結方法

Country Status (10)

Country Link
US (1) US20250239565A1 (enExample)
EP (1) EP4497157A1 (enExample)
JP (1) JP2025510631A (enExample)
KR (1) KR20240163652A (enExample)
CN (1) CN118922934A (enExample)
CA (1) CA3245722A1 (enExample)
MX (1) MX2024011555A (enExample)
NL (1) NL2031383B1 (enExample)
TW (1) TW202406424A (enExample)
WO (1) WO2023182885A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT527921B1 (de) * 2024-04-25 2025-08-15 Smt Maschinen Und Vertriebs Gmbh & Co Kg Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4770379B2 (ja) * 2005-10-13 2011-09-14 富士電機株式会社 金属部材の接合方法およびその組立治具
US7851334B2 (en) * 2007-07-20 2010-12-14 Infineon Technologies Ag Apparatus and method for producing semiconductor modules
DE102014103013B4 (de) * 2014-03-06 2017-09-21 Infineon Technologies Ag Verfahren zum Erzeugen einer getrockneten Pastenschicht, Verfahren zum Erzeugen einer Sinterverbindung und Durchlaufanlage zur Durchführung der Verfahren
DE102014114093B4 (de) * 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Verfahren zum Niedertemperatur-Drucksintern

Also Published As

Publication number Publication date
NL2031383B1 (en) 2023-10-06
KR20240163652A (ko) 2024-11-19
CA3245722A1 (en) 2023-09-28
CN118922934A (zh) 2024-11-08
WO2023182885A1 (en) 2023-09-28
JP2025510631A (ja) 2025-04-15
MX2024011555A (es) 2024-12-06
US20250239565A1 (en) 2025-07-24
EP4497157A1 (en) 2025-01-29

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