CN118922934A - 加压烧结方法及对应加压烧结设备 - Google Patents

加压烧结方法及对应加压烧结设备 Download PDF

Info

Publication number
CN118922934A
CN118922934A CN202380029660.XA CN202380029660A CN118922934A CN 118922934 A CN118922934 A CN 118922934A CN 202380029660 A CN202380029660 A CN 202380029660A CN 118922934 A CN118922934 A CN 118922934A
Authority
CN
China
Prior art keywords
sintering
substrate
component
tool
tool part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380029660.XA
Other languages
English (en)
Chinese (zh)
Inventor
弗朗西斯库·格拉尔杜斯·约翰内斯·博什曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boschman Technologies BV
Original Assignee
Boschman Technologies BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boschman Technologies BV filed Critical Boschman Technologies BV
Publication of CN118922934A publication Critical patent/CN118922934A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01365—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07125—Means for controlling the bonding environment, e.g. valves or vacuum pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202380029660.XA 2022-03-23 2023-03-23 加压烧结方法及对应加压烧结设备 Pending CN118922934A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL2031383 2022-03-23
NL2031383A NL2031383B1 (en) 2022-03-23 2022-03-23 Pressure Sintering Apparatus, and corresponding Pressure Sintering Method
PCT/NL2023/050149 WO2023182885A1 (en) 2022-03-23 2023-03-23 Pressure sintering method and corresponding pressure sintering apparatus

Publications (1)

Publication Number Publication Date
CN118922934A true CN118922934A (zh) 2024-11-08

Family

ID=82482611

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380029660.XA Pending CN118922934A (zh) 2022-03-23 2023-03-23 加压烧结方法及对应加压烧结设备

Country Status (10)

Country Link
US (1) US20250239565A1 (enExample)
EP (1) EP4497157A1 (enExample)
JP (1) JP2025510631A (enExample)
KR (1) KR20240163652A (enExample)
CN (1) CN118922934A (enExample)
CA (1) CA3245722A1 (enExample)
MX (1) MX2024011555A (enExample)
NL (1) NL2031383B1 (enExample)
TW (1) TW202406424A (enExample)
WO (1) WO2023182885A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT527921B1 (de) * 2024-04-25 2025-08-15 Smt Maschinen Und Vertriebs Gmbh & Co Kg Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4770379B2 (ja) * 2005-10-13 2011-09-14 富士電機株式会社 金属部材の接合方法およびその組立治具
US7851334B2 (en) * 2007-07-20 2010-12-14 Infineon Technologies Ag Apparatus and method for producing semiconductor modules
DE102014103013B4 (de) * 2014-03-06 2017-09-21 Infineon Technologies Ag Verfahren zum Erzeugen einer getrockneten Pastenschicht, Verfahren zum Erzeugen einer Sinterverbindung und Durchlaufanlage zur Durchführung der Verfahren
DE102014114093B4 (de) * 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Verfahren zum Niedertemperatur-Drucksintern

Also Published As

Publication number Publication date
CA3245722A1 (en) 2023-09-28
KR20240163652A (ko) 2024-11-19
MX2024011555A (es) 2024-12-06
NL2031383B1 (en) 2023-10-06
JP2025510631A (ja) 2025-04-15
WO2023182885A1 (en) 2023-09-28
TW202406424A (zh) 2024-02-01
US20250239565A1 (en) 2025-07-24
EP4497157A1 (en) 2025-01-29

Similar Documents

Publication Publication Date Title
US8728831B2 (en) Reconstituted wafer warpage adjustment
JP6533579B2 (ja) 電気構成部品のはんだ付け接続を行うための熱伝達装置
US20070131353A1 (en) Apparatus and clocked method for pressure-sintered bonding
CN110678288B (zh) 用于产生焊接连接部的方法
US9426898B2 (en) Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly
EP3180801A1 (de) Vorrichtung zum insbesondere thermischen verbinden mikro-elektromechanischer bauteile
US6845901B2 (en) Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
JP7793250B2 (ja) 焼結装置および方法
CN118922934A (zh) 加压烧结方法及对应加压烧结设备
KR101785092B1 (ko) 레이저를 이용한 반도체 본딩장치
JPH1051152A (ja) 可撓性ラミナをアライメント・ピン上に積み重ねる方法及び装置
US6565706B2 (en) Support-frame bonding apparatus
JP2025510631A5 (enExample)
JP2013012542A (ja) 圧着装置および温度制御方法
US20190304949A1 (en) Semiconductor packaging methodology with reconstitution concept using thermal and uv releasable adhesive on a carrier
TW498524B (en) Method and apparatus for mounting semiconductor chips onto a flexible substrate
TWI900142B (zh) 壓縮成形裝置及壓縮成形方法
JP7850453B2 (ja) 実装装置及び実装方法
EP4659930A1 (en) Compression-molding device and compression-molding method
EP4661063A1 (en) Sealing resin used for compression molding, and forming method for same
WO2018097995A1 (en) Apparatus and method for connecting two substrates for an electric component
JP2024139406A (ja) 圧縮成形装置及び圧縮成形方法
HK40019727A (en) Method for producing a solder connection
HK40019727B (en) Method for producing a solder connection

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination