CA3245722A1 - PRESSURE SINTERING PROCESS AND CORRESPONDING PRESSURE SINTERING APPARATUS - Google Patents

PRESSURE SINTERING PROCESS AND CORRESPONDING PRESSURE SINTERING APPARATUS

Info

Publication number
CA3245722A1
CA3245722A1 CA3245722A CA3245722A CA3245722A1 CA 3245722 A1 CA3245722 A1 CA 3245722A1 CA 3245722 A CA3245722 A CA 3245722A CA 3245722 A CA3245722 A CA 3245722A CA 3245722 A1 CA3245722 A1 CA 3245722A1
Authority
CA
Canada
Prior art keywords
sintering
tool part
component
substrate
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CA3245722A
Other languages
English (en)
French (fr)
Inventor
Franciscus Gerardus Johannes Boschman
Original Assignee
Boschman Technologies BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boschman Technologies BV filed Critical Boschman Technologies BV
Publication of CA3245722A1 publication Critical patent/CA3245722A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01365—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07125—Means for controlling the bonding environment, e.g. valves or vacuum pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Die Bonding (AREA)
CA3245722A 2022-03-23 2023-03-23 PRESSURE SINTERING PROCESS AND CORRESPONDING PRESSURE SINTERING APPARATUS Pending CA3245722A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL2031383A NL2031383B1 (en) 2022-03-23 2022-03-23 Pressure Sintering Apparatus, and corresponding Pressure Sintering Method
NL2031383 2022-03-23
PCT/NL2023/050149 WO2023182885A1 (en) 2022-03-23 2023-03-23 Pressure sintering method and corresponding pressure sintering apparatus

Publications (1)

Publication Number Publication Date
CA3245722A1 true CA3245722A1 (en) 2023-09-28

Family

ID=82482611

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3245722A Pending CA3245722A1 (en) 2022-03-23 2023-03-23 PRESSURE SINTERING PROCESS AND CORRESPONDING PRESSURE SINTERING APPARATUS

Country Status (10)

Country Link
US (1) US20250239565A1 (enExample)
EP (1) EP4497157A1 (enExample)
JP (1) JP2025510631A (enExample)
KR (1) KR20240163652A (enExample)
CN (1) CN118922934A (enExample)
CA (1) CA3245722A1 (enExample)
MX (1) MX2024011555A (enExample)
NL (1) NL2031383B1 (enExample)
TW (1) TW202406424A (enExample)
WO (1) WO2023182885A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT527921B1 (de) * 2024-04-25 2025-08-15 Smt Maschinen Und Vertriebs Gmbh & Co Kg Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4770379B2 (ja) * 2005-10-13 2011-09-14 富士電機株式会社 金属部材の接合方法およびその組立治具
US7851334B2 (en) * 2007-07-20 2010-12-14 Infineon Technologies Ag Apparatus and method for producing semiconductor modules
DE102014103013B4 (de) * 2014-03-06 2017-09-21 Infineon Technologies Ag Verfahren zum Erzeugen einer getrockneten Pastenschicht, Verfahren zum Erzeugen einer Sinterverbindung und Durchlaufanlage zur Durchführung der Verfahren
DE102014114093B4 (de) * 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Verfahren zum Niedertemperatur-Drucksintern

Also Published As

Publication number Publication date
NL2031383B1 (en) 2023-10-06
KR20240163652A (ko) 2024-11-19
CN118922934A (zh) 2024-11-08
TW202406424A (zh) 2024-02-01
WO2023182885A1 (en) 2023-09-28
JP2025510631A (ja) 2025-04-15
MX2024011555A (es) 2024-12-06
US20250239565A1 (en) 2025-07-24
EP4497157A1 (en) 2025-01-29

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