FR2506075A1 - Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection - Google Patents
Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protectionInfo
- Publication number
- FR2506075A1 FR2506075A1 FR8109817A FR8109817A FR2506075A1 FR 2506075 A1 FR2506075 A1 FR 2506075A1 FR 8109817 A FR8109817 A FR 8109817A FR 8109817 A FR8109817 A FR 8109817A FR 2506075 A1 FR2506075 A1 FR 2506075A1
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- frame
- assembling
- protective housing
- slab
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 230000001681 protective effect Effects 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8109817A FR2506075A1 (fr) | 1981-05-18 | 1981-05-18 | Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection |
DE19823217345 DE3217345A1 (de) | 1981-05-18 | 1982-05-08 | Verfahren zum zusammenbauen einer halbleiteranordnung und des schutzgehaeuses derselben |
NLAANVRAGE8202010,A NL186206C (nl) | 1981-05-18 | 1982-05-14 | Werkwijze voor het assembleren van een halfgeleiderinrichting en het beschermingshuis ervan. |
GB8214182A GB2098801B (en) | 1981-05-18 | 1982-05-14 | Method of assembling a semiconductor package |
IT21289/82A IT1152406B (it) | 1981-05-18 | 1982-05-14 | Metodo di assemblaggio di un dispositivo semiconduttore e del proprio contenitore protettivo |
JP57080878A JPS57196549A (en) | 1981-05-18 | 1982-05-15 | Method of assembling semiconductor device |
KR8202125A KR900002119B1 (ko) | 1981-05-18 | 1982-05-15 | 반도체 장치 및 그 보호외피의 조립방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8109817A FR2506075A1 (fr) | 1981-05-18 | 1981-05-18 | Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2506075A1 true FR2506075A1 (fr) | 1982-11-19 |
FR2506075B1 FR2506075B1 (nl) | 1984-10-19 |
Family
ID=9258561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8109817A Granted FR2506075A1 (fr) | 1981-05-18 | 1981-05-18 | Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS57196549A (nl) |
KR (1) | KR900002119B1 (nl) |
DE (1) | DE3217345A1 (nl) |
FR (1) | FR2506075A1 (nl) |
GB (1) | GB2098801B (nl) |
IT (1) | IT1152406B (nl) |
NL (1) | NL186206C (nl) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS617647A (ja) * | 1984-06-21 | 1986-01-14 | Toshiba Corp | 回路基板 |
JPS61218151A (ja) * | 1985-03-23 | 1986-09-27 | Hitachi Ltd | 半導体装置 |
JP2712461B2 (ja) * | 1988-12-27 | 1998-02-10 | 日本電気株式会社 | 半導体装置の容器 |
DE3931634A1 (de) * | 1989-09-22 | 1991-04-04 | Telefunken Electronic Gmbh | Halbleiterbauelement |
DE4201931C1 (nl) * | 1992-01-24 | 1993-05-27 | Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh + Co.Kg, 4788 Warstein, De |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1468122A (fr) * | 1965-02-17 | 1967-02-03 | Motorola Inc | Boîtier pour semi-conducteurs |
DE1564308A1 (de) * | 1965-02-17 | 1969-09-25 | Motorola Inc | Transistorhalterung |
US3641398A (en) * | 1970-09-23 | 1972-02-08 | Rca Corp | High-frequency semiconductor device |
US4067040A (en) * | 1975-12-12 | 1978-01-03 | Nippon Electric Company, Ltd. | Semiconductor device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3340602A (en) * | 1965-02-01 | 1967-09-12 | Philco Ford Corp | Process for sealing |
DE1564815A1 (de) * | 1966-08-27 | 1970-02-26 | Standard Elek K Lorenz Ag | Verfahren zum Einbau von Halbleiteranordnungen in miniaturisierte Schaltungen |
JPS5116258B2 (nl) * | 1971-10-30 | 1976-05-22 | ||
US3784884A (en) * | 1972-11-03 | 1974-01-08 | Motorola Inc | Low parasitic microwave package |
JPS5623759A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Resin-sealed semiconductor device and manufacture thereof |
-
1981
- 1981-05-18 FR FR8109817A patent/FR2506075A1/fr active Granted
-
1982
- 1982-05-08 DE DE19823217345 patent/DE3217345A1/de active Granted
- 1982-05-14 IT IT21289/82A patent/IT1152406B/it active
- 1982-05-14 GB GB8214182A patent/GB2098801B/en not_active Expired
- 1982-05-14 NL NLAANVRAGE8202010,A patent/NL186206C/nl not_active IP Right Cessation
- 1982-05-15 KR KR8202125A patent/KR900002119B1/ko active
- 1982-05-15 JP JP57080878A patent/JPS57196549A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1468122A (fr) * | 1965-02-17 | 1967-02-03 | Motorola Inc | Boîtier pour semi-conducteurs |
DE1564308A1 (de) * | 1965-02-17 | 1969-09-25 | Motorola Inc | Transistorhalterung |
US3641398A (en) * | 1970-09-23 | 1972-02-08 | Rca Corp | High-frequency semiconductor device |
US4067040A (en) * | 1975-12-12 | 1978-01-03 | Nippon Electric Company, Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
DE3217345C2 (nl) | 1987-07-02 |
JPH0119269B2 (nl) | 1989-04-11 |
KR840000076A (ko) | 1984-01-30 |
IT1152406B (it) | 1986-12-31 |
GB2098801A (en) | 1982-11-24 |
NL186206C (nl) | 1990-10-01 |
FR2506075B1 (nl) | 1984-10-19 |
JPS57196549A (en) | 1982-12-02 |
NL186206B (nl) | 1990-05-01 |
GB2098801B (en) | 1985-01-03 |
KR900002119B1 (ko) | 1990-04-02 |
IT8221289A0 (it) | 1982-05-14 |
NL8202010A (nl) | 1982-12-16 |
DE3217345A1 (de) | 1982-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CA | Change of address | ||
CD | Change of name or company name | ||
ST | Notification of lapse |