NL186206C - Werkwijze voor het assembleren van een halfgeleiderinrichting en het beschermingshuis ervan. - Google Patents

Werkwijze voor het assembleren van een halfgeleiderinrichting en het beschermingshuis ervan.

Info

Publication number
NL186206C
NL186206C NLAANVRAGE8202010,A NL8202010A NL186206C NL 186206 C NL186206 C NL 186206C NL 8202010 A NL8202010 A NL 8202010A NL 186206 C NL186206 C NL 186206C
Authority
NL
Netherlands
Prior art keywords
assembling
semiconductor device
protective housing
protective
housing
Prior art date
Application number
NLAANVRAGE8202010,A
Other languages
English (en)
Other versions
NL186206B (nl
NL8202010A (nl
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of NL8202010A publication Critical patent/NL8202010A/nl
Publication of NL186206B publication Critical patent/NL186206B/nl
Application granted granted Critical
Publication of NL186206C publication Critical patent/NL186206C/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
NLAANVRAGE8202010,A 1981-05-18 1982-05-14 Werkwijze voor het assembleren van een halfgeleiderinrichting en het beschermingshuis ervan. NL186206C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8109817A FR2506075A1 (fr) 1981-05-18 1981-05-18 Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection
FR8109817 1981-05-18

Publications (3)

Publication Number Publication Date
NL8202010A NL8202010A (nl) 1982-12-16
NL186206B NL186206B (nl) 1990-05-01
NL186206C true NL186206C (nl) 1990-10-01

Family

ID=9258561

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE8202010,A NL186206C (nl) 1981-05-18 1982-05-14 Werkwijze voor het assembleren van een halfgeleiderinrichting en het beschermingshuis ervan.

Country Status (7)

Country Link
JP (1) JPS57196549A (nl)
KR (1) KR900002119B1 (nl)
DE (1) DE3217345A1 (nl)
FR (1) FR2506075A1 (nl)
GB (1) GB2098801B (nl)
IT (1) IT1152406B (nl)
NL (1) NL186206C (nl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617647A (ja) * 1984-06-21 1986-01-14 Toshiba Corp 回路基板
JPS61218151A (ja) * 1985-03-23 1986-09-27 Hitachi Ltd 半導体装置
JP2712461B2 (ja) * 1988-12-27 1998-02-10 日本電気株式会社 半導体装置の容器
DE3931634A1 (de) * 1989-09-22 1991-04-04 Telefunken Electronic Gmbh Halbleiterbauelement
DE4201931C1 (nl) * 1992-01-24 1993-05-27 Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh + Co.Kg, 4788 Warstein, De

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
FR1468122A (fr) * 1965-02-17 1967-02-03 Motorola Inc Boîtier pour semi-conducteurs
US3515952A (en) * 1965-02-17 1970-06-02 Motorola Inc Mounting structure for high power transistors
DE1564815A1 (de) * 1966-08-27 1970-02-26 Standard Elek K Lorenz Ag Verfahren zum Einbau von Halbleiteranordnungen in miniaturisierte Schaltungen
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
JPS5116258B2 (nl) * 1971-10-30 1976-05-22
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
JPS5272170A (en) * 1975-12-12 1977-06-16 Nec Corp Package for semiconductor elements
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof

Also Published As

Publication number Publication date
FR2506075A1 (fr) 1982-11-19
KR900002119B1 (ko) 1990-04-02
DE3217345A1 (de) 1982-12-02
GB2098801B (en) 1985-01-03
DE3217345C2 (nl) 1987-07-02
NL186206B (nl) 1990-05-01
NL8202010A (nl) 1982-12-16
FR2506075B1 (nl) 1984-10-19
JPS57196549A (en) 1982-12-02
JPH0119269B2 (nl) 1989-04-11
GB2098801A (en) 1982-11-24
IT8221289A0 (it) 1982-05-14
KR840000076A (ko) 1984-01-30
IT1152406B (it) 1986-12-31

Similar Documents

Publication Publication Date Title
NL193037B (nl) Werkwijze en inrichting voor het bewerken van spraak.
NL192252B (nl) Inrichting voor het positioneren van gereedschappen.
NL191424C (nl) Werkwijze voor het vervaardigen van een geintegreerde schakeling.
NL187374C (nl) Inrichting voor het detecteren van straling.
NL190256C (nl) Werkwijze voor het vervaardigen van een fotogevoelige inrichting.
NL191217C (nl) Werkwijze en inrichting voor boorputonderzoek.
NL188792C (nl) Inrichting voor het verbinden van banen.
NL7804565A (nl) Werkwijze en inrichting voor het afdichten van een boorput.
DK336382A (da) Anordning til robotmanipulator
NL7703591A (nl) Werkwijze en inrichting voor het bekleden van onderdelen.
NL190559B (nl) Werkwijze voor het vormen van een beschermende diffusielaag op delen van legeringen.
NL187144C (nl) Inbouwapparaat met ingesneden bevestigingshuls en bevestigingshuls voor een dergelijk inbouwapparaat.
NL191587C (nl) Werkwijze voor het vervaardigen van een geïntegreerde-keten-inrichting.
NL187373B (nl) Werkwijze voor vervaardiging van een halfgeleiderinrichting.
NL190983C (nl) Inrichting voor het aanhechten van labelpennen.
NL190388C (nl) Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting.
BE892782A (fr) Werkwijze en inrichting voor het koelen en zuiveren van een heet gas
BE891429A (nl) Inrichting voor het orienteren van de wieken van een windmolen.
NL179265C (nl) Koppelinrichting voor een ondergedompeld hydraulisch werktuig en een bedieningsinrichting.
NL186206C (nl) Werkwijze voor het assembleren van een halfgeleiderinrichting en het beschermingshuis ervan.
NL7902584A (nl) Werkwijze en inrichting voor het koelen van een draad.
NL7810639A (nl) Inrichting voor het bevestigen en assembleren van naast elkaar gelegen elementen.
NL7901739A (nl) Inrichting voor het controleren van een cilinder-zui- geraggregaat.
NL7903826A (nl) Inrichting en werkwijze voor het vervaardigen van een bouwwerk.
NL184038B (nl) Inrichting voor het ondersteunen van een plant.

Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
A85 Still pending on 85-01-01
V1 Lapsed because of non-payment of the annual fee